Resins are provided including bisphenol M diphthalonitrile ether resin or bisphenol P diphthalonitrile either resin. Compositions are also provided, including a primary amine curative and the bisphenol M diphthalonitrile ether resin or the bisphenol P diphthalonitrile either resin. Further, polymerized products are provided of the bisphenol M diphthalonitrile ether resin or the bisphenol P diphthalonitrile either resin. In addition, a method of making a polymerized network is provided. A two component system is further provided, including a curative in one of the components and the bisphenol M diphthalonitrile ether resin or the bisphenol P diphthalonitrile either resin in the other component. In addition, a resin blend is provided, including a blend of at least two of bisphenol M diphthalonitrile ether resin, bisphenol P diphthalonitrile either resin, or bisphenol T diphthalonitrile ether resin.

A polymerizable thermoset composition including a polymerizable organic cyanate ester resin and a polymerizable aryl ethynyl-terminated polyimide, a polymerized thermoset, a process for the production of the polymerized thermoset as well as the use of the polymerizable thermoset composition for the production of lightweight construction components, preferably carbon fiber composite materials (CFC), and a lightweight construction component, preferably carbon fiber composite material (CFC), containing the polymerized thermoset are described.

The present invention relates to a thermosetting resin composition, which comprises: (A) cyanate ester compound and/or cyanate ester prepolymer; and (B) polyphosphonate ester and/or phosphonate-carbonate copolymer. The thermosetting resin composition provided by the present invention has low dielectric constant and dielectric loss tangent. The prepreg and copper clad laminate made from the above-mentioned thermosetting resin composition have excellent dielectric properties and wet-heat resistance, UL94 V-0 flame resistance, and good processability.

A curable composition for bonding windings or core laminates in an electrical machine is presented. The curable composition includes: (A) about 10 weight percent to about 25 weight percent of a polyfunctional cyanate ester; (B) about 35 weight percent to about 65 weight percent of a first difunctional cyanate ester, or a prepolymer thereof (C) about 15 weight percent to about 40 weight percent of a second difunctional cyanate ester, or a prepolymer thereof. An associated method is also presented.

The present invention is a cyanate ester compound represented by the following formula (1): ##STR00001## wherein Ar represents an aromatic ring; R.sub.1 each independently represents a hydrogen atom, an alkyl group, or an aryl group; n each independently represents an integer of 1 to 3; m+n is the same as the total number of hydrogen atoms in a monovalent aromatic group containing the aromatic ring and the hydrogen atoms; R.sub.2 represents a hydrogen atom (excluding a case where Ar represents a benzene ring; n each represents 1; R.sub.1 represents a hydrogen atom; m each represents 4, and a cyanate group is bonded to the benzene ring in the 4-position relative to an adamantyl group), or an alkyl group having 1 to 4 carbon atoms; and R.sub.3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.

A material for forming an underlayer film for lithography, including a cyanic acid ester compound obtained by cyanation of a modified xylene formaldehyde resin, a composition including the material, and a pattern forming method using the composition.

A polymer of intrinsic microporosity having a repeating subunit including a spirobisindane imide moiety as illustrated below. ##STR00001##

A composition for forming a resist underlayer film which make possible to form a desired high-adhesion resist pattern. A resist underlayer film-forming composition for lithography containing a polymer having the following structure Formula (1) or (2) at a terminal of a polymer chain, crosslinker, compound promoting crosslinking reaction, and organic solvent. ##STR00001##
(wherein R.sub.1 is a C.sub.1-6 alkyl group optionally having a substituent, phenyl group, pyridyl group, halogeno group, or hydroxy group, R.sub.2 is a hydrogen atom, a C.sub.1-6 alkyl group, hydroxy group, halogeno group, or ester group of C(O)OX wherein X is a C.sub.1-6 alkyl group optionally having a substituent, R.sub.3 is a hydrogen atom, a C.sub.1-6 alkyl group, hydroxy group, or halogeno group, R.sub.4 is a direct bond or divalent C.sub.1-8 organic group, R.sub.5 is a divalent C.sub.1-8 organic group, A is an aromatic ring or heteroaromatic ring, t is 0 or 1, and u is 1 or 2.)

A curable composition for an electrical machine is presented. The curable composition includes: (A) about 10 weight percent to about 30 weight percent of a polyfunctional cyanate ester; (B) about 25 weight percent to about 60 weight percent of a first difunctional cyanate ester, or a prepolymer thereof; (C) about 10 weight percent to about 30 weight percent of a second difunctional cyanate ester, or a prepolymer thereof, and (D) about 5 weight percent to about 25 weight percent of a thermally conductive filler comprising boron nitride. An associated method is also presented.

Provided is a highly versatile heat-curable resin composition for semiconductor encapsulation that exhibits a favorable water resistance and abradability when used to encapsulate a semiconductor device; and a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-sized wafer.

The heat-curable resin composition for semiconductor encapsulation comprises: (A) a cyanate ester compound having not less than two cyanato groups in one molecule, and containing a particular cyanate ester compound that has a viscosity of not higher than 50 Pa.Math.s; (B) a phenol curing agent containing a resorcinol-type phenolic resin; (C) a curing accelerator; (D) an inorganic filler surface-treated with a silane coupling agent; and (E) an ester compound.