A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 μm or more and 100 μm or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.

An oxygen-absorbing resin composition containing an ethylene terephthalate type polyester resin and an organic oxygen absorber and, further, containing cobalt in an amount of 5 to 50 ppm and titanium in an amount of 1 to 15 ppm calculated as elements.

An oxygen-absorbing resin composition containing an ethylene terephthalate type polyester resin and an organic oxygen absorber and, further, containing cobalt in an amount of 5 to 50 ppm and titanium in an amount of 1 to 15 ppm calculated as elements.

An oxygen-absorbing resin composition containing an ethylene terephthalate type polyester resin and an organic oxygen absorber and, further, containing cobalt in an amount of 5 to 50 ppm and titanium in an amount of 1 to 15 ppm calculated as elements.

Process for reducing fogging from high melt strength polypropylene (HMS-PP) obtained by heat treating polypropylene at a temperature between 150 C. and 300 C. in the presence of a dialkyl peroxydicarbonate, said process involving the introduction of an anhydride to said high melt strength polypropylene.

Process for reducing fogging from high melt strength polypropylene (HMS-PP) obtained by heat treating polypropylene at a temperature between 150 C. and 300 C. in the presence of a dialkyl peroxydicarbonate, said process involving the introduction of an anhydride to said high melt strength polypropylene.

The invention discloses one method of producing polyether polymer dispersant and polyether polymer, wherein the dispersant is a copolymer macromolecule prepared by the propylene oxide or ethylene oxide with an average molecular weight of 6000 to 20000, with containing at least one benzene ring group and one polymerizable carbon-carbon double or triple bond polymer. The preparation method of the dispersant is: synthesizing a basic polyether polyol, adding a cyclic dicarboxylic anhydride into the polyether polyol, then the polyether polyol is reacted with an epoxy compound with the polymerizable double bond, and capping with an epoxy compound to obtain the dispersant; preparing the polymer polyol by the basic polyol, an unsaturated vinyl monomer styrene and acrylonitrile, a polymerization initiator, the dispersant and an optional chain transfer agent; the basic polyether is a polyether polyol with a functionality of 3 to 8.

A method for operating in a borehole comprises disposing in a downhole environment an article comprising a bismaleimide composite which comprises a polybismaleimide and a disintegrating agent; exposing the article to an aqueous fluid at a temperature of about 25 C. to about 300 C.; and disintegrating the article.

A method for operating in a borehole comprises disposing in a downhole environment an article comprising a bismaleimide composite which comprises a polybismaleimide and a disintegrating agent; exposing the article to an aqueous fluid at a temperature of about 25 C. to about 300 C.; and disintegrating the article.

The present invention discloses an organofluorine modified epoxy resin for increasing the surface flashover voltage, and preparation methods and applications thereof. In the present invention, the organofluorine modified epoxy resin is prepared from bisphenol A epoxy resin and hexafluorobisphenol A as raw materials in a mild environment in the presence of tri-(dimethylaminomethyl)phenol as a catalyst. Due to the reasonable proportion of the raw materials, the performance of the resin is optimized, the process is simple, and it is easy to realize industrial production. By using the modified resin as a matrix and adding a curing agent, a filler and an accelerant, a modified resin composite is prepared. In the present invention, a CF.sub.3 group is introduced in the epoxy resin without changing the surface state of the epoxy composite insulating material, the volume/surface resistivity of the material is reduced, it is less likely to accumulate charges on the material surface.