Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The thermally conductive silicone gel composition includes (I) a liquid composition that includes components (A), (C), (D), (E), and (F), but does not include component (B) and (II) a liquid composition that includes components (B), (D), (E), and (F), but does not include component (C) which are individually stored.

Methods of forming a composite material film can include providing a mixture comprising a precursor and silane-treated silicon particles. The methods can also include pyrolysing the mixture to convert the precursor into one or more carbon phases to form the composite material film with the silicon particles distributed throughout the composite material film.

Methods of forming a composite material film can include providing a mixture comprising a precursor and silane-treated silicon particles. The methods can also include pyrolysing the mixture to convert the precursor into one or more carbon phases to form the composite material film with the silicon particles distributed throughout the composite material film.

The present invention relates to an improved emulsified composition comprising a) —one or more amino functional siloxanes of the formula I b) —one or more hydrolysable alkyl silans of the formula II c) an acid d) water e) a defoamer f) a coalescent agent and optionally one or more of a preservative, co-emulsifier, catalyst, rheology modifier, fatty acid, oil and/or wax,
the process of preparing it and the application method of enhancing the water repellence of an inorganic, organic or fiber based materials and/or enhancing the said materials ability to repel water soluble dirt, as well as an apparatus for use in said method.

The present invention relates to an improved emulsified composition comprising a) —one or more amino functional siloxanes of the formula I b) —one or more hydrolysable alkyl silans of the formula II c) an acid d) water e) a defoamer f) a coalescent agent and optionally one or more of a preservative, co-emulsifier, catalyst, rheology modifier, fatty acid, oil and/or wax,
the process of preparing it and the application method of enhancing the water repellence of an inorganic, organic or fiber based materials and/or enhancing the said materials ability to repel water soluble dirt, as well as an apparatus for use in said method.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.

The present disclosure relates to self-healing siloxane elastomers. In particular, the present disclosure relates to self-healing siloxane elastomers comprising at least one siloxane polymer reversibly crosslinked to a second siloxane oligomer or polymer, the reversible cross-linked may be formed at ambient temperature.

The present disclosure relates to self-healing siloxane elastomers. In particular, the present disclosure relates to self-healing siloxane elastomers comprising at least one siloxane polymer reversibly crosslinked to a second siloxane oligomer or polymer, the reversible cross-linked may be formed at ambient temperature.