ENCAPSULATION COMPOSITION

Abstract

The present disclosure relates to an encapsulation composition, an encapsulation film comprising the same, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, which provides an encapsulation composition capable of effectively blocking moisture or oxygen introduced into an organic electronic device from the outside and realizing an organic electronic device with an extremely small bezel part structure.

Claims

1. An encapsulation composition comprising: an encapsulation resin comprising an olefinic resin, and a moisture adsorbent surface-treated with an aliphatic hydrocarbon compound.

2. The encapsulation composition according to claim 1, wherein the encapsulation resin is a polymer derived from butylene.

3. The encapsulation composition according to claim 2, wherein the encapsulation resin is a homopolymer of a butylene monomer; a copolymer obtained by copolymerizing a butylene monomer with other monomers polymerizable with the butylene monomer; a reactive oligomer using the butylene monomer; or a mixture thereof.

4. The encapsulation composition according to claim 1, wherein the aliphatic hydrocarbon compound comprises at least one or more polar functional groups.

5. The encapsulation composition according to claim 1, wherein the aliphatic hydrocarbon compound has a carbon number in a range of 5 to 50.

6. The encapsulation composition according to claim 1, wherein the moisture adsorbent has a particle diameter of 8 μm or less in a particle size analysis according to D90.

7. The encapsulation composition according to claim 1, wherein the moisture adsorbent is comprised in a range of 150 to 1500 parts by weight relative to 100 parts by weight of the encapsulation resin.

8. The encapsulation composition according to claim 1, further comprising a tackifier having a softening point of 145° C. or less.

9. The encapsulation composition according to claim 8, wherein the tackifier has a weight average molecular weight in a range of 300 to 5000 g/mol.

10. The encapsulation composition according to claim 8, wherein the tackifier is a polymer polymerized from a monomer having a carbon number in a range of 3 to 15 in the molecular structure.

11. The encapsulation composition according to claim 8, wherein the tackifier is comprised in a range of 140 to 450 parts by weight relative to 100 parts by weight of the encapsulation resin.

12. The encapsulation composition according to claim 1, further comprising an active energy ray polymerizable compound.

13. The encapsulation composition according to claim 12, wherein the active energy ray polymerizable compound is included in a range of 2 to 35 parts by weight relative to 100 parts by weight of the encapsulation resin.

14. The encapsulation composition according to claim 1, further comprising a radical initiator.

15. An encapsulation film comprising an encapsulation layer comprising the encapsulation composition of claim 1, wherein the encapsulation layer is a single layer or a multilayer structure of two or more layers.

16. The encapsulation film according to claim 15, wherein the encapsulation layer is a multilayer structure of two or more layers, and the encapsulation layer comprises a first layer including a moisture adsorbent, and a second layer including no moisture adsorbent or including the moisture adsorbent in an amount lower than that of the first layer.

17. The encapsulation film according to claim 16, wherein a ratio of the first layer thickness to the second layer thickness is in a range of 1.2 to 8.

18. The encapsulation film according to claim 15, further comprising a metal layer formed on the encapsulation layer.

19. An organic electronic device comprising: a substrate; an organic electronic element formed on the substrate; and the encapsulation film of claim 15 which encapsulates the entire surface of the organic electronic element.

20. A method for manufacturing an organic electronic device, comprising: a step of applying the encapsulation film of claim 15 to a substrate, on which an organic electronic element is formed, so as to cover the organic electronic element.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0065] FIGS. 1 and 2 are cross-sectional diagrams showing an encapsulation film according to one example of the present application.

[0066] FIG. 3 is a cross-sectional diagram showing an organic electronic device according to one example of the present application.

EXPLANATION OF REFERENCE NUMERALS

[0067] 10: encapsulation film [0068] 1: release film or base film [0069] 11: encapsulation layer [0070] 12: metal layer [0071] 13: protective layer [0072] 21: substrate [0073] 22: organic electronic element

BEST MODE

[0074] Hereinafter, the present invention will be described in more detail through examples according to the present invention and comparative examples not according to the present invention, but the scope of the present invention is not limited by the following examples.

Example 1

[0075] (1) Preparation of Encapsulation Layer First Layer Solution

[0076] As a moisture adsorbent, CaO (Aldrich) surface-treated with stearic acid on the surface was mixed with toluene as a solvent to prepare a moisture adsorbent solution at a concentration of 50 wt % of the solid content.

[0077] Apart from the above, 100 parts by weight of a polyisobutylene resin (B50 from BASF, weight average molecular weight 340,000 g/mol) as an encapsulation resin and 340 parts by weight of H2100 (softening point 102° C.) from HIKOREZ as a tackifier were introduced into a reactor at room temperature. Then, 5 parts by weight of 1,6-hexanediol diacrylate as an active energy ray polymerizable compound and 1 part by weight of a photo-radical initiator (Irgacure 819) were introduced thereto, and the mixture was diluted with toluene so that the solid content was 40 wt % or so. The moisture adsorbent solution prepared in advance was mixed so that the moisture adsorbent was in an amount of 570 parts by weight relative to 100 parts by weight of the encapsulation resin, and homogenized.

[0078] (2) Preparation of Encapsulation Layer Second Layer Solution

[0079] At room temperature, 100 parts by weight of a polyisobutylene resin (B50 from BASF, weight average molecular weight 340,000 g/mol) as an encapsulation resin and 150 parts by weight of H2100 (softening point 102° C.) from HIKOREZ as a tackifier were introduced into a reactor. Then, 5 parts by weight of 1,6-hexanediol diacrylate as an active energy ray polymerizable compound and 1 part by weight of a photo-radical initiator (Irgacure 819) were introduced thereto, and the mixture was diluted with toluene so that the solid content was 40 wt % or so.

[0080] (3) Production of Encapsulation Film

[0081] The solution of the first layer prepared above was applied to a release surface of a release PET and dried at 110° C. for 10 minutes to form a layer with a thickness of 40 μm.

[0082] The solution of the second layer prepared above was applied to a release surface of a release PET and dried at 130° C. for 3 minutes to form a layer with a thickness of 10 μm.

[0083] The two layers were laminated to produce an encapsulation film having a two-layered encapsulation layer.

[0084] (4) Production of Encapsulation Film in which Metal Layer is Integrated

[0085] The release-treated PET was peeled off on the first layer surface of the two-layered encapsulation layer produced above, and the encapsulation layer was laminated so that the metal layer (aluminum) prepared in advance contacted the first layer.

[0086] The laminated metal integral encapsulation film was knife-cut to produce an encapsulation film in a desired shape.

Example 2

[0087] An encapsulation film was produced in the same method as in Example 1, except that the first layer solution was prepared as follows.

[0088] (1) Preparation of Encapsulation Layer First Layer Solution

[0089] As a moisture adsorbent, CaO (Aldrich) surface-treated with stearic acid on the surface was mixed with toluene as a solvent to prepare a moisture adsorbent solution at a concentration of 50 wt % of the solid content.

[0090] Apart from the above, 100 parts by weight of a butyl rubber (BR065 from EXXON) as an encapsulation resin and 150 parts by weight of SU120 (softening point 120° C.) from SUKOREZ as a tackifier were introduced into a reactor at room temperature. Then, 5 parts by weight of 1,6-hexanediol diacrylate as an active energy ray polymerizable compound and 1 part by weight of a photo-radical initiator (Irgacure 819) were introduced thereto, and the mixture was diluted with toluene so that the solid content was 45 wt % or so. The moisture adsorbent solution prepared in advance was mixed so that the moisture adsorbent was in an amount of 300 parts by weight relative to 100 parts by weight of the encapsulation resin, and homogenized.

Example 3

[0091] An encapsulation film was produced in the same method as in Example 1, except that the first layer solution was prepared as follows.

[0092] (1) Preparation of Encapsulation Layer First Layer Solution

[0093] As a moisture adsorbent, CaO (Aldrich) surface-treated with stearic acid on the surface was mixed with toluene as a solvent to prepare a moisture adsorbent solution at a concentration of 50 wt % of the solid content.

[0094] Apart from the above, 100 parts by weight of a polyisobutylene resin (B50 from BASF, weight average molecular weight 340,000 g/mol) as an encapsulation resin and 400 parts by weight of H2100 (softening point 102° C.) from HIKOREZ as a tackifier were introduced into a reactor at room temperature. Then, 5 parts by weight of 1,6-hexanediol diacrylate as an active energy ray polymerizable compound and 1 part by weight of a photo-radical initiator (Irgacure 819) were introduced thereto, and the mixture was diluted with toluene so that the solid content was 48 wt % or so. The moisture adsorbent solution prepared in advance was mixed so that the moisture adsorbent was in an amount of 1000 parts by weight relative to 100 parts by weight of the encapsulation resin, and homogenized.

Example 4

[0095] An encapsulation film was produced in the same method as in Example 1, except that the first layer solution was prepared as follows.

[0096] (1) Preparation of Encapsulation Layer First Layer Solution

[0097] As a moisture adsorbent, CaO (Aldrich) surface-treated with stearic acid on the surface was mixed with toluene as a solvent to prepare a moisture adsorbent solution at a concentration of 50 wt % of the solid content.

[0098] Apart from the above, 100 parts by weight of a butyl rubber (BR065 from EXXON) as an encapsulation resin and 148 parts by weight of SU120 (softening point 120° C.) from SUKOREZ as a tackifier were introduced into a reactor at room temperature. Then, 5 parts by weight of 1,6-hexanediol diacrylate as an active energy ray polymerizable compound and 1 part by weight of a photo-radical initiator (Irgacure 819) were introduced thereto, and the mixture was diluted with toluene so that the solid content was 45 wt % or so. The moisture adsorbent solution prepared in advance was mixed so that the moisture adsorbent was in an amount of 300 parts by weight relative to 100 parts by weight of the encapsulation resin, and homogenized.

Example 5

[0099] An encapsulation film was produced in the same method as in Example 1, except that the first layer solution was prepared as follows.

[0100] (1) Preparation of Encapsulation Layer First Layer Solution

[0101] As a moisture adsorbent, CaO (Aldrich) surface-treated with stearic acid on the surface was mixed with toluene as a solvent to prepare a moisture adsorbent solution at a concentration of 50 wt % of the solid content.

[0102] Apart from the above, 100 parts by weight of a polyisobutylene resin (B50 from BASF, weight average molecular weight 340,000 g/mol) as an encapsulation resin and 420 parts by weight of H2100 (softening point 102° C.) from HIKOREZ as a tackifier were introduced into a reactor at room temperature. Then, 5 parts by weight of 1,6-hexanediol diacrylate as an active energy ray polymerizable compound and 1 part by weight of a photo-radical initiator (Irgacure 819) were introduced thereto, and the mixture was diluted with toluene so that the solid content was 48 wt % or so. The moisture adsorbent solution prepared in advance was mixed so that the moisture adsorbent was in an amount of 1000 parts by weight relative to 100 parts by weight of the encapsulation resin, and homogenized.

Example 6

[0103] An encapsulation film was produced in the same method as in Example 1, except that the first layer solution was prepared as follows.

[0104] (1) Preparation of Encapsulation Layer First Layer Solution

[0105] As a moisture adsorbent, CaO (Aldrich) surface-treated with stearic acid on the surface was mixed with toluene as a solvent to prepare a moisture adsorbent solution at a concentration of 50 wt % of the solid content.

[0106] Apart from the above, 100 parts by weight of a polyisobutylene resin (B50 from BASF, weight average molecular weight 340,000 g/mol) as an encapsulation resin and 340 parts by weight of H2140 (softening point 140° C.) from HIKOREZ as a tackifier were introduced into a reactor at room temperature. Then, 5 parts by weight of 1,6-hexanediol diacrylate as an active energy ray polymerizable compound and 1 part by weight of a photo-radical initiator (Irgacure 819) were introduced thereto, and the mixture was diluted with toluene so that the solid content was 40 wt % or so. The moisture adsorbent solution prepared in advance was mixed so that the moisture adsorbent was in an amount of 570 parts by weight relative to 100 parts by weight of the encapsulation resin, and homogenized.

Comparative Example 1

[0107] An encapsulation film was produced in the same method as in Example 1, except that the first layer solution was prepared as follows.

[0108] (1) Preparation of Encapsulation Layer First Layer Solution

[0109] As a moisture adsorbent, CaO (Aldrich) was mixed with toluene as a solvent to prepare a moisture adsorbent solution at a concentration of 50 wt % of the solid content.

[0110] Apart from the above, 100 parts by weight of a polyisobutylene resin (B50 from BASF, weight average molecular weight 340,000 g/mol) as an encapsulation resin and 380 parts by weight of H2100 (softening point 102° C.) from HIKOREZ as a tackifier were introduced into a reactor at room temperature. Then, 5 parts by weight of 1,6-hexanediol diacrylate as an active energy ray polymerizable compound and 1 part by weight of a photo-radical initiator (Irgacure 819) were introduced thereto, and the mixture was diluted with toluene so that the solid content was 40 wt % or so. The moisture adsorbent solution prepared in advance was mixed so that the moisture adsorbent was in an amount of 570 parts by weight relative to 100 parts by weight of the encapsulation resin, and homogenized.

Comparative Example 2

[0111] An encapsulation film was produced in the same method as in Example 1, except that the surface was treated with an epoxy-based silane coupling agent ((3-glycidyloxypropyl)trimethoxysilane) instead of stearic acid as the moisture adsorbent.

Experimental Example 1-Coating Appearance

[0112] The coating appearance of the encapsulation films produced in Examples and Comparative Examples was visually observed, which was classified as X when agglomeration of moisture adsorbent particles occurred, and classified as 0 when the appearance was excellent without agglomeration.

Experimental Example 2-Bonding Property

[0113] The encapsulation films produced in Examples and Comparative Examples were each laminated on a glass substrate on which an organic electronic element was formed, so that the encapsulation layer covered the element, and pressurized, heated and pressed under conditions of 40° C. and 5 atm using an autoclave to prepare a specimen. Then, the encapsulation film was re-peeled off and the appearance was observed. It was classified as 0 in the case of being bonded together with no bubbles at all, A when 3 or less bubbles occurred, and X when more than 3 bubbles occurred.

Experimental Example 3-Cutting Property

[0114] When the knife press cutting was performed about each of the encapsulation films produced in Examples and Comparative Examples, the shape of the end (edge part) of the film was observed. In the case of the knife press cutting, when the encapsulation film is brittle, the end is often not cut into the desired shape by stress upon cutting. It was classified as X when a part of the encapsulation layer of the end of the encapsulation film fell off to be lost and the shape was not maintained in a rectangular form, A when the shape of the end (edge part, vertex part) was maintained, but a part of the encapsulation layer fell off to be lost, and O when the shape was maintained without loss of the encapsulation layer and the end was cut well.

Experimental Example 4-Moisture Barrier Property

[0115] Calcium was deposited in a size of 5 mm×5 mm and a thickness of 100 nm on a glass substrate having a size of 100 mm×100 mm, and the encapsulation films of Examples and Comparative Examples were each attached to cover the entire surface of the calcium. The obtained specimens are observed in a constant temperature and humidity chamber at 85° C. and 85% relative humidity, thereby observing the time when calcium began to become transparent by an oxidation reaction due to moisture permeation. It was represented by O when the transparent start time was 700 hours or more, A when the transparent start time was less than 700 hours and 500 hours or more, and X when the transparent start time was less than 500 hours.

TABLE-US-00001 TABLE 1 Moisture Coating Bonding Cutting Barrier Appearance Property Property Property Example 1 ◯ ◯ ◯ ◯ 2 ◯ ◯ ◯ ◯ 3 ◯ ◯ ◯ ◯ 4 ◯ ◯ ◯ Δ 5 ◯ ◯ Δ ◯ 6 ◯ Δ ◯ Δ Comparative 1 X Δ ◯ X Example 2 X X ◯ X