[Problem] To obtain a thermosetting resin composition that has curing performance at a lower temperature and uses transesterification capable of also suitably coping with conversion into an aqueous form as a curing reaction.

[Solution] A thermosetting resin composition containing a resin component (A), which includes a structure (a) represented by the following general formula (1) and a hydroxy group (b), and a transesterification catalyst (B).

##STR00001##

n=0 to 20

R.sub.1 is an alkyl group having 50 or less carbon atoms.

R.sub.3 is hydrogen or an alkyl group having 10 or less carbon atoms.

[Problem] To obtain a thermosetting resin composition that has curing performance at a lower temperature and uses transesterification capable of also suitably coping with conversion into an aqueous form as a curing reaction.

[Solution] A thermosetting resin composition containing a resin component (A), which includes a structure (a) represented by the following general formula (1) and a hydroxy group (b), and a transesterification catalyst (B).

##STR00001##

n=0 to 20

R.sub.1 is an alkyl group having 50 or less carbon atoms.

R.sub.3 is hydrogen or an alkyl group having 10 or less carbon atoms.

A curable composition containing: a compound represented by the following formula (1):

##STR00001##

wherein R.sup.11 and R.sup.12 each independently represent a hydrogen atom or a methyl group, and R.sup.13 represents a divalent group having a polyoxyalkylene chain; and a thermally conductive filler.

A curable composition containing: a compound represented by the following formula (1):

##STR00001##

wherein R.sup.11 and R.sup.12 each independently represent a hydrogen atom or a methyl group, and R.sup.13 represents a divalent group having a polyoxyalkylene chain; and a thermally conductive filler.

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) which contains a repeating unit (a1) having a specific ring structure, a compound (B) which generates an acid by an irradiation with an actinic ray or a radiation, and a specific compound (C) which is decomposed by an irradiation with an actinic ray or a radiation so that an acid-trapping property is lowered; an actinic ray-sensitive or radiation-sensitive film formed of the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method using the actinic ray-sensitive or radiation-sensitive resin composition; and a method for manufacturing an electronic device.

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) which contains a repeating unit (a1) having a specific ring structure, a compound (B) which generates an acid by an irradiation with an actinic ray or a radiation, and a specific compound (C) which is decomposed by an irradiation with an actinic ray or a radiation so that an acid-trapping property is lowered; an actinic ray-sensitive or radiation-sensitive film formed of the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method using the actinic ray-sensitive or radiation-sensitive resin composition; and a method for manufacturing an electronic device.

An adhesive composition that is excellent in both adhesiveness and a holding force while having high flame retardancy. The adhesive composition contains an acrylic resin (A) containing a (meth)acrylic acid monomer (a1) unit and a hydroxyl group-containing monomer (a2) unit, an epoxy crosslinking agent (b1), an isocyanate crosslinking agent (b2), and a flame retardant (C).

An adhesive composition that is excellent in both adhesiveness and a holding force while having high flame retardancy. The adhesive composition contains an acrylic resin (A) containing a (meth)acrylic acid monomer (a1) unit and a hydroxyl group-containing monomer (a2) unit, an epoxy crosslinking agent (b1), an isocyanate crosslinking agent (b2), and a flame retardant (C).

The invention relates to adhesive strips consisting of at least four, particularly precisely four layers, comprising: a layer A having an upper side and a lower side consisting of a foamed adhesive substance containing a self-adhesive acrylate substance; a layer B consisting of a film carrier, layer B being arranged on the lower side of layer A, at least the main surface which faces layer A, preferably both main surfaces of the film carrier, being etched, the surface of layer A and the surface of layer B being in direct contact with each other; a layer C consisting of a self-adhesive substance, arranged on the upper side of layer A and containing a self-adhesive acrylate substance; and a layer D consisting of a self-adhesive substance, arranged on the side of layer B opposite layer A and containing a self-adhesive acrylate substance.

The invention relates to adhesive strips consisting of at least four, particularly precisely four layers, comprising: a layer A having an upper side and a lower side consisting of a foamed adhesive substance containing a self-adhesive acrylate substance; a layer B consisting of a film carrier, layer B being arranged on the lower side of layer A, at least the main surface which faces layer A, preferably both main surfaces of the film carrier, being etched, the surface of layer A and the surface of layer B being in direct contact with each other; a layer C consisting of a self-adhesive substance, arranged on the upper side of layer A and containing a self-adhesive acrylate substance; and a layer D consisting of a self-adhesive substance, arranged on the side of layer B opposite layer A and containing a self-adhesive acrylate substance.