Patent classifications
F28F2275/067
Microchannel expanded heat exchanger
A microchannel heat exchanger (800) is manufactured by bonding a first sheet (802a) of material and a second sheet (802b) of material in a first connection pattern for integral formation of a core portion (801) and a manifold portion (808) for the first and second sheets (802a, 802b) of material. A third sheet (802c) of material is then superposed on to the second sheet (802b) of material and bonded in a second connection pattern to the second sheet of material for integral formation of the core portion (801) and the manifold portion (808) for the second and third sheets (802b, 802c) of material. The second and third sheets (802b, 802c) of material are bonded without bonding the second sheet (802b) of the material to the first sheet (802a) of material. The core portion (801) and the manifold portion (808) of the heat exchanger (800) are thus integrally created. The interstices between the first, second, and third sheets (802a, 802b, 802c) of material are then expanded to create fluid flow channels (806). This method can also be used to create a heat sink. The bonding method may be a form of laser welding where an opaque sheet absorbs the laser energy and the heat conducts through the top sheet to the sheet immediately below, but does not cause bonding with subsequent sheets below.
TUBE BUNDLE HEAT EXCHANGER
A tube bundle heat exchanger has tubes which are held at each side in tube plates or oval-tube collecting-tube plates and are connected to these in each case by means of a weld seam. The connection of the tubes to the inlet-side tube plate or oval-tube collecting-tube plate is formed in each case by means of a conical and/or trumpet-shaped transition piece. The cross section of the transition piece reduces as viewed in the gas flow direction in such a way that the inlet-side end, as viewed in the gas flow direction, of the transition piece is connected in a buttjoint to the tube plate or oval-tube collecting-tube plate. The inner and outer contours of the transition piece and of the welded connection region are formed without gaps and corners to the tube plate or oval tube collecting-tube plate and so as to be straight and/or with a radius, measured from the outer contour, of at least 5 mm.
Tube bundle heat exchanger
A tube bundle heat exchanger has tubes which are held at each side in tube plates or oval-tube collecting-tube plates and are connected to these in each case by means of a weld seam. The connection of the tubes to the inlet-side tube plate or oval-tube collecting-tube plate is formed in each case by means of a conical and/or trumpet-shaped transition piece. The cross section of the transition piece reduces as viewed in the gas flow direction in such a way that the inlet-side end, as viewed in the gas flow direction, of the transition piece is connected in a butt joint to the tube plate or oval-tube collecting-tube plate. The inner and outer contours of the transition piece and of the welded connection region are formed without gaps and corners to the tube plate or oval tube collecting-tube plate and so as to be straight and/or with a radius, measured from the outer contour, of at least 5 mm.
HEAT SINK STRUCTURE AND MANUFACTURING METHOD THEREOF
Provided are a heat sink and a manufacturing method thereof, wherein a heat sink body and a plurality of heat dissipation fins are each manufactured separately, and then the plurality of heat dissipation fins are fixed to the heat sink body by laser welding to form the plurality of heat dissipation fins in a plate shape that is thinner and longer than the heat sink body to provide a sufficient heat dissipation surface and thereby improve heat dissipation efficiency. To this end, the heat sink structure according to the present invention comprises: a heat sink body that has, on one side, a mounting surface on which a product from which heat is to be dissipated is located, and has, on the other side, a heat dissipation surface for dissipating heat; and a plurality of heat dissipation fins which are positioned upright on the heat dissipation surface of the heat sink body and coupled thereto by laser welding.
Systems and Methods For Assembling Liquid Desiccant Heat Exchange Structures Using Controlled Multilayer Welding
Methods of assembling multilayer heat exchange structures. An example method includes attaching an outer layer to a fluid isolation sheet such that a first fluid channel is defined between the outer layer and the fluid isolation sheet; and selectively attaching the fluid isolation sheet, with the outer layer attached thereto, to a structure defining a second fluid channel that is separated from the first fluid channel by the fluid isolation sheet, wherein an internal seal is selectively formed between the fluid isolation sheet and the structure without forming a seal between the outer layer and the fluid isolation sheet.
Tube bundle heat exchanger
A tube bundle heat exchanger having a tube sheet, an outer shell and an interior. The heat exchanger includes a tube bundle having tubes located in the interior for fluid flow. The tubes have outside ribs and a channel is formed between adjacent ribs. The tube sheet has openings as passage points. Outer fins of the tubes project into the openings, and a joint gap is formed between an inner surface defining the opening and the outer fins of a tube located therein. The tubes are bonded to the tube sheet by joining material with the involvement of the outer fins. The bond is only formed in a first portion of the opening. The first portion is filled with joining material such that a second portion of the opening remains which is not filled with joining material, and the tube has outer fins adjacent the second portion.
THREE DIMENSIONAL HEAT DISSIPATION DEVICE, MANUFACTURING METHOD THEREOF, AND SHAPING TOOL
A manufacturing method of three dimensional heat dissipation device includes a step of manufacturing a thermally conductive casing, a step of manufacturing a preliminary three dimensional heat dissipation device and a step of manufacturing a final three dimensional heat dissipation device. The step of manufacturing a thermally conductive casing is to manufacture the thermally conductive casing with an airtight chamber. The step of manufacturing a preliminary three dimensional heat dissipation device is to install at least one round heat pipe on the thermally conductive casing to form the preliminary three dimensional heat dissipation device. The step of manufacturing a final three dimensional heat dissipation device is to fix the preliminary three dimensional heat dissipation device and shape the round heat pipe to a flat heat pipe via a shaping tool so as to form the final three dimensional heat dissipation device.
ACTIVE HEAT DISSIPATION APPARATUS
The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, in which the refrigerant flow space includes a first refrigerant flow path including a press-fitting end positioned adjacent to a press-fitting portion provided on a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having upper and lower ends coupled in a gravitational direction or coupled to be inclined with respect to the gravitational direction with respect to the press-fitting portion to define a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of strength reinforcement portions formed in a condensation zone other than the first refrigerant flow path and disposed and spaced apart from one another in a predetermined pattern to guide a flow of a liquid refrigerant condensed in the condensation zone.
Microtube heat exchanger devices, systems and methods
A microtube heat exchanger is disclosed, including two end plates with an array of holes or openings and an array of microtubes disposed in the array of openings between the two end plates. The heat exchanger can be used in environmental control systems, including systems for aerospace applications.
MANUFACTURING METHOD OF VAPOR CHAMBER
The present application relates to a manufacturing method of a vapor chamber, including processing an upper cover and a lower cover into predetermined shapes; fixing a capillary structure on a surface of an inner chamber of the lower cover; injecting a working liquid into the capillary structure; and fixing the upper cover and the lower cover in a vacuum environment. The present application has an effect of more accurately control of a quality of the working liquid.