Patent classifications
A01N33/20
Enhancing the antimicrobial activity of biocides with polymers
Disclosed are compositions comprising a) an antimicrobial agent, which is selected from the group consisting of biocides containing halogen atoms and/or containing phenolic moieties, formic acid, chlorine dioxide, chlorine dioxide generating compounds, dialdehydes; components containing an antimicrobial metal such as antimicrobial silver, and b) a polyamine, especially a polyethylenimine. The polyamine is effective as a booster for the antimicrobial agent.
Enhancing the antimicrobial activity of biocides with polymers
Disclosed are compositions comprising a) an antimicrobial agent, which is selected from the group consisting of biocides containing halogen atoms and/or containing phenolic moieties, formic acid, chlorine dioxide, chlorine dioxide generating compounds, dialdehydes; components containing an antimicrobial metal such as antimicrobial silver, and b) a polyamine, especially a polyethylenimine. The polyamine is effective as a booster for the antimicrobial agent.
MICROBICIDAL COMPOSITION
A synergistic microbicidal composition having two components. The first component is a nonionic surfactant with structure: R.sup.2O(CH.sub.2CH(CH.sub.3)O).sub.3(CH.sub.2CH.sub.2O).sub.7H, where R.sup.2 is a mixture of C.sub.8-C.sub.14 linear alkyl groups. The second component is tris(hydroxymethyl)nitromethane. The weight ratio of the nonionic surfactant to tris(hydroxymethyl)nitromethane is from 1:0.16 to 1:1.8286.
MICROBICIDAL COMPOSITION
A synergistic microbicidal composition having two components. The first component is a nonionic surfactant with structure: R.sup.2O(CH.sub.2CH(CH.sub.3)O).sub.3(CH.sub.2CH.sub.2O).sub.7H, where R.sup.2 is a mixture of C.sub.8-C.sub.14 linear alkyl groups. The second component is tris(hydroxymethyl)nitromethane. The weight ratio of the nonionic surfactant to tris(hydroxymethyl)nitromethane is from 1:0.16 to 1:1.8286.
MICROBICIDAL COMPOSITION
A synergistic microbicidal composition having two components. The first component is a nonionic surfactant with structure: R.sup.2O(CH.sub.2CH(CH.sub.3)O).sub.3(CH.sub.2CH.sub.2O).sub.7H, where R.sup.2 is a mixture of C.sub.8-C.sub.14 linear alkyl groups. The second component is tris(hydroxymethyl)nitromethane. The weight ratio of the nonionic surfactant to tris(hydroxymethyl)nitromethane is from 1:0.16 to 1:1.8286.
Enhancing the antimicrobial activity of biocides with polymers
Disclosed are compositions comprising a) an antimicrobial agent, which is selected from the group consisting of biocides containing halogen atoms and/or containing phenolic moieties, formic acid, chlorine dioxide, chlorine dioxide generating compounds, dialdehydes; components containing an antimicrobial metal such as antimicrobial silver, and b) a polyamine, especially a polyethylenimine. The polyamine is effective as a booster for the antimicrobial agent.
Enhancing the antimicrobial activity of biocides with polymers
Disclosed are compositions comprising a) an antimicrobial agent, which is selected from the group consisting of biocides containing halogen atoms and/or containing phenolic moieties, formic acid, chlorine dioxide, chlorine dioxide generating compounds, dialdehydes; components containing an antimicrobial metal such as antimicrobial silver, and b) a polyamine, especially a polyethylenimine. The polyamine is effective as a booster for the antimicrobial agent.
PESTICIDAL MIXTURES COMPRISING A PYRAZOLE COMPOUND
Pesticidal mixtures comprising as active compounds 1) 1-[(1RS)-1,2-dimethylpropyl]-N-ethyl-5-methyl-N-pyridazin-4-yl-1H-pyrazole-4-carboxamide and 2) at least one further compound B selected from B.1) Succinate dehydrogenase inhibitors as defined in the specification; B.2) Inhibitors of oxysterol binding protein as defined in the specification; B.3) Inhibitors of complex III at Qi site selected from: a) florylpicoxamid, and b) fenpicox-amid; B.4) Strobilurins as defined in the specification; B.5) Inhibitors of C14-demethylase in sterol biosynthesis as defined in the specification; B.6) Inhibitors of cell division and cytoskeleton as defined in the specification, B.7) Other compounds of unknown mode of action as defined in the specification; and B.8) N-[[2-fluoro-4-[(2S,3S)-2-hydroxy-3-(3,4,5-trichlorophenyl)-3-(trifluoromethyl)pyrrolidin-1-yl]phenyl]methyl]cyclopropanecarboxamide; wherein component 1) and component 2) are present in a weight ratio of from 1000:1 to 1:1000; methods and use of these mixtures for combating invertebrate pests such as insects, arachnids, nematodes and/or harmful fungi in and on plants, and for protecting such plants being infested with pests and/or harmful fungi.
PESTICIDAL MIXTURES COMPRISING A PYRAZOLE COMPOUND
Pesticidal mixtures comprising as active compounds 1) 1-[(1RS)-1,2-dimethylpropyl]-N-ethyl-5-methyl-N-pyridazin-4-yl-1H-pyrazole-4-carboxamide and 2) at least one further compound B selected from B.1) Succinate dehydrogenase inhibitors as defined in the specification; B.2) Inhibitors of oxysterol binding protein as defined in the specification; B.3) Inhibitors of complex III at Qi site selected from: a) florylpicoxamid, and b) fenpicox-amid; B.4) Strobilurins as defined in the specification; B.5) Inhibitors of C14-demethylase in sterol biosynthesis as defined in the specification; B.6) Inhibitors of cell division and cytoskeleton as defined in the specification, B.7) Other compounds of unknown mode of action as defined in the specification; and B.8) N-[[2-fluoro-4-[(2S,3S)-2-hydroxy-3-(3,4,5-trichlorophenyl)-3-(trifluoromethyl)pyrrolidin-1-yl]phenyl]methyl]cyclopropanecarboxamide; wherein component 1) and component 2) are present in a weight ratio of from 1000:1 to 1:1000; methods and use of these mixtures for combating invertebrate pests such as insects, arachnids, nematodes and/or harmful fungi in and on plants, and for protecting such plants being infested with pests and/or harmful fungi.
CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN PATTERN WAFER AND METHOD OF POLISHING TUNGSTEN PATTERN WAFER USING THE SAME
A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer, the CMP slurry composition including a solvent, the solvent being a polar solvent or a non-polar solvent; an abrasive agent; and a biocide, wherein the abrasive agent includes silica modified with a silane containing two nitrogen atoms or silica modified with a silane containing three nitrogen atoms, the biocide includes a compound of Formula 3:
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