Patent classifications
C08G59/4276
Polyester-epoxide polymer compositions
Polyester-epoxide polymer (PEEP) compositions are disclosed. The PEEP compositions comprise a reaction product of a polyepoxide compound (eq. wt. 125 to 250 g/eq.) and a polyester polyol composition. The ratio of epoxy equivalents to hydroxyl equivalents is within the range of 0.8 to 3.5. The PEEP composition has a T.sub.g within the range of 40 C. to 60 C. Elevated temperature-cure and low temperature-cure processes for making the PEEP compositions are also disclosed. In a simple yet innovative approach, a new class of polymers useful for adhesives, coatings, elastomers, and other valuable products is assembled from readily available starting materials without reliance on polyisocyanates or polyamines. The PEEP compositions have increased elongation and lower T.sub.g when compared with traditional epoxy products.
Optical fibre having a crosslinked secondary coating
An optical fibre comprising: an optical waveguide comprising a glass core surrounded by a glass cladding; a primary coating surrounding the optical waveguide; a secondary coating, surrounding the primary coating, comprising a cured polymer material obtained by curing a curable coating composition comprising: (a) a polyester obtained by esterification of a reactant A selected from carboxylic acids, triglycerides, and mixtures thereof, having a C.sub.16-C.sub.24 aliphatic chain comprising at least two double bonds spaced by one carbon atom at most, with a reactant B selected from polyols having at least 3 hydroxyl groups, the polyols being thermally stable up to 300 C.; (b) an aromatic glycidyl epoxy resin; (c) an aliphatic polyether hardener containing from 8 to 64 hydroxy groups and/or from 2 to 4 epoxy groups; and (d) a secondary amine compound as curing agent. Preferably, the step of curing is a thermal curing, preferably up to 300 C. When cured by heat, the coating material can be applied during the drawing process of the fibre so as to exploit the heat of the just drawn glass fibre as heat source for curing.
Halogen-free epoxy resin composition and a prepreg and a laminate using the same
The present disclosure relates to a halogen-free epoxy resin composition and a prepreg and a laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reactive phosphorous-containing flame retardant. The prepreg and laminate made from the halogen-free epoxy resin composition have the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, and can achieve the halogen-free flame retardant purpose.
ACTIVE ESTER RESIN AND COMPOSITION AND CURED PRODUCT USING THE SAME
The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.
METHOD FOR CONNECTING MOLDED BODIES BY INJECTING A SINGLE-COMPONENT HEAT-CURING EPOXY RESIN COMPOSITION INTO CAVITIES
A method of bonding two shaped bodies S1 and S2 including the steps of: a) providing shaped body S1; b) arranging shaped body S2 wherein shaped body S1, forming cavity between two shaped bodies, c) introducing one-component thermosetting epoxy resin compositions into cavity, wherein one-component thermosetting epoxy resin composition is one-component thermosetting epoxy resin composition including: at least one epoxy resin A having average of more than one epoxy group per molecule; at least one curing agent B for epoxy resins activated by elevated temperature; at least one polyester polyol PP obtainable by reaction of at least one diol having structure HO(CH.sub.2).sub.xOH the value of x=2-10, andat least one dicarboxylic acid having structure HOOC(CH.sub.2).sub.yCOOH and derivatives of dicarboxylic acid, value of y=8-18, and wherein proportion of polyester polyol PP is 1.5% to 20% by weight, based on total weight of one-component thermosetting epoxy resin composition.
POLYMER NANOFIBER SHEET AND METHOD OF PRODUCING THE SHEET
Provided is a polymer nanofiber sheet having high delamination resistance, a high mechanical strength, and a high specific surface area. Specifically, provided is a polymer nanofiber sheet, including polymer nanofibers, the polymer nanofibers being laminated and three-dimensionally entangled with each other, in which: at least part of the polymer nanofibers are crosslinked at a crosslinked part having crosslinking portions and a non-crosslinking portion; and the crosslinked part contains a low-molecular weight epoxy compound having a molecular weight of from 100 to 3,000.
EPOXY RESIN, EPOXY RESIN-CONTAINING COMPOSITION AND CURED PRODUCT THEREOF
An object of the present invention is to provide an epoxy resin, an epoxy resin-containing composition, and a cured product which are excellent in flexibility. The present invention relates to an epoxy resin, which is a reaction product of an epoxy compound (A) and an acid-terminated polyester (B). In addition, the present invention relates to an epoxy resin-containing composition and a cured product obtained by using the epoxy resin.
OPTICAL FIBRE HAVING A CROSSLINKED SECONDARY COATING
An optical fibre comprising: an optical waveguide comprising a glass core surrounded by a glass cladding; a primary coating surrounding the optical waveguide; a secondary coating, surrounding the primary coating, comprising a cured polymer material obtained by curing a curable coating composition comprising: (a) a polyester obtained by esterification of a reactant A selected from carboxylic acids, triglycerides, and mixtures thereof, having a C.sub.16-C.sub.24 aliphatic chain comprising at least two double bonds spaced by one carbon atom at most, with a reactant B selected from polyols having at least 3 hydroxyl groups, the polyols being thermally stable up to 300 C.; (b) an aromatic glycidyl epoxy resin; (c) an aliphatic polyether hardener containing from 8 to 64 hydroxy groups and/or from 2 to 4 epoxy groups; and (d) a secondary amine compound as curing agent. Preferably, the step of curing is a thermal curing, preferably up to 300 C. When cured by heat, the coating material can be applied during the drawing process of the fibre so as to exploit the heat of the just drawn glass fibre as heat source for curing.
A HALOGEN-FREE EPOXY RESIN COMPOSITION AND A PREPREG AND A LAMINATE USING THE SAME
The present disclosure relates to a halogen-free epoxy resin composition and a prepreg and a laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reactive phosphorous-containing flame retardant. The prepreg and laminate made from the halogen-free epoxy resin composition have the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, and can achieve the halogen-free flame retardant purpose.
THERMOPLASTIC POLYESTER RESIN COMPOSITION AND MOLDED ARTICLE
A thermoplastic polyester resin composition includes 0.05 to 10 parts by weight of an epoxy compound (B) and 0.001 to 1 part by weight of a hindered amine compound (C) with respect to 100 parts by weight of a thermoplastic polyester resin (A) having an amount of carboxyl groups of 50 eq/t or less. The thermoplastic polyester resin composition is capable of producing a molded article which is excellent in mechanical properties and heat resistance, as well as in long-term hydrolysis resistance, and has a small decrease in mechanical properties and hydrolysis resistance even when melt-processed at a high temperature of 270 C. or more.