An adaptive optical element for microlithography comprises at least one manipulator for changing the shape of an optical surface of the optical element. The manipulator comprises a dielectric medium which is deformable via an electric field, work electrodes for generating the electric field in the dielectric medium, and a measuring electrode for measuring temperature. The measuring electrode is arranged in a direct assemblage with the dielectric medium. The measuring electrode has a temperature-dependent resistance.

An adaptive optical element for microlithography comprises at least one manipulator for changing the shape of an optical surface of the optical element. The manipulator comprises a dielectric medium which is deformable via an electric field, work electrodes for generating the electric field in the dielectric medium, and a measuring electrode for measuring temperature. The measuring electrode is arranged in a direct assemblage with the dielectric medium. The measuring electrode has a temperature-dependent resistance.

A method for temperature measurement used in an RF processing apparatus for semiconductor includes generating by electrodes an RF signal sequence having multiple discontinuous RF signals that are separated by a time interval; and generating a temperature sensing signal by a thermal sensor during the time interval.

A method for temperature measurement used in an RF processing apparatus for semiconductor includes generating by electrodes an RF signal sequence having multiple discontinuous RF signals that are separated by a time interval; and generating a temperature sensing signal by a thermal sensor during the time interval.

An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

The present disclosure relates to an apparatus for determining and/or monitoring a process variable of a medium, comprising at least one sensor element arranged in a sensor head for determining and/or monitoring the process variable, wherein an internal volume of the sensor head is filled at least partially with a filler. The filler includes at least one fill material, for which at at least one predeterminable phase transformation temperature a phase change occurs, in which the material remains in the solid state, wherein the fill material is in a first phase state when a temperature of the fill material is less than the phase transformation temperature, and wherein the fill material is in a second phase state when the temperature of the fill material is greater than the phase transformation temperature.

The present disclosure relates to an apparatus for determining and/or monitoring a process variable of a medium, comprising at least one sensor element arranged in a sensor head for determining and/or monitoring the process variable, wherein an internal volume of the sensor head is filled at least partially with a filler. The filler includes at least one fill material, for which at at least one predeterminable phase transformation temperature a phase change occurs, in which the material remains in the solid state, wherein the fill material is in a first phase state when a temperature of the fill material is less than the phase transformation temperature, and wherein the fill material is in a second phase state when the temperature of the fill material is greater than the phase transformation temperature.

A measurement device for measuring a temperature prevailing inside a container is disclosed. The measurement device comprises: a process connector including a connector body and a fastener configured to be mounted onto a corresponding counterpart surrounding an opening of the container; a measurement unit secured in an opening of the process connector such that a front surface of the measurement unit is facing into the container when the measurement device is mounted on the container; the measurement unit including or consisting of: a heat pipe and a temperature sensor; the heat pipe having two thermally conductive interfaces including a front interface exposable to the temperature to be measured and a second interface in thermal contact with the temperature sensor; and a thermal insulation surrounding the heat pipe and the temperature sensor.

A measurement device for measuring a temperature prevailing inside a container is disclosed. The measurement device comprises: a process connector including a connector body and a fastener configured to be mounted onto a corresponding counterpart surrounding an opening of the container; a measurement unit secured in an opening of the process connector such that a front surface of the measurement unit is facing into the container when the measurement device is mounted on the container; the measurement unit including or consisting of: a heat pipe and a temperature sensor; the heat pipe having two thermally conductive interfaces including a front interface exposable to the temperature to be measured and a second interface in thermal contact with the temperature sensor; and a thermal insulation surrounding the heat pipe and the temperature sensor.

A temperature sensor assembly for measuring a gas temperature in a gas flow stream includes a first substrate having a first surface configured to be connected to a thermally conductive structure in a gas path, a first temperature sensor mounted to the first substrate a first distance from the first surface, and a second temperature sensor mounted to the first substrate a second distance from the first surface. The second distance is less than the first distance. The first and second temperature sensors are arranged along a temperature gradient.