Patent classifications
C08K5/3417
COLORED CURABLE RESIN COMPOSITION
An object of the present invention is to provide a colored curable resin composition for forming an optical filter in which the occurrence of foreign matter is reduced. The present invention relates to a colored curable resin composition containing a colorant, a resin, a polymerizable compound, and a polymerization initiator, wherein the colorant is a colorant containing a compound represented by formula (I) or formula (II).
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COLORED CURABLE RESIN COMPOSITION
An object of the present invention is to provide a colored curable resin composition for forming an optical filter in which the occurrence of foreign matter is reduced. The present invention relates to a colored curable resin composition containing a colorant, a resin, a polymerizable compound, and a polymerization initiator, wherein the colorant is a colorant containing a compound represented by formula (I) or formula (II).
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THERMOPLASTIC MOLDING COMPOSITIONS THAT RESIST HEAT
Described herein is a thermoplastic molding composition, including A) from 10 to 99.99% by weight of a thermoplastic polymer, B) from 0.01 to 20% by weight of at least one carbazole compound selected from substituted and unsubstituted carbazole and organic compounds containing at least one chemically bonded substituted or unsubstituted carbazole residue, and C) from 0 to 70% by weight of further additives,
where the total of the percentages by weight of components A) to C) is 100% by weight.
THERMOPLASTIC MOLDING COMPOSITIONS THAT RESIST HEAT
Described herein is a thermoplastic molding composition, including A) from 10 to 99.99% by weight of a thermoplastic polymer, B) from 0.01 to 20% by weight of at least one carbazole compound selected from substituted and unsubstituted carbazole and organic compounds containing at least one chemically bonded substituted or unsubstituted carbazole residue, and C) from 0 to 70% by weight of further additives,
where the total of the percentages by weight of components A) to C) is 100% by weight.
THERMOPLASTIC MOLDING COMPOSITIONS THAT RESIST HEAT
Described herein is a thermoplastic molding composition, including A) from 10 to 99.99% by weight of a thermoplastic polymer, B) from 0.01 to 20% by weight of at least one carbazole compound selected from substituted and unsubstituted carbazole and organic compounds containing at least one chemically bonded substituted or unsubstituted carbazole residue, and C) from 0 to 70% by weight of further additives,
where the total of the percentages by weight of components A) to C) is 100% by weight.
ACRYLIC RUBBER COMPOSITION AND RUBBER CROSSLINKED PRODUCT
An acrylic rubber composition includes an acrylic rubber and a specific antioxidant, wherein the acrylic rubber includes 15 to 55% by weight of methacrylic acid alkyl ester monomer units (a), 44.5 to 84.5% by weight of acrylic acid ester monomer units (b), and 0.5 to 4% by weight of carboxyl group-containing monomer units (c), and the content of the antioxidant is 0.1 to 5 parts by weight relative to 100 parts by weight of the acrylic rubber.
ACRYLIC RUBBER COMPOSITION AND RUBBER CROSSLINKED PRODUCT
An acrylic rubber composition includes an acrylic rubber and a specific antioxidant, wherein the acrylic rubber includes 15 to 55% by weight of methacrylic acid alkyl ester monomer units (a), 44.5 to 84.5% by weight of acrylic acid ester monomer units (b), and 0.5 to 4% by weight of carboxyl group-containing monomer units (c), and the content of the antioxidant is 0.1 to 5 parts by weight relative to 100 parts by weight of the acrylic rubber.
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
A resin composition includes: (A) a polyphenylene ether resin of Formula (1) and (B) a compound of Formula (3), and/or a compound of Formula (4), and/or a compound of Formula (5). An article is made from the resin composition. The article made from the resin composition may include a prepreg, a resin film, a laminate or a printed circuit board, and one or more properties including resin filling void, glass transition temperature, Z-axis ratio of thermal expansion, dielectric constant, dissipation factor, and warpage may be improved.
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RESIN COMPOSITION AND ARTICLE MADE THEREFROM
A resin composition includes: (A) a polyphenylene ether resin of Formula (1) and (B) a compound of Formula (3), and/or a compound of Formula (4), and/or a compound of Formula (5). An article is made from the resin composition. The article made from the resin composition may include a prepreg, a resin film, a laminate or a printed circuit board, and one or more properties including resin filling void, glass transition temperature, Z-axis ratio of thermal expansion, dielectric constant, dissipation factor, and warpage may be improved.
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OPTICAL FILTER
The present invention relates to an optical filter including: a substrate; and a dielectric multilayer film laid on or above at least one major surface of the substrate, as an outermost layer, in which: the substrate includes a resin film containing a dye (U) having a maximum absorption wavelength in a range of 360 to 395 nm in dichloromethane, a dye (A) having a maximum absorption wavelength in a range of 600 to 800 nm in dichloromethane, and a resin; and the optical filter satisfies spectral characteristics (i-1) to (i-5).