The present invention relates to the field of oil extraction. More specifically, it relates to a particular polymerization process, which provides access to formulations of polymers that may be used in particular for modifying rheology and fluid loss control during extraction operations and that have a better heat stability.

The present invention relates to the field of oil extraction. More specifically, it relates to a particular polymerization process, which provides access to formulations of polymers that may be used in particular for modifying rheology and fluid loss control during extraction operations and that have a better heat stability.

Provided is a method for forming a multilayer coating film including the following steps (1) to (4): (1) applying a base paint (X) to a substrate to form a base coating film; (2) applying a specific effect pigment dispersion (Y) to the base coating film formed in step (1) to form an effect coating film with a specific dry film thickness; (3) applying a clear paint (Z) to the effect coating film formed in step (2) to form a clear coating film; and (4) heating the uncured base coating film, the uncured effect coating film, and the uncured clear coating film formed in steps (1) to (3) to simultaneously cure these three coating films.

Provided is a method for forming a multilayer coating film including the following steps (1) to (4): (1) applying a base paint (X) to a substrate to form a base coating film; (2) applying a specific effect pigment dispersion (Y) to the base coating film formed in step (1) to form an effect coating film with a specific dry film thickness; (3) applying a clear paint (Z) to the effect coating film formed in step (2) to form a clear coating film; and (4) heating the uncured base coating film, the uncured effect coating film, and the uncured clear coating film formed in steps (1) to (3) to simultaneously cure these three coating films.

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate. The present invention provides a material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A) or (1B); and (B) an organic solvent, ##STR00001##
noting that in the general formula (1A), when W.sub.1 represents any of ##STR00002##
R.sub.1 does not represent any of ##STR00003##

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate. The present invention provides a material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A) or (1B); and (B) an organic solvent, ##STR00001##
noting that in the general formula (1A), when W.sub.1 represents any of ##STR00002##
R.sub.1 does not represent any of ##STR00003##

A resist composition including a compound (D0) represented by general formula (d0) and a polymeric compound (A10) having a structural unit (a0) derived from a compound represented by general formula (a0-1) shown below (in formula (d0), n represents an integer of 2 or more; in formula (a0-1), W.sup.1 represents a polymerizable group-containing group; C.sup.t represents a tertiary carbon atom, and the α-position of C.sup.t is a carbon atom which constitutes a carbon-carbon unsaturated bond; R.sup.11 represents an aromatic hydrocarbon group which may have a substituent, or a chain hydrocarbon group; R.sup.12 and R.sup.13 each independently represents a chain hydrocarbon group, or R.sup.12 and R.sup.13 are mutually bonded to form a cyclic group ##STR00001##

A resist composition including a compound (D0) represented by general formula (d0) and a polymeric compound (A10) having a structural unit (a0) derived from a compound represented by general formula (a0-1) shown below (in formula (d0), n represents an integer of 2 or more; in formula (a0-1), W.sup.1 represents a polymerizable group-containing group; C.sup.t represents a tertiary carbon atom, and the α-position of C.sup.t is a carbon atom which constitutes a carbon-carbon unsaturated bond; R.sup.11 represents an aromatic hydrocarbon group which may have a substituent, or a chain hydrocarbon group; R.sup.12 and R.sup.13 each independently represents a chain hydrocarbon group, or R.sup.12 and R.sup.13 are mutually bonded to form a cyclic group ##STR00001##

A composition for encapsulation of organic light emitting diodes and an organic light emitting diode display apparatus, the composition including photocurable monomers and having a CLD of 50 or more, as calculated by Equation 1:

[00001]$\begin{array}{cc}\mathrm{CLD}=.Math.\frac{M_x\left(N_x-1\right)}{M_{\mathrm{total}}}& \left[\mathrm{Equation}1\right]\end{array}$

wherein, in Equation 1, M.sub.total is a total sum of a number of moles of the photocurable monomers in the composition, M.sub.x is a number of moles of an x.sup.th photocurable monomer in the composition, N.sub.x is a number of photocurable functional groups per mole of the x.sup.th photocurable monomer in the composition, and x is an integer of 1 or more.

A composition for encapsulation of organic light emitting diodes and an organic light emitting diode display apparatus, the composition including photocurable monomers and having a CLD of 50 or more, as calculated by Equation 1:

[00001]$\begin{array}{cc}\mathrm{CLD}=.Math.\frac{M_x\left(N_x-1\right)}{M_{\mathrm{total}}}& \left[\mathrm{Equation}1\right]\end{array}$

wherein, in Equation 1, M.sub.total is a total sum of a number of moles of the photocurable monomers in the composition, M.sub.x is a number of moles of an x.sup.th photocurable monomer in the composition, N.sub.x is a number of photocurable functional groups per mole of the x.sup.th photocurable monomer in the composition, and x is an integer of 1 or more.