Provided are an electronic component manufacturing method by which even a platable layer made of a difficult-to-plate material can be easily plated with good adhesion without using a special chemical solution or a photolithography technique, and an electronic component which has a peel strength of 0.1 N/mm or greater as measured by a copper foil peel test. A picosecond laser beam having a pulse duration on the order of a picosecond or a femtosecond laser beam having a pulse duration on the order of a femtosecond is emitted at a surface of a platable layer (2) in order to roughen the surface, a wiring pattern is formed using a mask (13), and a plated part (12) is formed on the surface of the wiring pattern.

An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer.

An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer.

A self-cleaning transparent conductive surface includes a hydrophobic film and a metal nano-web coupled to the hydrophobic film. The metal nano-web imparts conductive properties to the surface of the film and texturing formed by either the hydrophobic film, substrate or metal nano-web create a super-hydrophobic surface. This super-hydrophobic and conductive surface may be created by etching and layering a metal nano-web over the surface of a hydrophobic film or a rigid substrate, the metal grid may the hydrophobic film or substrate may also be etched in a moth's eye pattern. Both the hydrophobic film or substrate and metal nano-web may be coated in a layer of hydrophobic material to further increase the hydrophobic effect.

A self-cleaning transparent conductive surface includes a hydrophobic film and a metal nano-web coupled to the hydrophobic film. The metal nano-web imparts conductive properties to the surface of the film and texturing formed by either the hydrophobic film, substrate or metal nano-web create a super-hydrophobic surface. This super-hydrophobic and conductive surface may be created by etching and layering a metal nano-web over the surface of a hydrophobic film or a rigid substrate, the metal grid may the hydrophobic film or substrate may also be etched in a moth's eye pattern. Both the hydrophobic film or substrate and metal nano-web may be coated in a layer of hydrophobic material to further increase the hydrophobic effect.

A plating method includes a first mask forming step of ejecting a UV-curable ink in the form of ink droplets from an inkjet head so as to have the ejected ink droplets land on a plating target object and to form a first plating mask on the plating target object, a catalyst applying step of applying a catalyst for deposition of plating material to the plating target object on which the first plating mask is formed, a second mask forming step of having the ink droplets land on the first plating mask so as to form a second plating mask on the first plating mask, a plating step of performing electroless plating to the plating target object subsequent to the second mask forming step, and a mask removing step of removing the first plating mask and the second plating mask from the plating target object subsequent to the plating step.

A plating method includes a first mask forming step of ejecting a UV-curable ink in the form of ink droplets from an inkjet head so as to have the ejected ink droplets land on a plating target object and to form a first plating mask on the plating target object, a catalyst applying step of applying a catalyst for deposition of plating material to the plating target object on which the first plating mask is formed, a second mask forming step of having the ink droplets land on the first plating mask so as to form a second plating mask on the first plating mask, a plating step of performing electroless plating to the plating target object subsequent to the second mask forming step, and a mask removing step of removing the first plating mask and the second plating mask from the plating target object subsequent to the plating step.

The present invention pertains to a multilayer tubular article, to processes for the manufacture of said multilayer tubular article and to uses of said multilayer tubular article in upstream applications for conveying hydrocarbons from a well to a floating off-shore unit via a bottom platform.

The present invention pertains to a multilayer tubular article, to processes for the manufacture of said multilayer tubular article and to uses of said multilayer tubular article in upstream applications for conveying hydrocarbons from a well to a floating off-shore unit via a bottom platform.

The present invention pertains to a process for packaging one or more products, said process comprising the following steps: (i) providing a package having an opening, said package comprising at least one sheet, said sheet comprising the following layers: a layer [layer (L1)] consisting of a composition [composition (C1)] comprising, preferably consisting of, at least one thermoplastic polymer [polymer (T1)], said layer (L1) having two opposite surfaces, wherein one surface comprises one or more grafted functional groups [surface (L1-S1-f)], directly adhered to the surface (L1-S1-f), a layer [layer (L2)] consisting of at least one metal compound [compound (M1)], and optionally, directly adhered to the layer (L2), a layer (L3) consisting of a composition [composition (C3)] comprising, preferably consisting of at least one thermoplastic polymer [polymer (T2)], said polymer (T2) being equal to or different from the polymer (T1); (ii) feeding the package provided in step (i) with one or more products; and (iii) sealing the package provided in step (ii). The present invention also pertains to said package, to a process for the manufacture of said package and to uses of said package in various applications.