A pulse loop heat exchanger, under vacuum, having a working fluid therein, comprising a heat exchanger body, a first continuity plate, and a second continuity plate is provided. The heat exchanger body, first continuity plate and second continuity plate comprise a plurality of channels and grooves on different elevated plane levels, respectfully. The different elevated plane levels result in increased output pressure gain in downward working fluid flow portions of the grooves, boosting thermo-fluidic transport oscillation driving forces throughout the heat exchanger. The second continuity plate comprises a second continuity plate attachment surface having a third elevated continuity channel. In addition to providing for fluid transport and boosting oscillation driving forces, the third elevated continuity channel also provides an internal reservoir. The heat exchanger is formed by an aluminum extrusion and stamping process and comprises three main steps, a providing step, a closing and welding step, and an insertion, vacuuming and closing step.

A heat pipe or a bundle of heat pipes for transporting geothermal heat in a well is provided. As the temperature rises at one end of the heat pipe, the operating fluid turns to a vapor which absorbs the latent heat. The hot vapor within the heat pipe flows to the cooler end of the heat pipe where it then condenses and releases the latent heat. The condensed fluid then flows back to the hot side of the heat pipe and the process repeats itself.

A cooling pipe system, including an evaporation pipe slantly arranged, a water inlet pipe, and a water removal assembly. An output end of the water inlet pipe is connected to an input end of the evaporation pipe, the water inlet pipe is connected to a three-way valve for introducing low molecular weight gas into the evaporation pipe. The water removal assembly is located below the evaporation pipe and includes a water sealing cavity, the output end of the evaporation pipe is connected to the water sealing cavity by means of a recovery pipe, the water sealing cavity is connected to a first pipeline extending upwards and communicated with the input end of the evaporation pipe, a lower end of the first pipeline is connected to a molecular sieve for preventing water vapor from passing through, and the water removal assembly is configured for absorbing the water vapor.

A heat transfer device such as a heat sink includes one or more fins for dissipating heat received from a heat source, such as an integrated circuit or other electronic component. A thermosiphon component including a tube that defines a closed, continuous loop and contains a working fluid is attached to a face of a corresponding fin and is arranged to operate as a two-phase thermosiphon to transfer heat across areas of the fin. The heat transfer may equalize temperatures across the fin, enhancing efficiency.

System-level thermal solutions for integrated circuit (IC) die packages including a heat pipe contiguously integrated with base plate material at the hot interface or with heat sink material at the cold interface. Base plate material may be deposited with a high throughput additive manufacturing (HTAM) technique directly upon a surface of the heat pipe to form a base plate suitable for interfacing with an IC die package. The contiguous base plate material may offer low thermal resistance in the absence of any intervening joining material (e.g., solder or brazing filler). Solder or brazing filler may also be eliminated from between a heat sink and a heat pipe by depositing wick material directly upon the heat sink with an HTAM technique. The wick material may be then enclosed by attaching a preformed half-open tube.

A heat exchanger for cooling a heat-generating component includes first and second plates, each having a core layer of a first metal and an inner clad layer of a lower melting second metal, which is inert to the working fluid contained in a fluid chamber of the heat exchanger. The outer peripheral sealing surfaces of the first and second plates are joined by welding, wherein the weld joint is fluidly isolated from the fluid chamber by a layer of the second metal in an area adjacent to the weld joint. In some embodiments, the heat exchanger includes liquid flow passages and primary and secondary gas flow passages, each secondary passage providing communication between primary gas flow passages. The gas and liquid flow passages may be defined by a wick material having hydrophilic areas and non-wicking areas of reduced thickness. A method of manufacturing is also disclosed.

A loop heat pipe includes a metal layer stack of two outermost metal layers and intermediate metal layers stacked between the two outermost metal layers. The metal layer stack includes an evaporator, a condenser, a vapor pipe, a liquid pipe, and an inlet. The metal layer stack forms a flow passage that circulates the working fluid through the evaporator, the vapor pipe, the condenser, and the liquid pipe. At least one of the two outermost metal layers includes a thin wall portion that forms a portion of a wall of the vapor pipe in the flow passage.

A thermally conductive pipe includes a pipe of which both end portions are closed, a working liquid that is sealed inside the pipe and vaporizes and liquefies, and a liquid transfer unit that exists along a longitudinal direction inside the pipe and transfers the liquefied working liquid at least in the longitudinal direction, in which the liquid transfer unit has, in a case of being viewed in a cross section of the pipe, which is orthogonal to the longitudinal direction, a first liquid transfer unit that is in contact with at least a partial range of an inner wall surface of the pipe and a second liquid transfer unit that is not in contact with the inner wall surface of the pipe and the first liquid transfer unit.

A heat exchanger includes: a baseplate having a first side and a second side opposite the first side, the first side being coupled to a thermosiphon, one or more electronic components being mounted on the second side. The baseplate has a two-phase heat spreading structure. In an embodiment, the heat exchanger includes a thermosiphon.

A heat pipe operating noiselessly by preventing, or reducing the effects of, the mixing of working fluid at different temperatures includes a hollow tube, a capillary structure, a working fluid, and a bushing. The porous capillary structure able to carry the fluid is disposed on an inner wall of the tube. The bushing is hollow, and the bushing is disposed on a surface of the capillary structure away from the tube. The heat pipe is divided into evaporation, adiabatic, and condensation sections, the capillary structure being at all sections. The working fluid is disposed in the capillary structure of the evaporation section, the bushing is disposed on a side of the capillary structure of the adiabatic section.