A unit detergent pack consists of a pouch made of a water-soluble film comprising polyvinyl alcohol, about 0.9 to about 15 weight percent actives of propylene glycol based on a total weight of the film, about 0 to about 23 weight percent actives of glycerin based on a total weight of the film, about 3 to about 17 weight percent actives of polyethylene glycol based on a total weight of the film wherein the polyethylene glycol has a number-average molecular weight of about 100 Daltons to about 600 Daltons, about 4 to about 15 weight percent actives of glucose based on a total weight of the film, and about 8 to about 18 weight percent actives of fructose based on a total weight of the film. The pack also includes a detergent composition encapsulated within the pouch.

The invention concerns a thermosetting resin composition, a cured film, a substrate with the cured film, and an electronic component, and the thermosetting resin composition contains polyester amide acid (A), epoxy compound (B) having a fluorene skeleton and epoxy curing agent (C).

The invention concerns a thermosetting resin composition, a cured film, a substrate with the cured film, and an electronic component, and the thermosetting resin composition contains polyester amide acid (A), epoxy compound (B) having a fluorene skeleton and epoxy curing agent (C).

The invention concerns a thermosetting resin composition, a cured film, a substrate with the cured film, and an electronic component, and the thermosetting resin composition contains polyester amide acid (A), epoxy compound (B) having a fluorene skeleton and epoxy curing agent (C).

An aqueous composition comprising: (a) 4,5-dichloro-2-n-octyl-4-isothiazolin-3-one; and (b) an aromatic acid anhydride comprising from 6 to 30 carbon atoms.

Disclosed herein are coupled polymer products comprising polymer with up to five polymer chains bonded to a functionalizing compound of either formula (II) or formula (III), wherein the polymer chains are comprised of conjugated diene-containing monomers optionally in combination with vinyl aromatic monomers and further include vinyl group-functionalized aminosilane compound of formula (I) bonded within the polymer chain. Also disclosed are processes for producing the coupled polymer products as well as a rubber composition containing the coupled polymer product and tire components comprising the rubber composition.

Disclosed herein are coupled polymer products comprising polymer with up to five polymer chains bonded to a functionalizing compound of either formula (II) or formula (III), wherein the polymer chains are comprised of conjugated diene-containing monomers optionally in combination with vinyl aromatic monomers and further include vinyl group-functionalized aminosilane compound of formula (I) bonded within the polymer chain. Also disclosed are processes for producing the coupled polymer products as well as a rubber composition containing the coupled polymer product and tire components comprising the rubber composition.

A resin composition that has excellent adhesiveness to chips and substrates such as printed wiring boards and excellent flux activity is provided. The present application provides a resin composition containing: a benzoxazine compound (A); an organic compound (B) having a flux function; and at least one thermosetting component (C) selected from a phenolic resin and a radical polymerizable thermosetting resin, wherein the radical polymerizable thermosetting resin is a resin or a compound having at least one or more functional groups selected from the group consisting of an alkenyl group, a maleimide group and a (meth)acryloyl group, and wherein a mass ratio between the benzoxazine compound (A) and the thermosetting component (C) ((A)/(C)) is 20/80 to 90/10.

A resin composition that has excellent adhesiveness to chips and substrates such as printed wiring boards and excellent flux activity is provided. The present application provides a resin composition containing: a benzoxazine compound (A); an organic compound (B) having a flux function; and at least one thermosetting component (C) selected from a phenolic resin and a radical polymerizable thermosetting resin, wherein the radical polymerizable thermosetting resin is a resin or a compound having at least one or more functional groups selected from the group consisting of an alkenyl group, a maleimide group and a (meth)acryloyl group, and wherein a mass ratio between the benzoxazine compound (A) and the thermosetting component (C) ((A)/(C)) is 20/80 to 90/10.

A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 μm or more and 100 μm or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.