This disclosure relates to a composition for the protection of an article against corrosion, wherein the composition comprises a blend comprising about 50 to about 99 wt. % of an amorphous polymer and about 1 to about 50 wt. % of a hydrocarbon wax, based on the total weight of the blend, the composition containing at least 30 wt. % of said blend, based on the total weight of the composition, wherein the amorphous polymer has a glass transition temperature T.sub.g of lower than about −20° C.; and the hydrocarbon wax has a melting point of about 35° to about 130° C. This disclosure also relates to a wrapping tape comprising a backing layer and a layer comprising the composition.

A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y<162, A: the acid value excluding the organometallic compound M: the weight average molecular weight of the organometallic compound Y: the weight ratio of the organometallic compound with respect to 100 parts by weight of resin components ##STR00001## wherein the thermoplastic resin contains a hydride of a styrene-based A-B-A type triblock, wherein R1 to R4 represent organic groups including an alkyl group, aryl group, alkoxy group, cycloalkyl group and acyl group, each having a carbon number of 1 or more and 8 or less, M represents a metal atom having 3 valency.

A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y<162, A: the acid value excluding the organometallic compound M: the weight average molecular weight of the organometallic compound Y: the weight ratio of the organometallic compound with respect to 100 parts by weight of resin components ##STR00001## wherein the thermoplastic resin contains a hydride of a styrene-based A-B-A type triblock, wherein R1 to R4 represent organic groups including an alkyl group, aryl group, alkoxy group, cycloalkyl group and acyl group, each having a carbon number of 1 or more and 8 or less, M represents a metal atom having 3 valency.

The present disclosure relates to an encapsulation composition, an encapsulation film comprising the same, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, which provides an encapsulation composition capable of effectively blocking moisture or oxygen introduced into an organic electronic device from the outside and realizing an organic electronic device with an extremely small bezel part structure.

The present disclosure relates to an encapsulation composition, an encapsulation film comprising the same, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, which provides an encapsulation composition capable of effectively blocking moisture or oxygen introduced into an organic electronic device from the outside and realizing an organic electronic device with an extremely small bezel part structure.

The present disclosure provides a latent heat storage material that has a low risk of leakage and a low moisture absorbency that is highly workable. The latent heat storage material includes a heat storage material and a surface layer containing a cured product of a reaction curable liquid resin. The heat storage material contains an inorganic latent heat storage material composition containing an inorganic latent heat agent and a thickener. The surface layer has a specific type E hardness value, a specific 100% modulus, and a specific elongation percentage at break.

The present disclosure provides a latent heat storage material that has a low risk of leakage and a low moisture absorbency that is highly workable. The latent heat storage material includes a heat storage material and a surface layer containing a cured product of a reaction curable liquid resin. The heat storage material contains an inorganic latent heat storage material composition containing an inorganic latent heat agent and a thickener. The surface layer has a specific type E hardness value, a specific 100% modulus, and a specific elongation percentage at break.

A resin composition for sealing an organic electronic device element, containing a polyisobutylene resin (A), a hydrogenated cyclic olefin resin (B), and a polymer (C) obtained by any one of radical polymerization, anionic polymerization or coordination polymerization and exhibiting rubber elasticity, a resin sheet using the same, organic electroluminescent element, and image display apparatus.

A resin composition for sealing an organic electronic device element, containing a polyisobutylene resin (A), a hydrogenated cyclic olefin resin (B), and a polymer (C) obtained by any one of radical polymerization, anionic polymerization or coordination polymerization and exhibiting rubber elasticity, a resin sheet using the same, organic electroluminescent element, and image display apparatus.

Methods and compositions for suppressing fugitive dust are provided herein. To suppress fugitive dust, particulate materials, dust and or substrates can be treated with a mixture having a hydrophobizing agent and an oil. The hydrophobizing agent can be an organo- or halosilane, a tallow alkylamine, an amine-functionalized polysiloxane, or an amine-functionalized hydrophobic polymer.