C04B35/47

Variable Capacitor for RF Power Applications

A radio-frequency (RF) power variable capacitor capable of operating at, at least, 50 watts in the MHz range. The capacitor has a composite HDK-NDK ceramic dielectric. The HDK (high dielectric constant) component comprises an active matrix of barium strontium titanate, for example. Acoustic resonances are reduced or eliminated by the addition of a metal or metalloid oxide such as magnesium borate (NDK—low dielectric constant), which acts as an acoustic resonance reduction agent (ARRA) in the RF power domain. The acoustic resonances which previously occurred under bias voltage 500 V or 1100 V in prior art RF power variable capacitors are eliminated by the addition of the ARRA.

Dielectric material, method of manufacturing thereof, and dielectric devices and electronic devices including the same

A dielectric material, a method of manufacturing thereof, and a dielectric device and an electronic device including the same. A dielectric material includes a layered metal oxide including a first layer having a positive charge and a second layer having a negative charge which are laminated, a monolayer nanosheet exfoliated from the layered metal oxide, a nanosheet laminate of the monolayer nanosheets, or a combination thereof, wherein the dielectric material includes a two-dimensional layered material having a two-dimensional crystal structure and the two-dimensional layered material is represented by Chemical Formula 1.

Dielectric material, method of manufacturing thereof, and dielectric devices and electronic devices including the same

A dielectric material, a method of manufacturing thereof, and a dielectric device and an electronic device including the same. A dielectric material includes a layered metal oxide including a first layer having a positive charge and a second layer having a negative charge which are laminated, a monolayer nanosheet exfoliated from the layered metal oxide, a nanosheet laminate of the monolayer nanosheets, or a combination thereof, wherein the dielectric material includes a two-dimensional layered material having a two-dimensional crystal structure and the two-dimensional layered material is represented by Chemical Formula 1.

Sandwich-structured dielectric materials for pulse energy storage as well as preparation method and application thereof

A sandwich-structured dielectric material for pulse energy storage is provided as well as a preparation method thereof. Employing a sandwich structure and combining the properties of ceramic-glass materials prepares a high performance dielectric material for pulse energy storage, in which the ceramic dielectric is core-shell structured powder of Ba.sub.xSr.sub.1-xTiO.sub.3 coated with SiO.sub.2, and the glass material is alkali-free glass AF45, of which the chemical composition is 63% SiO.sub.2-12% BaO-16% B.sub.2O.sub.3-9% Al.sub.2O.sub.3. AF45 alkali-free glass paste is spin-coated on both sides of the ceramic and calcined to get a layer-structured material of glass-ceramic-glass.

ELECTRONIC COMPONENT
20220013297 · 2022-01-13 ·

A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers provided on opposing end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected with the internal electrode layers, in which the dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and when a dimension in the lamination direction of the multilayer body is defined as T0, a dimension in the length direction of the multilayer body is defined as L0, and a dimension in a width direction orthogonal or substantially orthogonal to the lamination direction and the length direction is defined as W0, a relationship of L0<W0<T0 is satisfied.

CERAMIC COMPONENT AND METHOD FOR PRODUCING THE CERAMIC COMPONENT
20220005648 · 2022-01-06 ·

A ceramic component having a ceramic main part containing AxByC1−x−vTi1—y+wO3* (Mn2P2O7)z*Du, in which A is a first dopant selected from a group including neodymium, praseodymium, cerium, and lanthanum, B is a second dopant selected from a group including niobium, tantalum, and vanadium, C is selected from a group including calcium, strontium, and barium, and D includes a metal selected from a group including aluminum, nickel, and iron. x is the proportion of A, y is the proportion of B, v is the proportion of A vacancies, w is the proportion of excess titanium, z is the proportion of Mn2P2O7, u is the proportion of D, and the following applies: 0.0≤x≤0.1, 0.0≤y<0.1, 0≤v<1.5*x, 0≤w<0.05, 0.01≤z<0.1, 0≤u<0.05. A method for producing the ceramic component is also disclosed.

Process for making laminate substrate with sintered components

The present disclosure relates to a process to integrate sintered components in a laminate substrate. The disclosed process starts with providing a precursor substrate, which includes a substrate body having an opening through the substrate body, and a first foil layer. Herein, the first foil layer is formed underneath the substrate body, so as to fully cover a bottom of the opening. Next, a sinterable base material is applied into the opening and over the first foil layer, and then sintered at a first sintering temperature to create a sintered base component. A sinterable contact material is applied over the sintered base component, and then sintered at a second sintering temperature to create a sintered contact film. The sintered base component is confined within the opening by the substrate body on sides, by the first foil layer on bottom, and by the sintered contact film on top.

Process for making laminate substrate with sintered components

The present disclosure relates to a process to integrate sintered components in a laminate substrate. The disclosed process starts with providing a precursor substrate, which includes a substrate body having an opening through the substrate body, and a first foil layer. Herein, the first foil layer is formed underneath the substrate body, so as to fully cover a bottom of the opening. Next, a sinterable base material is applied into the opening and over the first foil layer, and then sintered at a first sintering temperature to create a sintered base component. A sinterable contact material is applied over the sintered base component, and then sintered at a second sintering temperature to create a sintered contact film. The sintered base component is confined within the opening by the substrate body on sides, by the first foil layer on bottom, and by the sintered contact film on top.

Multilayer ceramic capacitor

A multilayer ceramic capacitor include: a ceramic body including first and second surfaces opposing each other and third and fourth surfaces connecting the first and second surfaces; a plurality of internal electrodes disposed inside the ceramic body and exposed to the first and second surfaces, the plurality internal electrodes each having one end exposed to the third or fourth surface; and first and second side margin portions disposed on sides of the internal electrodes exposed to the first and second surfaces. A dielectric composition of the first and second side margin portions is different from a dielectric composition of the ceramic body, and a dielectric constant of the first and second side margin portions is lower than a dielectric constant of the ceramic body.

Processes for preparing porous ceramics for acoustic transducers

A process for preparing a porous ceramic body includes forming a green body with a mixture of ceramic material powder, binder material, and pore-forming particles. The process further includes extracting the binder material, decomposing the pore-forming particles, and removing residual organic materials from the green body at respective, progressively higher pre-firing temperatures. After these three stages, the green body is sintered at a still-higher temperature to form the porous ceramic body. Embodiments facilitate manufacturing and can render most or all surface grinding unnecessary, allowing electrode deposition directly onto substantially non-porous surfaces of the porous ceramic body that are naturally formed during sintering. Advantageously, the green body may be formed into net shape by injection molding the mixture that includes the pore-forming particles, and embodiments can result in porous ceramic bodies that are much thicker than currently available, with better structural integrity.