C08K5/3417

OXYGEN SCAVENGING MOLECULES, ARTICLES CONTAINING SAME, AND METHODS OF THEIR USE

The invention relates to compounds of the structure of formula I and II:

##STR00001##

where X is selected from the group consisting of O, S and NH; Y, A and B are independently selected from the group consisting of N and CH; D, E and F are independently selected from the group consisting of CH, N, O and S; the symbol ---- represents a single or a double bond; and R.sub.1, R.sub.2 and R.sub.3 are independently selected from the group consisting of H, electron withdrawing groups and electron releasing groups. In other embodiments, the compounds are used as oxygen scavengers and in barrier compositions and articles.

OXYGEN SCAVENGING MOLECULES, ARTICLES CONTAINING SAME, AND METHODS OF THEIR USE

The invention relates to compounds of the structure of formula I and II:

##STR00001##

where X is selected from the group consisting of O, S and NH; Y, A and B are independently selected from the group consisting of N and CH; D, E and F are independently selected from the group consisting of CH, N, O and S; the symbol ---- represents a single or a double bond; and R.sub.1, R.sub.2 and R.sub.3 are independently selected from the group consisting of H, electron withdrawing groups and electron releasing groups. In other embodiments, the compounds are used as oxygen scavengers and in barrier compositions and articles.

OXYGEN SCAVENGING MOLECULES, ARTICLES CONTAINING SAME, AND METHODS OF THEIR USE

The invention relates to compounds of the structure of formula I and II:

##STR00001##

where X is selected from the group consisting of O, S and NH; Y, A and B are independently selected from the group consisting of N and CH; D, E and F are independently selected from the group consisting of CH, N, O and S; the symbol ---- represents a single or a double bond; and R.sub.1, R.sub.2 and R.sub.3 are independently selected from the group consisting of H, electron withdrawing groups and electron releasing groups. In other embodiments, the compounds are used as oxygen scavengers and in barrier compositions and articles.

LIGHT-RESPONSIVE TEMPORARY ADHESIVES AND USE THEREOF
20220228035 · 2022-07-21 ·

The invention relates to a device that includes a substrate and a thin film of a photo-switchable adhesive layer applied to at least one surface of the substrate. A method of releasably supporting a product that includes adhering a product onto the thin film of the device and exposing the thin film to light sufficient to cause a change in the adhesive strength of the thin film. A method of making the device is also disclosed.

THERMALLY CONDUCTIVE COMPOSITION CONTAINING MGO FILLER AND METHODS AND DEVICES IN WHICH SAID COMPOSITION IS USED

A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 1 μm, (D-2) middle-sized filler having a mean size of from 1 to 10 μm, (D-3) large filler having a mean size of larger than 30 μm and comprising at least magnesium oxide.

THERMALLY CONDUCTIVE COMPOSITION CONTAINING MGO FILLER AND METHODS AND DEVICES IN WHICH SAID COMPOSITION IS USED

A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 1 μm, (D-2) middle-sized filler having a mean size of from 1 to 10 μm, (D-3) large filler having a mean size of larger than 30 μm and comprising at least magnesium oxide.

THERMALLY CONDUCTIVE COMPOSITION CONTAINING MGO FILLER AND METHODS AND DEVICES IN WHICH SAID COMPOSITION IS USED

A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 1 μm, (D-2) middle-sized filler having a mean size of from 1 to 10 μm, (D-3) large filler having a mean size of larger than 30 μm and comprising at least magnesium oxide.

HEAT-RESISTANT SILICONE RESIN COMPOSITION AND HEAT-RESISTANT SILICONE RESIN COMPOSITE MATERIAL
20210403717 · 2021-12-30 ·

A heat-resistant silicone resin composition contains a silicone resin and a heat resistance improver. The heat resistance improver is an organic polycyclic aromatic compound having one or more secondary amino groups and one or more ketone groups in a ring structure. The organic polycyclic aromatic compound maybe, e.g., quinacridone (P.V. 19) represented by the following Chemical Formula 2. A silicone resin composite material of the present invention includes the heat-resistant silicone resin composition and at least one filler selected from the group consisting of an inorganic filler and an organic filler. The at least one filler is contained in the heat-resistant silicone resin composition. Thus, the silicone resin composition and the silicone resin composite material have high heat resistance.

##STR00001##

HEAT-RESISTANT SILICONE RESIN COMPOSITION AND HEAT-RESISTANT SILICONE RESIN COMPOSITE MATERIAL
20210403717 · 2021-12-30 ·

A heat-resistant silicone resin composition contains a silicone resin and a heat resistance improver. The heat resistance improver is an organic polycyclic aromatic compound having one or more secondary amino groups and one or more ketone groups in a ring structure. The organic polycyclic aromatic compound maybe, e.g., quinacridone (P.V. 19) represented by the following Chemical Formula 2. A silicone resin composite material of the present invention includes the heat-resistant silicone resin composition and at least one filler selected from the group consisting of an inorganic filler and an organic filler. The at least one filler is contained in the heat-resistant silicone resin composition. Thus, the silicone resin composition and the silicone resin composite material have high heat resistance.

##STR00001##

COLORING COMPOSITION, FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE

Provided are a coloring composition including a colorant including a green pigment, a compound A, and a resin, in an which amount of the green pigment dissolved in 100 g of propylene glycol methyl ether acetate at 25° C. is less than 0.01 g, an amount of the compound A dissolved in 100 g of propylene glycol methyl ether acetate at 25° C. is 0.01 g or more, the coloring composition includes 0.1 to 10 parts by mass of the compound A with respect to 100 parts by mass of the green pigment, and the green pigment and the compound A satisfy a relationship of “−1.0 eV≤LUMO.sub.B−LUMO.sub.A≤1.0 eV”; a film; a color filter; a solid-state imaging element; and an image display device. LUMO.sub.B is an energy level of a lowest unoccupied molecular orbital of the green pigment, and LUMO.sub.A is an energy level of a lowest unoccupied molecular orbital of the compound A.