Patent classifications
C08K5/3465
OPTICAL FILTER
The present invention relates to an optical filter including: a substrate; and a dielectric multilayer film laid on or above at least one major surface of the substrate, as an outermost layer, in which: the substrate includes a resin film containing a dye (U) having a maximum absorption wavelength in a range of 360 to 395 nm in dichloromethane, a dye (A) having a maximum absorption wavelength in a range of 600 to 800 nm in dichloromethane, and a resin; and the optical filter satisfies spectral characteristics (i-1) to (i-5).
OPTICAL FILTER
The present invention relates to an optical filter including: a substrate; and a dielectric multilayer film laid on or above at least one major surface of the substrate, as an outermost layer, in which: the substrate includes a resin film containing a dye (U) having a maximum absorption wavelength in a range of 360 to 395 nm in dichloromethane, a dye (A) having a maximum absorption wavelength in a range of 600 to 800 nm in dichloromethane, and a resin; and the optical filter satisfies spectral characteristics (i-1) to (i-5).
Multi-layer body made of polycarbonate with high weathering resistance
Disclosed is a multi-layer body with high weathering resistance comprising (a) a substrate layer containing at least one thermoplastic polymer (b) one cover layer on at least one side of the substrate layer, characterized in that the substrate layer further contains: (a1) at 0.02 wt. % to 0.2 wt %, at least one colorant on the basis of anthraquinone of structure (1) or (2) with structure (1), R1 and R2 standing, independently of each other, for H, OH, OR5 NH2 and NHR5, R5 being selected from alkyl, cycloalkyl, phenyl and substituted and annulated phenyls, and R3 standing for H, alkyl, alkoxy, and R4 standing for H, OH and p-methylphenyl-NH—; and with structure (2): (a2) at 0.01 wt % to 1.00 wt. %, one or a plurality of demolders, and the cover layer consisting of a coating on the basis of polysiloxane or on the basis of polyacrylate or on the basis of polyurethane acrylate, containing at least one UV-absorber and having a layer thickness of 2-15 [mu]m.
Multi-layer body made of polycarbonate with high weathering resistance
Disclosed is a multi-layer body with high weathering resistance comprising (a) a substrate layer containing at least one thermoplastic polymer (b) one cover layer on at least one side of the substrate layer, characterized in that the substrate layer further contains: (a1) at 0.02 wt. % to 0.2 wt %, at least one colorant on the basis of anthraquinone of structure (1) or (2) with structure (1), R1 and R2 standing, independently of each other, for H, OH, OR5 NH2 and NHR5, R5 being selected from alkyl, cycloalkyl, phenyl and substituted and annulated phenyls, and R3 standing for H, alkyl, alkoxy, and R4 standing for H, OH and p-methylphenyl-NH—; and with structure (2): (a2) at 0.01 wt % to 1.00 wt. %, one or a plurality of demolders, and the cover layer consisting of a coating on the basis of polysiloxane or on the basis of polyacrylate or on the basis of polyurethane acrylate, containing at least one UV-absorber and having a layer thickness of 2-15 [mu]m.
POLYAMIDE COMPOSITIONS WITH HIGH HEAT PERFORMANCE
A polyamide composition comprising from 25 wt % to 90 wt % of a first polyamide comprising a non-aromatic polyamide formed from 50 wt % to 90 wt % PA66; from 10-50 wt % of a second polyamide comprising a polyamide copolymer; from 0.01-10 wt % of a first stabilizer comprising a lanthanoid-based compound; from 0.01-10 wt % of a second stabilizer comprising a copper-based compound; and from 0-65 wt % filler.
POLYAMIDE COMPOSITIONS WITH HIGH HEAT PERFORMANCE
A polyamide composition comprising from 25 wt % to 90 wt % of a first polyamide comprising a non-aromatic polyamide formed from 50 wt % to 90 wt % PA66; from 10-50 wt % of a second polyamide comprising a polyamide copolymer; from 0.01-10 wt % of a first stabilizer comprising a lanthanoid-based compound; from 0.01-10 wt % of a second stabilizer comprising a copper-based compound; and from 0-65 wt % filler.
Low dielectric constant siliceous film manufacturing composition and methods for producing cured film and electronic device using the same
To provide a low dielectric constant siliceous film manufacturing composition capable of forming a low dielectric constant siliceous film with dispersed pores having excellent mechanical properties and stable electrical properties. [Means] The present invention provides a low dielectric constant siliceous film manufacturing composition comprising: a polysiloxane, a pore-generating material, a condensation catalyst generator, and a solvent.
Low dielectric constant siliceous film manufacturing composition and methods for producing cured film and electronic device using the same
To provide a low dielectric constant siliceous film manufacturing composition capable of forming a low dielectric constant siliceous film with dispersed pores having excellent mechanical properties and stable electrical properties. [Means] The present invention provides a low dielectric constant siliceous film manufacturing composition comprising: a polysiloxane, a pore-generating material, a condensation catalyst generator, and a solvent.
Support material for energy-pulse-induced transfer printing
The invention relates to a material for use as support material for energy-pulse-induced transfer printing, which contains (a) at least one energy transformation component, (b) at least one volume expansion component and (c) at least one binder and which has a viscosity at 25° C. of from 0.2 Pas to 1000 Pas and a surface tension at 25° C. of from 20 to 150 mN/m. The invention furthermore relates to a process for producing three-dimensional objects using the support material.
Support material for energy-pulse-induced transfer printing
The invention relates to a material for use as support material for energy-pulse-induced transfer printing, which contains (a) at least one energy transformation component, (b) at least one volume expansion component and (c) at least one binder and which has a viscosity at 25° C. of from 0.2 Pas to 1000 Pas and a surface tension at 25° C. of from 20 to 150 mN/m. The invention furthermore relates to a process for producing three-dimensional objects using the support material.