C08F220/1806

POSITIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS

A positive resist composition is provided comprising a base polymer comprising repeat units having a carboxy group whose hydrogen is substituted by a nitrobenzene ring-containing tertiary hydrocarbyl group. The resist composition has a high sensitivity and resolution and forms a pattern of good profile with reduced edge roughness and size variation after exposure.

Photocurable composition, cured body, gasket in which cured body is used, watertight structure, and method for manufacturing gasket
11613645 · 2023-03-28 · ·

A photocurable composition is provided. A cured product formed by curing the photocurable composition has reworkability and excellent heat resistance while having flexibility. The photocurable composition includes a telechelic acrylic polymer having an acryloyl group at both ends; a polyfunctional acrylic polymer having acryloyl groups; a monofunctional acrylic monomer; and a fumed silica including at least one of a hydrophilic fumed silica or a fumed silica having a polar group. The photocurable composition has a Martens hardness of 0.07 to 0.75 N/mm.sup.2, where the Martens hardness is a hardness after the photocurable composition is cured.

Photocurable composition, cured body, gasket in which cured body is used, watertight structure, and method for manufacturing gasket
11613645 · 2023-03-28 · ·

A photocurable composition is provided. A cured product formed by curing the photocurable composition has reworkability and excellent heat resistance while having flexibility. The photocurable composition includes a telechelic acrylic polymer having an acryloyl group at both ends; a polyfunctional acrylic polymer having acryloyl groups; a monofunctional acrylic monomer; and a fumed silica including at least one of a hydrophilic fumed silica or a fumed silica having a polar group. The photocurable composition has a Martens hardness of 0.07 to 0.75 N/mm.sup.2, where the Martens hardness is a hardness after the photocurable composition is cured.

Copolymer and colored resin composition

A copolymer useful as an ingredient of a colored resin composition, comprising a structural unit derived from an aromatic carboxylic acid having an ethylenically unsaturated bond, a structural unit (Ab) represented by formula (Z), and a structural unit (Ac) derived from an unsaturated compound having a cyclic ether structure having 2 to 4 carbon atoms, wherein L represents a single bond or a divalent linking group, A represents a phenyl group optionally having a substituent other than a carboxy group or a naphthyl group optionally having a substituent other than a carboxy group, R.sup.a represents a hydrogen atom, or an alkyl group having 1 to 4 carbon atoms, and a hydrogen atom contained in the alkyl group is optionally replaced by a hydroxy group. ##STR00001##

Copolymer and colored resin composition

A copolymer useful as an ingredient of a colored resin composition, comprising a structural unit derived from an aromatic carboxylic acid having an ethylenically unsaturated bond, a structural unit (Ab) represented by formula (Z), and a structural unit (Ac) derived from an unsaturated compound having a cyclic ether structure having 2 to 4 carbon atoms, wherein L represents a single bond or a divalent linking group, A represents a phenyl group optionally having a substituent other than a carboxy group or a naphthyl group optionally having a substituent other than a carboxy group, R.sup.a represents a hydrogen atom, or an alkyl group having 1 to 4 carbon atoms, and a hydrogen atom contained in the alkyl group is optionally replaced by a hydroxy group. ##STR00001##

Curable and cured adhesive compositions

Curable adhesive compositions are provided that can be cured using ultraviolet or visible light radiation. These curable adhesive compositions, which contain a curable (meth)acrylate copolymer, have a creep compliance that is less than 5(10.sup.−4) inverse Pascals at 25° C., a creep compliance that is greater than 1(10.sup.−3) inverse Pascals at 70° C., and a shear storage modulus greater than 40 kiloPascals when measured at 25° C. at a frequency of 1 radian/second.

Curable and cured adhesive compositions

Curable adhesive compositions are provided that can be cured using ultraviolet or visible light radiation. These curable adhesive compositions, which contain a curable (meth)acrylate copolymer, have a creep compliance that is less than 5(10.sup.−4) inverse Pascals at 25° C., a creep compliance that is greater than 1(10.sup.−3) inverse Pascals at 70° C., and a shear storage modulus greater than 40 kiloPascals when measured at 25° C. at a frequency of 1 radian/second.

Radiation-sensitive resin composition and resist pattern-forming method

A radiation-sensitive resin composition includes a polymer including a phenolic hydroxyl group, a compound represented by formula (1-1) or formula (1-2), and a compound represented by formula (2). In the formula (1-1), a sum of a, b, and c is no less than 1; at least one of R.sup.1, R.sup.2, and R.sup.3 represents a fluorine atom or the like; and R.sup.4 and R.sup.5 each independently represent a hydrogen atom, a fluorine atom, or the like. In the formula (1-2), in a case in which d is 1, R.sup.6 represents a fluorine atom or the like, and in a case in which d is no less than 2, at least one of the plurality of R.sup.6s represents a fluorine atom or the like; and R.sup.8 represents a single bond or a divalent organic group having 1 to 20 carbon atoms. ##STR00001##

3D printing with polymeric nanogel particles

A photoinitiated polymerizable composition for 3D printing, the polymerizable composition comprising a nanogel component that comprises nanogel particles, wherein the nanogel particles comprise a copolymer with polymerizable reactive groups suitable for reacting with each other or a reactive diluent monomer, a reactive oligomer, a resin, or a combination thereof that is present in the polymerizable composition upon photoinitiation, wherein the nanogel component has a glass transition temperature that is in a range of about −50 C and about 20 C and an average molecular weight that is in a range of about 10 kg/mol and about 100 kg/mol, and wherein the nanoparticles have an average hydrodynamic radius that is in a range of 1 nm to about 5 nm.

ACTIVE ENERGY RAY-CURABLE POLYURETHANE RESIN, CURABLE RESIN COMPOSITION, AND PRODUCTION METHOD FOR ACTIVE ENERGY RAY-CURABLE POLYURETHANE RESIN

In an active energy ray-curable polyurethane resin including a reaction product of a resin material containing an isocyanate group-terminated prepolymer and a hydroxy group-containing unsaturated compound, the isocyanate group-terminated prepolymer includes a reaction product of a prepolymer material containing a polyisocyanate component containing a xylylene diisocyanate and/or a hydrogenated xylylene diisocyanate, and a polyol component containing a polyoxyalkylene polyol having a number average molecular weight of 6000 or more and 12000 or less, and the viscosity at 25° C. of the active energy ray-curable polyurethane resin is 20000 mPa.Math.s or more and 40000 mPa.Math.s or less.