Patent classifications
C08F220/1811
CURABLE COMPOSITION AND ARTICLE
A curable composition containing: a compound represented by the following formula (1):
##STR00001##
wherein R.sup.11 and R.sup.12 each independently represent a hydrogen atom or a methyl group, and R.sup.13 represents a divalent group having a polyoxyalkylene chain; and a thermally conductive filler.
CURABLE COMPOSITION AND ARTICLE
A curable composition containing: a compound represented by the following formula (1):
##STR00001##
wherein R.sup.11 and R.sup.12 each independently represent a hydrogen atom or a methyl group, and R.sup.13 represents a divalent group having a polyoxyalkylene chain; and a thermally conductive filler.
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) which contains a repeating unit (a1) having a specific ring structure, a compound (B) which generates an acid by an irradiation with an actinic ray or a radiation, and a specific compound (C) which is decomposed by an irradiation with an actinic ray or a radiation so that an acid-trapping property is lowered; an actinic ray-sensitive or radiation-sensitive film formed of the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method using the actinic ray-sensitive or radiation-sensitive resin composition; and a method for manufacturing an electronic device.
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) which contains a repeating unit (a1) having a specific ring structure, a compound (B) which generates an acid by an irradiation with an actinic ray or a radiation, and a specific compound (C) which is decomposed by an irradiation with an actinic ray or a radiation so that an acid-trapping property is lowered; an actinic ray-sensitive or radiation-sensitive film formed of the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method using the actinic ray-sensitive or radiation-sensitive resin composition; and a method for manufacturing an electronic device.
Coated articles demonstrating electromagnetic radiation transparency and method of mitigating contaminant build-up on a substrate
The present invention is directed to coated articles demonstrating a transmission of electromagnetic radiation having a frequency of 22 to 81 GHz in the range of 70% to 100%. The articles comprise substrates coated with curable film-forming compositions comprising a first film-forming polymer prepared from at least one hydrophobic monomer, a second film-forming polymer prepared from at least one hydrophobic monomer, and a curing agent. Upon application of the curable film-forming composition to the substrate to form a coating layer, the first film-forming polymer is distributed throughout the coating layer, and the concentration of the second film-forming polymer is greater at the surface of the coating layer than the concentration of the second film-forming polymer within the bulk of the coating layer. The present invention is also drawn to methods of mitigating contaminant build-up on a substrate using the curable film-forming compositions described above.
Coated articles demonstrating electromagnetic radiation transparency and method of mitigating contaminant build-up on a substrate
The present invention is directed to coated articles demonstrating a transmission of electromagnetic radiation having a frequency of 22 to 81 GHz in the range of 70% to 100%. The articles comprise substrates coated with curable film-forming compositions comprising a first film-forming polymer prepared from at least one hydrophobic monomer, a second film-forming polymer prepared from at least one hydrophobic monomer, and a curing agent. Upon application of the curable film-forming composition to the substrate to form a coating layer, the first film-forming polymer is distributed throughout the coating layer, and the concentration of the second film-forming polymer is greater at the surface of the coating layer than the concentration of the second film-forming polymer within the bulk of the coating layer. The present invention is also drawn to methods of mitigating contaminant build-up on a substrate using the curable film-forming compositions described above.
RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND COMPOUND
A radiation-sensitive resin composition includes: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid; a radiation-sensitive acid generator; and a compound represented by formula (1). Ar.sup.1 represents a group obtained by removing (a+b+2) hydrogen atoms from an aromatic hydrocarbon ring having 6 to 30 ring atoms; R.sup.1 represents a halogen atom or a monovalent organic group having 1 to 20 carbon atoms; L.sup.1 represents a divalent linking group; R.sup.2 represents a substituted or unsubstituted monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms; a is an integer of 0 to 10, b is an integer of 1 to 10, wherein a sum of a and b is no greater than 10; and X.sup.+ represents a monovalent radiation-sensitive onium cation.
##STR00001##
Plastic substrate adhesion promoter with random copolymer
Disclosed is a resinous adhesion promoter comprising (a) a random copolymer having first and second constitutional monomeric units, the first units comprising halogen and/or a pendant organic group having six or more carbon atoms and the second monomeric units comprising an active hydrogen-containing functional group; and (b) one of either (i) a non-reactive adhesion promoter or (ii) a reaction mixture comprising a first component and a second component, at least one of the first and second components having functional groups being reactive with the active hydrogen-containing functional groups of the random copolymer.
Plastic substrate adhesion promoter with random copolymer
Disclosed is a resinous adhesion promoter comprising (a) a random copolymer having first and second constitutional monomeric units, the first units comprising halogen and/or a pendant organic group having six or more carbon atoms and the second monomeric units comprising an active hydrogen-containing functional group; and (b) one of either (i) a non-reactive adhesion promoter or (ii) a reaction mixture comprising a first component and a second component, at least one of the first and second components having functional groups being reactive with the active hydrogen-containing functional groups of the random copolymer.
Compound and Polymer Composition Including Said Compound
A compound including two or more constituent units derived from a monomer M having a radical polymerizable group and having a radical polymerizable group A at the terminal, in which the monomer M includes a monomer m having a structure that generates an active species by photoexcitation.