The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors that include about 0 to about 50 wt % C.sub.1-C.sub.9 alkyl(meth)acrylate, about 40 to about 99 wt % C.sub.10-C.sub.24 (meth)acrylate, about 0 to about 30 wt % hydroxyl(meth)acrylate, about 0 to about 10 wt % of a non-hydroxy functional polar monomer, and about 0 to about 5 wt % crosslinker.

A monomer has the structure ##STR00001##
wherein R is an organic group comprising a polymerizable carbon-carbon double bond or carbon-carbon triple bond; X and Y are independently at each occurrence hydrogen or a non-hydrogen substituent; EWG1 and EWG2 are independently at each occurrence an electron-withdrawing group; p is 0, 1, 2, 3, or 4; n is 1, 2, 3, or 4; and M.sup.+ is an organic cation. A polymer prepared from monomer is useful as a component of a photoresist composition.

A monomer has the structure ##STR00001##
wherein R is an organic group comprising a polymerizable carbon-carbon double bond or carbon-carbon triple bond; X and Y are independently at each occurrence hydrogen or a non-hydrogen substituent; EWG1 and EWG2 are independently at each occurrence an electron-withdrawing group; p is 0, 1, 2, 3, or 4; n is 1, 2, 3, or 4; and M.sup.+ is an organic cation. A polymer prepared from monomer is useful as a component of a photoresist composition.

A positive resist composition is provided comprising a base polymer comprising repeat units having a carboxy group whose hydrogen is substituted by a nitrobenzene ring-containing tertiary hydrocarbyl group. The resist composition has a high sensitivity and resolution and forms a pattern of good profile with reduced edge roughness and size variation after exposure.

A positive resist composition is provided comprising a base polymer comprising repeat units having a carboxy group whose hydrogen is substituted by a nitrobenzene ring-containing tertiary hydrocarbyl group. The resist composition has a high sensitivity and resolution and forms a pattern of good profile with reduced edge roughness and size variation after exposure.

A radiation-sensitive resin composition includes a polymer including a phenolic hydroxyl group, a compound represented by formula (1-1) or formula (1-2), and a compound represented by formula (2). In the formula (1-1), a sum of a, b, and c is no less than 1; at least one of R.sup.1, R.sup.2, and R.sup.3 represents a fluorine atom or the like; and R.sup.4 and R.sup.5 each independently represent a hydrogen atom, a fluorine atom, or the like. In the formula (1-2), in a case in which d is 1, R.sup.6 represents a fluorine atom or the like, and in a case in which d is no less than 2, at least one of the plurality of R.sup.6s represents a fluorine atom or the like; and R.sup.8 represents a single bond or a divalent organic group having 1 to 20 carbon atoms. ##STR00001##

The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors that include about 0 to about 50 wt % C.sub.1-C.sub.9 alkyl(meth)acrylate, about 40 to about 99 wt % C.sub.10-C.sub.24 (meth)acrylate, about 0 to about 30 wt % hydroxyl (meth)acrylate, about 0 to about 10 wt % of a non-hydroxy functional polar monomer, and about 0 to about 5 wt % crosslinker.

A photoinitiated polymerizable composition for 3D printing, the polymerizable composition comprising a nanogel component that comprises nanogel particles, wherein the nanogel particles comprise a copolymer with polymerizable reactive groups suitable for reacting with each other or a reactive diluent monomer, a reactive oligomer, a resin, or a combination thereof that is present in the polymerizable composition upon photoinitiation, wherein the nanogel component has a glass transition temperature that is in a range of about −50 C and about 20 C and an average molecular weight that is in a range of about 10 kg/mol and about 100 kg/mol, and wherein the nanoparticles have an average hydrodynamic radius that is in a range of 1 nm to about 5 nm.

Disclosed are curable adhesive compositions comprising hydroxyl functional polymers and silane functionalized resins. Such adhesive compositions are capable of providing unexpected properties for various uses and end products. The adhesive may be used for woodworking, automotive, textile, appliances, electronics, bookbinding, and packaging. Suitable substrates can be metal, polymer film, plastics, wood, glass, ceramic, paper, and concrete.

Disclosed are curable adhesive compositions comprising hydroxyl functional polymers and silane functionalized resins. Such adhesive compositions are capable of providing unexpected properties for various uses and end products. The adhesive may be used for woodworking, automotive, textile, appliances, electronics, bookbinding, and packaging. Suitable substrates can be metal, polymer film, plastics, wood, glass, ceramic, paper, and concrete.