A cyanate ester based adhesive comprising component A which has at least one cyanate ester with at least two OCN groups, and component B which comprises at least one catalyst for the trimerisation reaction of OCN groups to form a triazine ring. The catalyst is retained releasably on a carrier, particularly a pyrogenic silica.

The invention relates to the use of dicyanamide-containing ionic liquids which decrease the cure temperature of cyanate esters to form unique thermoset polymers having a triazine network. These thermoset polymers having the triazine network have an ionic character allowing for use in varied applications. The thermoset polymers described herein are useful in high temperature performance composites, and their high Tg makes them useful as a substitute for epoxies in the microelectronics industry. The thermoset polymers have good fracture toughness, excellent substrate adhesion, low shrinkage, and low moisture uptake.

A method of forming a three-dimensional object is carried out by: (a) providing a cyanate ester dual cure resin; (b) forming a three-dimensional intermediate from said resin, where said intermediate has the shape of, or a shape to be imparted to, said three-dimensional object, and where said resin is solidified by exposure to light; (c) optionally washing the three-dimensional intermediate, and then (d) heating and/or microwave irradiating said three-dimensional intermediate sufficiently to further cure said resin and form said three-dimensional object. Compositions useful for carrying out the method, and products made from the method, are also described.

A method of forming a three-dimensional object is carried out by: (a) providing a cyanate ester dual cure resin; (b) forming a three-dimensional intermediate from said resin, where said intermediate has the shape of, or a shape to be imparted to, said three-dimensional object, and where said resin is solidified by exposure to light; (c) optionally washing the three-dimensional intermediate, and then (d) heating and/or microwave irradiating said three-dimensional intermediate sufficiently to further cure said resin and form said three-dimensional object. Compositions useful for carrying out the method, and products made from the method, are also described.

A thermoset polymer product comprising 4,4-(((3-oxo-isoindoline-1,1-diyl)bis(4,1-arylene))bis(oxy))dibenzonitrile units of formula (2)

##STR00001##

wherein the units are derived from a 4,4-(((3-oxo-isoindoline-1,1-diyl)bis(4,1-arylene))bis(oxy))diphthalonitrile monomer of formula (1)

##STR00002##

wherein R is a C.sub.1-25 hydrocarbyl, preferably a C.sub.1-6 alkyl, a phenyl, or a phenyl substituted with up to five C.sub.1-6 alkyl groups, more preferably a C.sub.1-3 alkyl or a phenyl; each occurrence of R.sup.2 and R.sup.3 is independently a hydrogen, a halogen, or a C.sub.1-25 hydrocarbyl, preferably a hydrogen, a halogen, or a C.sub.1-6 alkyl, more preferably a hydrogen or a C.sub.1-3 alkyl; p and q are each independently 0 to 4, preferably 0 or 1, more preferably 0; and G is a residue of a cyano group, and is a C.sub.1-25 hydrocarbyl linking group having a valence of at least 2.

Provided is a highly versatile heat-curable resin composition for semiconductor encapsulation that exhibits a favorable water resistance and abradability when used to encapsulate a semiconductor device; and a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-sized wafer. The heat-curable resin composition for semiconductor encapsulation comprises: (A) a cyanate ester compound having not less than two cyanato groups in one molecule, and containing a particular cyanate ester compound that has a viscosity of not higher than 50 Pa.Math.s; (B) a phenol curing agent containing a resorcinol-type phenolic resin; (C) a curing accelerator; (D) an inorganic filler surface-treated with a silane coupling agent; and (E) an ester compound.

A resin composition comprising a polyphenylene ether (A) having a number average molecular weight of 500 to 5000; a cyclophosphazene compound (B); a non-halogen-based epoxy resin (C); a cyanate compound (D); and a filler (E).

A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A),

##STR00001##

(wherein X is a C.sub.1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent C.sub.1-16 hydrocarbon group, Z is a divalent C.sub.1-4 linking group, the divalent linking group being bonded to an O group in formula (1), and R.sup.1 is a hydrogen atom or a methyl group.)

Provided herein are conductive formulations wherein graphene has been added into the metal system, thereby reducing curing shrinkage and improving flexibility, without significantly affecting the EMI shielding performance thereof. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. In certain aspects of the present invention, there are also provided articles prepared using invention formulations and methods.

A reversible crosslinking reactant composition is provided. The composition includes at least one furan-group-containing oligomer having a structure represented by Formula (I) and a bismaleimide compound having a structure represented by

##STR00001##

Formula (II), wherein the equivalent ratio of the furan group of the furan-group-containing oligomer having a structure represented by Formula (I) to the maleimide group of the bismaleimide compound having a structure represented by Formula (II) is from 0.5:1 to 1:0.5.