The invention relates to a cooler or cooler body which in particular is adapted for cooling electronic structural units or assemblies.

Cooling element for vacuum pump comprising a base element wherein by the base element an internal void is defined. Further, an inlet is connected to the base element and is in fluent connection with the void. Further, an outlet is connected to the base element and in fluent connection with the void such that a coolant can flow from the inlet through the void to the outlet to dissipated heat. Therein, the base element is connected to a housing of a vacuum pump.

A method of manufacturing a heat exchanger is provided. The method includes forming a first substrate by additively manufacturing a body defining a first outer surface and a second outer surface opposite the first outer surface, a first partial fluid flow channel formed within the first outer surface, a second partial fluid flow channel formed within the second outer surface, and at least one internal fluid flow channel completely formed within the body, and coupling the first substrate to a second substrate including a partial fluid flow channel formed within a surface of the second substrate such that the first partial fluid flow channel of the first substrate and the partial fluid flow channel of the second substrate combine to form a combined fluid flow channel.

A heat exchanger system is provided and includes a heat sink, fins arrayed on a central region of the heat sink to form channels between adjacent fins and an integrated blower. Each of the fins extends radially outwardly from the central region and has a height that increases with increasing distance from the central region. The integrated blower is disposed at the central region to generate flows of coolant directed into and through the channels.

A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.

According to various aspects, exemplary embodiments are provided of heat exchangers and applications. In an exemplary embodiment, a heat exchanger can include at least a first feature array and a second feature array, a channel in an interior of the heat exchanger, through which a fluid can flov, an inlet for the fluid to enter the channel, an outlet for the fluid to exit the channel. The channel may include at least one surface and said first feature array and said second feature array are positioned on the at least one surface of the channel, the fluid configured to flow from said inlet, through said channel to said outlet, and the first and second feature arrays have different densities.

A heat dissipation device includes a base, fins and strip-shaped plates. The fins protrude side by side from the base, and the fins respectively include first end edges and second end edges opposite to each other. The first end edges are connected to the base. The strip-shaped plates are parallel to the base and connected to at least a part of the second end edges of the fins, and strip-shaped openings are formed between the strip-shaped plates. The base, the fins and the strip-shaped plates collectively surround chambers in a non-closed manner, and each of the strip-shaped openings is connected to the corresponding chamber. A distance between two adjacent fins of the fins is S, a width of any one of the strip-shaped openings is d, and d/S is between 0.01 and 0.4.

A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

A heat exchanger layer having an inlet side, IN, where a medium enters the layer and an outlet side, OUT, where the medium exits the layer, and a plurality of fins defining a plurality of flow channels for the medium from the inlet side to the outlet side. Each fin has a leading edge adjacent the inlet side and a trailing edge adjacent the outlet side, and wherein the leading edge of a subset of the fins is thicker than the rest of the fin, and the leading edge of the fins intermediate the fins of the subset of fins is recessed with respect to the inlet side compared to the leading edge of the fins of the subset of fins.

A data center cooling system includes a modular heat sink and a working fluid. The modular heat sink includes an evaporator configured to thermally contact a heat-generating electronic device to receive heat from the data center heat-generating electronic device; a condenser coupled to the evaporator and configured to transfer the heat from the heat-generating electronic device into a cooling fluid; and a plurality of transport tubes that fluidly couple the evaporator and the condenser, at least one of the plurality of transport tubes including an open end positioned in the evaporator and a closed end positioned in the condenser. The working fluid vaporizes in the evaporator based on receipt of the heat from the heat-generating electronic device, and circulates, in vapor phase, from the evaporator to the condenser in the transport member, and circulates, in liquid phase, from the condenser to the evaporator.