A positive resist composition is provided comprising two onium salts, a base polymer comprising acid labile group-containing recurring units, and an organic solvent. The positive resist composition forms a pattern having PED stability and improved properties including DOF, LWR, and controlled footing profile.

A resist composition comprising a base polymer and a quencher in the form of an amine compound having an iodized aromatic ring and a tertiary ester structure offers a high sensitivity and minimal LWR or improved CDU, independent of whether it is of positive or negative tone.

A resist composition comprising a base polymer and a quencher in the form of an amine compound having an iodized aromatic ring and a tertiary ester structure offers a high sensitivity and minimal LWR or improved CDU, independent of whether it is of positive or negative tone.

A method of manufacturing a laminated steel plate capable of simplifying the manufacturing process. This is achieved by a method of manufacturing a laminated steel plate including a step of applying a mixture containing an oil and an adhesive composition for a laminated steel plate including at least one kind of a (meth)acrylate compound compatible with the oil and an organic peroxide to one side or both sides of a strip-like steel plate; and a step of punching a steel plate body from the strip-like steel plate with a punch portion of a press forming device, and laminating and bonding the steel plate bodies.

A method of manufacturing a laminated steel plate capable of simplifying the manufacturing process. This is achieved by a method of manufacturing a laminated steel plate including a step of applying a mixture containing an oil and an adhesive composition for a laminated steel plate including at least one kind of a (meth)acrylate compound compatible with the oil and an organic peroxide to one side or both sides of a strip-like steel plate; and a step of punching a steel plate body from the strip-like steel plate with a punch portion of a press forming device, and laminating and bonding the steel plate bodies.

Object: To provide a method for manufacturing a polymer, which is a method for forming a polymer having a homogeneous copolymer composition and a narrow molecular weight distribution.

Resolution Means: A method for manufacturing a polymer using a microreactor including a flow path capable of mixing a plurality of liquids to perform radical polymerization of a monomer component containing two or more types of monomers in the presence of a polymerization initiator; wherein the microreactor includes a first inlet port configured to feed the monomer component and an additional inlet port located downstream of the first inlet port; and the method includes feeding the monomer component through the first inlet port and the additional inlet port.

Object: To provide a method for manufacturing a polymer, which is a method for forming a polymer having a homogeneous copolymer composition and a narrow molecular weight distribution.

Resolution Means: A method for manufacturing a polymer using a microreactor including a flow path capable of mixing a plurality of liquids to perform radical polymerization of a monomer component containing two or more types of monomers in the presence of a polymerization initiator; wherein the microreactor includes a first inlet port configured to feed the monomer component and an additional inlet port located downstream of the first inlet port; and the method includes feeding the monomer component through the first inlet port and the additional inlet port.

The present invention relates to a novel copolymer, to processes for preparation thereof and to the use thereof.

Provided is a compound that can be used for a resin for a resist having excellent sensitivity, resolution, and etching resistance, or the like, by a compound represented by the following formula (1):

##STR00001##

(wherein R.sub.1 represents a hydrogen atom or a methyl group, R.sub.2 represents an aliphatic hydrocarbon group having 1 to 6 carbon atoms, m represents an integer of 0 to 5, and n represents an integer of 0 to 4).

Provided is a compound that can be used for a resin for a resist having excellent sensitivity, resolution, and etching resistance, or the like, by a compound represented by the following formula (1):

##STR00001##

(wherein R.sub.1 represents a hydrogen atom or a methyl group, R.sub.2 represents an aliphatic hydrocarbon group having 1 to 6 carbon atoms, m represents an integer of 0 to 5, and n represents an integer of 0 to 4).