C08F220/1811

ADHESIVE SET, ADHESIVE BODY, AND MANUFACTURING METHOD THEREFOR

An adhesive set includes a main agent containing a decomplexing agent and an initiator containing an organoborane complex. At least one of the main agent and the initiator further contains a compound having a radically polymerizable group. At least one of the main agent and the initiator further contains a compound having a thiocarbonylthio structure.

ADHESIVE TAPE, METHOD FOR FIXING ELECTRONIC DEVICE COMPONENT OR ON-BOARD DEVICE COMPONENT, AND METHOD FOR PRODUCING ELECTRONIC DEVICE OR ON-BOARD DEVICE
20230212442 · 2023-07-06 ·

The present invention aims to provide an adhesive tape that is easily peelable while capable of maintaining high adhesion at high temperature. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing: an acrylic copolymer; and 0.01 parts by weight or more and 10 parts by weight or less of a compound having a structure represented by the following formula (A) or (B) relative to 100 parts by weight of the acrylic copolymer:

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ADHESIVE TAPE, METHOD FOR FIXING ELECTRONIC DEVICE COMPONENT OR ON-BOARD DEVICE COMPONENT, AND METHOD FOR PRODUCING ELECTRONIC DEVICE OR ON-BOARD DEVICE
20230212442 · 2023-07-06 ·

The present invention aims to provide an adhesive tape that is easily peelable while capable of maintaining high adhesion at high temperature. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing: an acrylic copolymer; and 0.01 parts by weight or more and 10 parts by weight or less of a compound having a structure represented by the following formula (A) or (B) relative to 100 parts by weight of the acrylic copolymer:

##STR00001##

Curable composition for nano-fabrication
11549020 · 2023-01-10 · ·

A curable composition comprises at least 10 wt % expanding monomers based on a total weight of the curable composition, at least 25 wt % acrylate monomers based on the total weight of the curable composition, a photoinitiator, and a photosensitizer. The acrylate monomers have a molecular weight of 500 or less. The curable composition has a viscosity of 10 cP or less. A total amount of the expanding monomers and the acrylate monomers are at least 90 wt % based on the total weight of the curable composition.

Curable composition for nano-fabrication
11549020 · 2023-01-10 · ·

A curable composition comprises at least 10 wt % expanding monomers based on a total weight of the curable composition, at least 25 wt % acrylate monomers based on the total weight of the curable composition, a photoinitiator, and a photosensitizer. The acrylate monomers have a molecular weight of 500 or less. The curable composition has a viscosity of 10 cP or less. A total amount of the expanding monomers and the acrylate monomers are at least 90 wt % based on the total weight of the curable composition.

Resin composition, method for producing three-dimensional molding using same, and three-dimensional molding
11692093 · 2023-07-04 · ·

Provided is a resin composition from which a three-dimensional molding can be produced at an appropriate speed and with high dimensional accuracy, wherein the obtained three-dimensional molding has high strength. This resin composition is used in a method for producing a three-dimensional molding composed of a cured product of a liquid resin composition by selectively irradiating the liquid resin composition with active energy rays. The resin composition includes at least: a first polymerizable compound, in a liquid state at room temperature, having radical polymerizability; a second polymerizable compound, in a liquid state at room temperature, having no radical polymerizability; and a filler, wherein the surface of the filler is covered with the second polymerizable compound.

Resin composition, method for producing three-dimensional molding using same, and three-dimensional molding
11692093 · 2023-07-04 · ·

Provided is a resin composition from which a three-dimensional molding can be produced at an appropriate speed and with high dimensional accuracy, wherein the obtained three-dimensional molding has high strength. This resin composition is used in a method for producing a three-dimensional molding composed of a cured product of a liquid resin composition by selectively irradiating the liquid resin composition with active energy rays. The resin composition includes at least: a first polymerizable compound, in a liquid state at room temperature, having radical polymerizability; a second polymerizable compound, in a liquid state at room temperature, having no radical polymerizability; and a filler, wherein the surface of the filler is covered with the second polymerizable compound.

Resist composition and method of forming resist pattern

A resist composition including a compound (D0) represented by general formula (d0) and a polymeric compound (A10) having a structural unit (a0) derived from a compound represented by general formula (a0-1) shown below (in formula (d0), n represents an integer of 2 or more; in formula (a0-1), W.sup.1 represents a polymerizable group-containing group; C.sup.t represents a tertiary carbon atom, and the α-position of C.sup.t is a carbon atom which constitutes a carbon-carbon unsaturated bond; R.sup.11 represents an aromatic hydrocarbon group which may have a substituent, or a chain hydrocarbon group; R.sup.12 and R.sup.13 each independently represents a chain hydrocarbon group, or R.sup.12 and R.sup.13 are mutually bonded to form a cyclic group ##STR00001##

Resist composition and method of forming resist pattern

A resist composition including a compound (D0) represented by general formula (d0) and a polymeric compound (A10) having a structural unit (a0) derived from a compound represented by general formula (a0-1) shown below (in formula (d0), n represents an integer of 2 or more; in formula (a0-1), W.sup.1 represents a polymerizable group-containing group; C.sup.t represents a tertiary carbon atom, and the α-position of C.sup.t is a carbon atom which constitutes a carbon-carbon unsaturated bond; R.sup.11 represents an aromatic hydrocarbon group which may have a substituent, or a chain hydrocarbon group; R.sup.12 and R.sup.13 each independently represents a chain hydrocarbon group, or R.sup.12 and R.sup.13 are mutually bonded to form a cyclic group ##STR00001##

Resist composition and method of forming resist pattern

A resist composition including a resin component having a constitutional unit derived from a compound represented by General Formula (a01-1) and a constitutional unit derived from a compound represented by General Formula (a02-1), and an acid generator component composed of an anion moiety and a cation moiety. In General Formula (a01-1), W.sup.1 represents a polymerizable group-containing group, C.sup.t represents a tertiary carbon atom, R.sup.11 represents an unsaturated hydrocarbon group which may have a substituent, R.sup.12 and R.sup.13 represent a chain saturated hydrocarbon group which may have a substituent, and a carbon atom at an α-position of C.sup.t constitutes a carbon-carbon unsaturated bond. In General Formula (a02-1), W.sup.2 represents a polymerizable group-containing group, Wa.sup.2 represents an aromatic hydrocarbon group, and n2 represents an integer in a range of 1 to 3 ##STR00001##