The present invention relates to a resin composition containing a compound having a maleimido group, a divalent group having at least two imido bonds and a saturated or unsaturated divalent hydrocarbon group.

A branched polyimide of the formula (I) wherein G is a group having a valence of t, present in an amount of 0.01 to 10 mol %, or 0.05 to 5 mol %, or 0.1 to 4 mol %, or 0.1 to 3 mol %, each of Q, M, D, V, and R are as defined herein, q is 0 or 1, m is 0 or 1, d is 0 or 1, p is 1 or 2, t is 2 to 6, preferably 2 to 4, and each n is independently the same or different, and is 1 to 1,000, provided that the total of all values of n is greater than 4, wherein the branched polyimide has a zero-shear viscosity in a range from 500 to 15,000 Pa.Math.s, a rheology ratio of 1.1 to 5, and a strain hardening ratio of 1 to 6. ##STR00001##

The present invention relates to a new class of dielectric polymer material, which is particularly suitable for the manufacturing of electronic devices. The dielectric polymer material is formed by reacting bismaleimide compounds and shows an advantageous well-balanced profile of favorable material properties. The bismaleimide compounds have an oligomeric structure with a cardo and/or spiro moiety containing repeating unit in the middle part of the molecule and maleimide groups at each terminal end of the molecule. There is further provided a method for forming said dielectric polymer material and an electronic device comprising the same as dielectric material.

Embodiments in accordance with the present invention encompass photosensitive compositions containing a variety of soluble polyimide polymers and various additives including photoacid generator, photo radical generator and one or more photo crosslinking agents which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom can be readily cured at lower temperatures than the conventional polyimides and exhibit improved thermo-mechanical properties, among other property enhancements.

Polymer resins for the vat photopolymerization of thermoplastics are provided, in particular for the vat photopolymerization of thermoplastics with exception thermal stability and mechanical properties. In some aspects, the polymer resins are prepared by ring opening of an aromatic dianhydride with an alcohol containing an acrylate or methacrylate to produce a photocrosslinkable diacid monomer; conversion of the photocrosslinkable diacid monomer to a photocrosslinkable diacyl chloride; and polymerization of the photocrosslinkable diacyl chloride with an aromatic diamine to produce a photocrosslinkable precursor polymer. Upon crosslinking and drying, a thermal imidization can yield aromatic polyimide polymers with high yield and with micron-scale structural resolution.

The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): ##STR00001##
and a diamine of Formula (2) or (3): ##STR00002##
wherein G, P, R, R.sub.x, P, D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.

A branched polyimide of the formula (I) wherein G is a group having a valence of t present in an amount 0.01 to 20 mol %, each Q is independently the same or different, and is a divalent C.sub.1-60 hydrocarbon group, each M is independently the same or different, and is O, C(O), OC(O), OC(O)O, NHC(O), (O)CNH, S, S(O), or S(O).sub.2, D is a phenylene, each V is independently the same or different, and is a tetravalent C.sub.4-40 hydrocarbon group, each R is independently the same or different, and is a C.sub.1-20 divalent hydrocarbon group, q is 0 or 1, m is 0 or 1, d is 0 or 1, p is 1 or 2, t is 2 to 6, and each n is independently the same or different, and is 1 to 1,000, provided that the total of all values of n is greater than 4.

##STR00001##

A branched polyimide of the formula (I) wherein G is a group having a valence of t, present in an amount of 0.01 to 10 mol %, or 0.05 to 5 mol %, or 0.1 to 4 mol %, or 0.1 to 3 mol %, each of Q, M, D, V, and R are as defined herein, q is 0 or 1, m is 0 or 1, d is 0 or 1, p is 1 or 2, t is 2 to 6, preferably 2 to 4, and each n is independently the same or different, and is 1 to 1,000, provided that the total of all values of n is greater than 4, wherein the branched polyimide has a zero-shear viscosity in a range from 500 to 15,000 Pa.Math.s, a rheology ratio of 1.1 to 5, and a strain hardening ratio of 1 to 6.

##STR00001##

A polyimide oligomer of the formula ##STR00001##
wherein G is a group having a valence of t, each R is independently a C.sub.1-30 divalent bridging group, a C.sub.1-20 alkylene-X, or a C.sub.6-30 arylene-X wherein X is O-M, C(O)O-M, OC(O)O-M, S-M, S(O).sub.2-M, S(O).sub.3-M, OS(O).sub.3-M, or OP(O).sub.3-M wherein each M is independently Li, Na, K, Cs, Mg, Ca, Sr, Cr, Mn, Fe, Co, Ni, Cu, Zn, Cd, B, Al, Ga, In, Ge, Sn, Pb, As, or Sb, provided that at least one R is C.sub.1-20 alkylene-X or C.sub.6-30 arylene-X, q is 0 or 1, m is 0 or 1, d is 0 or 1, p is 1 or 2, t is 1 to 6, and each n is independently 1 to 1,000, the total of all values of n is greater than 4, the polyimide oligomer is thermoplastic, and Q, M, D, and V are as provided herein.

A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.