A polyolefin material that comprises a thermoplastic composition is provided. The composition contains a continuous phase that includes a polyolefin matrix polymer and a nanoinclusion additive dispersed within the continuous phase in the form of discrete domains. The composition further includes a beta-nucleating agent. A porous network is defined within the thermoplastic composition that includes a plurality of nanopores.

A polyolefin material that comprises a thermoplastic composition is provided. The composition contains a continuous phase that includes a polyolefin matrix polymer and a nanoinclusion additive dispersed within the continuous phase in the form of discrete domains. The composition further includes a beta-nucleating agent. A porous network is defined within the thermoplastic composition that includes a plurality of nanopores.

Described herein is an adhesive composition comprising: (a) a (meth)acryloyl polymer; and (b) greater than 1 parts of a tackifier per 100 parts of the(meth)acryloyl polymer, wherein the tackifier comprises a substituted oligomeric quinoline.

Provided is a thermosetting resin composition, which can be used as underfill for obtaining favorable solder connectivity while suppressing the formation of voids in the case of treating under heating conditions required by the underfill in a semiconductor chip thermocompression bonding step using the thermal compression bonding technique. The thermosetting resin composition contains a thermosetting resin, a curing agent and a fluxing agent, and the temperature at which the rate of temperature change of viscosity when temperature is increased according to a prescribed heating profile reaches 30 Pa.Math.s/° C. is 200° C. to 250° C.

The invention relates to benzothiazole-containing silanes of the formula I ##STR00001##
which are prepared by reacting benzothiazole-containing silanes of the formula II ##STR00002##
with a compound of formula III
R.sup.2—H  (III). The benzothiazole-containing silanes of the formula I can be used in rubber mixtures.

The invention relates to benzothiazole-containing silanes of the formula I ##STR00001##
which are prepared by reacting benzothiazole-containing silanes of the formula II ##STR00002##
with a compound of formula III
R.sup.2—H  (III). The benzothiazole-containing silanes of the formula I can be used in rubber mixtures.

An electric cable has at least one semi-conductive layer obtained from a polymer composition having at least one polypropylene-based thermoplastic polymer material, at least one first antioxidant and at least one metal deactivator.

An electric cable has at least one semi-conductive layer obtained from a polymer composition having at least one polypropylene-based thermoplastic polymer material, at least one first antioxidant and at least one metal deactivator.

Sealant compositions and methods for their use where the sealant compositions include a curable sealant and a photochromic material that undergoes a feature change upon exposure to radiation.

Sealant compositions and methods for their use where the sealant compositions include a curable sealant and a photochromic material that undergoes a feature change upon exposure to radiation.