Heat exchangers are manufactured by three-dimensional (3D) printers by printing subsequent layers of a material in a print direction. The heat exchangers include one or more tubes. The one or more tubes are configured to transport a fluid to be heated or cooled. Each of the one or more tubes defines a slope that is within a threshold angle of the print direction. The heat exchangers include a plurality of fins that are each configured to intersect with the one or more tubes while allowing fluid flow between the plurality of fins to heat or cool the fluid. Each fin of the plurality of fins defines a slope that is within a threshold angle of the print direction.

The present invention relates to a capsule type heat conduction column and a method for manufacturing the same. The method comprises the steps of mixing a thermally conductive base material thoroughly, stuffing and compacting the thermally conductive base material into a capsule formed by a first pipe and a second pipe, and sealing the capsule by a plurality of thermal interface materials. Each of the first pipe and the second pipe has a first opening and a second opening at two terminals thereof, and the second opening of the first pipe is assembled to the first opening of the second pipe.

An electronic device can include a housing and a support component joined to the housing. The support component can include a thermal conduction layer defining a first surface and a second surface opposite the first surface. The support component can also include a first support layer overlying the first surface and a second support layer overlying the second surface. A ratio of the thickness of the thermal conduction layer to the combined thickness of the first support layer and the second support layer can be at least 1.5.

A vapor chamber that includes a housing having a first sheet and a second sheet facing each other, wherein at least a part of an outer edge of the housing has a step shape in which an end portion of the second sheet is positioned inside an end portion of the first sheet, and the housing has a bonded portion inside the end portion of the second sheet where the first sheet and the second sheet are bonded to each other; a protective film covering a boundary between the end portion of the second sheet and the first sheet at the step shape; a working fluid enclosed in the housing, and a wick on an inner wall surface of the first sheet or the second sheet.

A device for forming inside three-dimensional finned tube by multi-edge ploughing and extruding, comprises a machine frame, a machine head, a supporting mechanism, an axial feeding mechanism and a cutter assembly for forming inside fins. The machine head, the supporting mechanism and the axial feeding mechanism are axially mounted on the machine frame in sequence. The cutter assembly for forming inside fins is mounted on the feeding mechanism. One end of a metal tube to be machined for forming inside three-dimensional fins is clamped on a chunk of a rotary main shaft of the machine head, and the other end thereof is placed on the supporting mechanism. The rotary main shaft of the machine head provides the rotation power for the metal tube, and the axial feeding mechanism drives the cutter assembly to move linearly along a coaxial line of the metal tube and the cutter assembly.

A stacked tube heat exchanger consisting of tubes that are affixed to a header or headers that are additively manufactured.

In one aspect, a composite material is disclosed herein that includes graphene platelets dispersed in a matrix. In some cases, the graphene platelets are randomly oriented within the matrix. The composite material can provide improved thermal conductivity and may be formed into heat spreaders or other thermal management devices to provide improved cooling to electronic, electrical components and semiconductor devices.

A thermoelectric conversion module includes a thermoelectric conversion element, a container, a heat storage material accommodated in the container, and a first heat transfer member thermally coupled to one side of the thermoelectric conversion element and thermally coupled to the heat storage material, wherein the first heat transfer member includes a portion made of a solid-solid phase transition system heat storage material having a thermal conductivity higher than a thermal conductivity of the heat storage material and having a transition temperature different from a transition temperature of the heat storage material.

Embodiments disclose a flexible connection of a metallic extruded profile to a connecting body for cooling electrical components. A heat exchanger for an electrical component comprises a metallic extruded profile having at least one channel for a cooling agent to flow through, the metallic extruded profile including an outer circumferential surface and a first end, a non-metallic connecting body including an accommodating region for receiving the first end of the metallic extruded profile at a first opening corresponding to a cross-section of the first end, the first opening having an inner circumferential surface, and a bonding layer between the outer circumferential surface of the first end received in the accommodating region and the inner circumferential surface of the opening. The bonding layer is configured to establish a mechanically flexible bond between the metallic extruded profile and the non-metallic connecting body. Embodiments further disclose a production method for a heat exchanger.

A cooling device including an encapsulated phase change porous layer that exhibits an increased heat capacity is disclosed. The encapsulated phase change porous layer may include a sintered porous layer, a phase change material formed over the sintered porous layer, and an encapsulation material formed over the phase change material. The encapsulation material may encapsulate the phase change material between the encapsulation material and the sintered porous layer and retain the phase change material between the encapsulation material and the sintered porous layer when a fluid is flowed through or in contact with the encapsulated phase change porous layer.