The present invention relates to an adhesive film for a semiconductor, including: a first layer including an adhesive binder and a heat-dissipating filler; and a second layer including an adhesive binder and a magnetic filler, which is formed on at least one surface of the first layer, wherein the adhesive film has a predetermined composition for the adhesive binder included in each of the first layer and the second layer.

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin having a polarity that increases by an action of an acid, and (B) a compound that generates an acid upon irradiation with actinic rays or radiation, represented by a specific general formula, is which the resin (A) includes a repeating unit represented by a specific general formula; and an actinic ray-sensitive or radiation-sensitive film formed of the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method, and a method for manufacturing an electronic device.

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin having a polarity that increases by an action of an acid, and (B) a compound that generates an acid upon irradiation with actinic rays or radiation, represented by a specific general formula, is which the resin (A) includes a repeating unit represented by a specific general formula; and an actinic ray-sensitive or radiation-sensitive film formed of the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method, and a method for manufacturing an electronic device.

A method for manufacturing a device including a substrate and a second film disposed above the substrate includes: forming a first film above the substrate using a composition containing a polymerizable monomer and an oxidation inhibitor; and forming the second film by curing the first film in a state where at least one part of a mold having a convexo-concave pattern is in contact with the first film, or after at least one part of the mold is brought into contact with the first film. The oxidation inhibitor is at least one of a hindered amine compound and a hindered phenol compound having a molecular weight of 700 or more. The composition satisfies a relationship of (t.sub.0(T)−t.sub.x(T))/t.sub.0(T)×100≤13.0. (t.sub.0(T) is a height of a convex part of cured film obtained by the specific method, and t.sub.x(T) is the corresponding height after heating at 260° C.)

Provided is a laminate having a good whiteness and a high infrared-shielding property. Provided are also a kit forming the above-mentioned laminate, a method for producing a laminate, and an optical sensor. The laminate includes an infrared-shielding layer and a white layer, in which the infrared-shielding layer is a layer that shields at least a part of a wavelength range at 800 to 1,500 nm, and the white layer has a value of L* of 35 to 100, a value of a* of −20 to 20, and a value of b* of −40 to 30 in a L*a*b* color coordinate system of CIE 1976.

Provided is a laminate having a good whiteness and a high infrared-shielding property. Provided are also a kit forming the above-mentioned laminate, a method for producing a laminate, and an optical sensor. The laminate includes an infrared-shielding layer and a white layer, in which the infrared-shielding layer is a layer that shields at least a part of a wavelength range at 800 to 1,500 nm, and the white layer has a value of L* of 35 to 100, a value of a* of −20 to 20, and a value of b* of −40 to 30 in a L*a*b* color coordinate system of CIE 1976.

A positive resist composition comprising a base polymer comprising recurring units (a) having the structure of an ammonium salt of fluorosulfonic acid having an iodized or brominated aromatic ring, and recurring units (b1) having an acid labile group-substituted carboxyl group and/or recurring units (b2) having an acid labile group-substituted phenolic hydroxyl group exhibits a high sensitivity, high resolution, low edge roughness and dimensional uniformity, and forms a pattern of good profile after exposure and development.

A positive resist composition comprising a base polymer comprising recurring units (a) having the structure of an ammonium salt of fluorosulfonic acid having an iodized or brominated aromatic ring, and recurring units (b1) having an acid labile group-substituted carboxyl group and/or recurring units (b2) having an acid labile group-substituted phenolic hydroxyl group exhibits a high sensitivity, high resolution, low edge roughness and dimensional uniformity, and forms a pattern of good profile after exposure and development.

An actinic ray-sensitive or radiation-sensitive resin composition containing: a resin (A) of which polarity increases by an action of an acid, the resin (A) having a repeating unit represented by General Formula (A1) as defined herein; and a compound (B) that generates an acid upon irradiation with actinic rays or radiation.

An actinic ray-sensitive or radiation-sensitive resin composition containing: a resin (A) of which polarity increases by an action of an acid, the resin (A) having a repeating unit represented by General Formula (A1) as defined herein; and a compound (B) that generates an acid upon irradiation with actinic rays or radiation.