F25B2321/025

THERMALLY CONTROLLABLE CUPHOLDER
20230272970 · 2023-08-31 ·

A thermally controllable cupholder that is advantageously designed for marine and other outdoor implementations. The thermally controllable cupholder includes a beverage receptacle and a thermal control device configured to change a temperature of the beverage receptacle. In one embodiment, the cupholder includes a drain passageway and a drain hole that connects the beverage receptacle to the drain passageway. In one embodiment, the cupholder includes a perforated heat sink to promote the thermal conductivity of the thermal control device.

Piezoelectric MEMS-based active cooling for heat dissipation in compute devices

An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.

MOBILE PHONE AND OTHER COMPUTE DEVICE COOLING ARCHITECTURE
20220139804 · 2022-05-05 ·

A system for cooling a mobile phone and method for using the system are described. The system includes an active piezoelectric cooling system, a controller and an interface. The active piezoelectric cooling system is configured to be disposed in a rear portion of the mobile phone distal from a front screen of the mobile phone. The controller is configured to activate the active piezoelectric cooling system in response to heat generated by heat-generating structures of the mobile phone. The interface is configured to receive power from a mobile phone power source when the active piezoelectric cooling system is activated.

GRAPHENE THERMAL CONDUCTIVITY USING HIGHLY CONDUCTIVE ISOTROPIC CLADDING
20230251001 · 2023-08-10 ·

A heating and cooling device includes a thermoelectric module that is configured to move heat to or from a conductive surface thereof in response to low voltage power applied to the thermoelectric module. A composite structure is configured to conductively transfer heat between the thermoelectric module and the body. The composite structure includes a graphene sheet material that has an interfacing portion that is thermally coupled with and overlaying the conductive surface of the thermoelectric module. A high thermal conductivity isotropic cladding is disposed at least partially over an outlying portion of the graphene sheet material outside of the interfacing portion. The isotropic cladding conductively transfers heat in a direction orthogonal to a planar extent of the graphene sheet material with a higher thermal conductively than the graphene sheet material in this direction.

UNIVERSAL ROBOTIC-ENABLED STORAGE AND RETRIEVAL SYSTEM

Apparatuses, methods and computer program products for a temperature regulated container disclosed herein. An example temperature regulated apparatus comprises abase container. The base container includes at least a base portion, one or more sidewall portions, and a lid portion. The temperature regulated apparatus also includes one or more thermoelectric components, wherein (i) each of the one or more thermoelectric components are configured to be disposed within the interior of the base container, (ii) each thermoelectric component comprises an exterior surface, an interior surface, and a composite semiconductor layer disposed between the exterior surface and interior surface, and (iii) each thermoelectric component is configured to, in an instance current flows through the thermoelectric component, transfer heat between the interior surface and exterior surface.

HEATING AND COOLING TECHNOLOGIES
20220000191 · 2022-01-06 ·

A heating and cooling device is disclosed comprising at least one integral low voltage heating and cooling source and an efficient flexible heat distribution means having a thermal conductivity of from 375 to 4000 W/mK for distributing the heat and cool across a surface. Further aspects include thermal interface compounds to provide full thermal contact as well as the use of a phase change material to provide a long lasting heating and/or cooling effect without the use of external electrical input. Preferred applications include automotive and furniture seating heating and cooling, along with outdoor garments having distributed heating and cooling effects.

Method and system for driving piezoelectric MEMS-based active cooling devices

A cooling system and method for using the cooling system are described. The cooling system includes an array of cooling elements and a controller. The array of cooling elements corresponds to regions of the heat-generating structure where heat is generated in response to operation of the semiconductor. The controller is configured to activate portions of the array of cooling elements based on a determination that operation of the heat-generating structure is likely to generate heat in a given region of the heat-generating structure.

Peltier cooling system for a domestic kitchen appliance

A domestic kitchen appliance is provided. The domestic kitchen appliance includes a peltier device having a hot side and a cold side; a hot-side heat-sink attached to the hot side of the peltier device, the hot-side heat-sink configured to remove heat from the hot side of the peltier device and transfer the heat removed from the hot side of the peltier device to a cooking chamber; a cold-side heat-sink attached to the cold side of the peltier device, the cold-side heat-sink fluidly connected to an area to be cooled; and a voltage supply that supplies voltage to the peltier device to cause the peltier device to absorb heat from the cold-side heat-sink into the cold side of the peltier device and to expel heat from the hot side of the peltier device into the hot-side heat-sink. The area to be cooled is outside of the cooking chamber.

Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
11639816 · 2023-05-02 · ·

A heating and cooling device is disclosed comprising at least one integral low voltage heating and cooling source and an efficient flexible heat distribution means having a thermal conductivity of from 375 to 4000 W/mK for distributing the heat and cool across a surface. Further aspects include thermal interface compounds to provide full thermal contact as well as the use of a phase change material to provide a long lasting heating and/or cooling effect without the use of external electrical input. Preferred applications include automotive and furniture seating heating and cooling, along with outdoor garments having distributed heating and cooling effects. Additional aspects include a thermal pad wrap and a thermally conductive liquid system for heat/cool distribution.

Mobile phone and other compute device cooling architecture

A system for cooling a mobile phone and method for using the system are described. The system includes an active piezoelectric cooling system, a controller and an interface. The active piezoelectric cooling system is configured to be disposed in a rear portion of the mobile phone distal from a front screen of the mobile phone. The controller is configured to activate the active piezoelectric cooling system in response to heat generated by heat-generating structures of the mobile phone. The interface is configured to receive power from a mobile phone power source when the active piezoelectric cooling system is activated.