Patent classifications
C04B2237/346
CERAMIC COMPOSITION AND MULTILAYER CAPACITOR HAVING THE SAME
A ceramic composition includes a ceramic powder and a phosphor (P). The phosphor (P) has a content of 1 to 2 wt %, based on a total weight of the ceramic powder not including the phosphor (P).
PIEZOELECTRIC ELEMENT
A piezoelectric element includes a piezoelectric body having a main phase configured by lead zirconate titanate and a heterogenous phase configured by a different component to lead zirconate titanate, and a pair of electrodes provided on the piezoelectric body. The piezoelectric body has a surface region within 10 μm of a surface, and an inner region more than 10 μm from the surface. A surface area coverage of the heterogenous phase in a cross section of the surface region is at least 0.75% greater than a surface area coverage of the heterogenous phase in a cross section of the inner region.
High-K LTCC Dielectric Compositions And Devices
Electronic devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a barium-strontium-titanium-tungsten-silicon oxide.
Monolithic Ceramic Component and Production Method
A film stack made from compacted green films and capable of being sintered to form a ceramic component with monolithic multi-layer structure is disclosed. The film stack includes a functional layer comprising a green film comprising a functional ceramic and a tension layer comprising a green film comprising a dielectric material. The tension layer is directly adjacent to the functional layer in the multi-layer structure. The multilayer structure also includes a first metallization plane and second metallization plane. The functional layer is between the first metallization plane and the second metallization plane.
MANUFACTURING METHOD OF CERAMIC POWDER
A manufacturing method of ceramic powder includes mixing a barium carbonate having a specific surface are of 15 m.sup.2/g or more, a titanium dioxide having a specific surface area of 20 m.sup.2/g or more, a first compound of a donor element having a larger valence than Ti, and a second compound of an acceptor element having a smaller valence than Ti and having a larger ion radium than Ti and the donor element, and synthesizing barium titanate powder by calcining the barium carbonate, the titanium dioxide, the first compound and the second compound until a specific surface area of the barium titanate powder becomes 4 m.sup.2/g or more and 25 m.sup.2/g or less.
Honeycomb structure and method for producing honeycomb structure
A honeycomb structure including a plurality of porous honeycomb block bodies bound via joining material layers A. Each of the porous honeycomb block bodies includes a plurality of porous honeycomb segments bound via joining material layers B, each of the porous honeycomb segment includes: partition walls that defines a plurality of cells to form flow paths for a fluid, each of cells extending from an inflow end face that is an end face on a fluid inflow side to an outflow end face that is an end face on a fluid outflow side; and an outer peripheral wall located at the outermost periphery. At least a part of the joining material layers A has higher toughness than that of the joining material layers B.
THERMOPLASTIC POLYMER COMPOSITION AND MOLDED ARTICLE
The present invention is a thermoplastic polymer composition which contains 10-120 parts by mass of a polar group-containing polypropylene resin (B) per 100 parts by mass of a thermoplastic elastomer (A) that is a block copolymer having a polymer block containing an aromatic vinyl compound unit and a polymer block composed of a conjugated diene unit having 40% by mole or more of 1,2-bonds and 3,4-bonds in total, or a hydrogenated product of the block copolymer (provided that a thermoplastic polymer composition containing 1 part by mass or more of a polyvinyl acetal resin is excluded). This thermoplastic polymer composition is able to be bonded with a ceramic, a metal or a synthetic resin without requiring a primer treatment, and has excellent flexibility, mechanical characteristics, moldability, heat resistance and storage stability.
CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF CERAMIC ELECTRONIC DEVICE
A ceramic electronic device includes a plurality of dielectric layers of which a main component is a ceramic having a perovskite structure, and a plurality of internal electrode layers, each of which is stacked through each of the plurality of dielectric layers and includes a co-material which is inactive against the main component of the plurality of dielectric layers.
THREE-DIMENSIONAL SHAPED ARTICLE PRODUCTION METHOD
A three-dimensional shaped article production method for producing a three-dimensional shaped article by stacking layers to form a stacked body includes a constituent layer formation step of forming a constituent layer which corresponds to a constituent region of the three-dimensional shaped article, a support layer formation step of forming a support layer which is in contact with the constituent layer and supports the constituent layer, and a sintering step of sintering the constituent layer, wherein the support layer is configured such that as compared with the volume decrement accompanying the sintering step of a space surrounded by the constituent layer from at least two directions, the volume decrement accompanying the sintering step of the support layer which supports the constituent layer in the space is larger.
Multilayer ceramic electronic component and board having the same
A multilayer ceramic electronic component includes a ceramic body including a plurality of dielectric layers stacked on each other and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, parallel to a stacking direction and connected to the first and second surfaces, and fifth and sixth surfaces opposing each other in a third direction and connected to the first to fourth surfaces, first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, first and second conductive thin films disposed on at least one of the third and fourth surfaces, connected to the first and second external electrodes, respectively, and having a thickness lower than that of the first and second external electrodes, and first and second solder preventing films disposed on the first and second external electrodes, respectively.