A method of inspecting flatness of substrate is provided and includes providing a substrate. N first inspecting points are selected from the surface of the substrate along a first straight line, where the coordinate of the i-th first inspecting point is (X.sub.i,Y.sub.i,Z.sub.i). By using a formula “D=Σ.sub.i=1.sup.N−1√{square root over ((X.sub.i+1−X.sub.i).sup.2+(Y.sub.i+1−Y.sub.i).sup.2+(Z.sub.i+1−Z.sub.i).sup.2)}”, a first measurement length D is calculated. By using a formula “F=(D−S)/S”, a first flatness index F is calculated. S is the horizontal distance between 1.sup.st first inspecting point and N-th first inspecting point. When the first flatness index F is larger than a first threshold, the substrate is determined to be unqualified.

A method of inspecting flatness of substrate is provided and includes providing a substrate. N first inspecting points are selected from the surface of the substrate along a first straight line, where the coordinate of the i-th first inspecting point is (X.sub.i,Y.sub.i,Z.sub.i). By using a formula “D=Σ.sub.i=1.sup.N−1√{square root over ((X.sub.i+1−X.sub.i).sup.2+(Y.sub.i+1−Y.sub.i).sup.2+(Z.sub.i+1−Z.sub.i).sup.2)}”, a first measurement length D is calculated. By using a formula “F=(D−S)/S”, a first flatness index F is calculated. S is the horizontal distance between 1.sup.st first inspecting point and N-th first inspecting point. When the first flatness index F is larger than a first threshold, the substrate is determined to be unqualified.

Implementations disclosed describe an optical inspection device comprising a source of light to direct a light beam to a location on a surface of a wafer, the wafer being transported from a processing chamber, wherein the light beam is to generate, a reflected light, an optical sensor to collect a first data representative of a direction of the first reflected light, collect a second data representative of a plurality of values characterizing intensity of the reflected light at a corresponding one of a plurality of wavelengths, and a processing device, in communication with the optical sensor, to determine, using the first data, a position of the surface of the wafer; retrieve calibration data, and determine, using the position of the surface of the wafer, the second data, and the calibration data, a characteristic representative of a quality of the wafer.

A method for monitoring flatness of a wafer table includes: acquiring a yield and original focus data of a wafer in real time; obtaining an edge flatness curve of a wafer table based on the original focus data; obtaining a yield curve of the wafer based on the yield of the wafer; obtaining a trend diagram of the edge flatness and the yield over time based on the edge flatness curve and the yield curve; and determining, based on the trend diagram, an edge flatness value of the wafer table when the wafer table is replaced.

Provided are a damage diagram creation method, a damage diagram creation device, a damage diagram creation system, and a recording medium capable of detecting damage with high accuracy based on a plurality of images acquired by subjecting a subject to split imaging.

In a damage diagram creation method, damage of a subject is detected from each image (each image in a state of being not composed) constituting a plurality of images (a plurality of images acquired by subjecting the subject to split imaging), and thus, damage detection performance is not deteriorated due to deterioration of image quality in an overlapping area. Therefore, it is possible to detect damage with high accuracy based on a plurality of images acquired by subjecting the subject to split imaging. Detection results for the respective images can be composed using a composition parameter calculated based on correspondence points between the images.

The present invention is directed to a system for measuring surface flatness, deformation and/or coefficient of thermal expansion (CTE) of a specimen comprising an image capture and analysis processing calibration means for performing image capture and analysis processing calibration of said system, a measuring means for measuring surface flatness of a specimen in a specimen holder, a heating means for heating said sample holder with a predetermined profile, and a control means for providing the predetermined heating profile onto the surface of said specimen and controlling operations of said image capture and analysis processing calibration means, said measuring means, and said heating means.

A light source projects a light beam. An interferometer includes a splitting unit that splits the light beam. The interferometer generates interference beams with the respective split light beams. Each of the interference beam is generated by interference between a measurement beam radiated toward the measurement target and reflected at the measurement beam and a reference beam passing through an optical path. A light-receiving unit receives the interference beams. A processor calculates a distance to the measurement target by associating at least one detected peak with at least one of the spots in accordance with a mirror surface mode or a rough surface mode. The optical path length difference is made different among the split light beams. In the mirror surface mode, the processor uses a distance calculated based on a peak corresponding to a spot for which the optical path length difference is shortest.

A metal substrate provided with a surface texture wherein the Maximum Zero Normalised Auto Correlation (MZNAC) of the surface texture is in the range of 0.2-0.8, as well as a method to apply such surface textures on a metal substrate.

The invention relates to a method for checking, prior to welding, two components made of polymer material, the method comprising a step of determining respective values relating to the roughness of the components, a step of determining respective values relating to the cleanliness of the components, a step of determining respective values relating to the temperature of the components and automated means for halting progression to a subsequent method step should the predetermined conditions not be met.

The invention relates to a device (1) for measuring the surface condition of a component (4, 5, 6). Said device (1) comprises a measurement member (2) comprising at least one sensor (21, 22, 23) capable of measuring at least one datum relating to the surface condition of the component (4, 5, 6) and at least one transmitter (24) capable of transmitting the datum from the sensor (21, 22, 23). The measurement device (1) also comprises a support (3) for the measurement member (2), the support comprising means for connecting same to the component (4, 5, 6).