An integrated device package sized and shaped to fit in a small space, such as within a body lumen or cavity of a human patient, is disclosed. The integrated device package includes a package substrate and integrated device dies. The first and second integrated device dies are angled relative to one another about the longitudinal axis by a fixed non-parallel angle.

A magnetic sensor includes an MR element and a support member. A top surface of the support member includes an inclined portion. The MR element includes an MR element main body, a lower electrode, and an upper electrode. The lower electrode includes a first end closest to a lower end of the inclined portion and a second end closest to an upper end of the inclined portion. The MR element main body is located at a position closer to the second end than to the first end.

A semiconductor package includes a leadframe forming a plurality of leads with a die attach site, a semiconductor die including a set of die contacts mounted to the die attach site in a flip chip configuration with each die contact of the set of die contacts electrically connected to leadframe via one of a set of solder joints, a set of solder joint capsules covering each of the set of solder joints against the leadframe, a clip mounted to the leadframe over the semiconductor die with a clip solder joint. The solder joint capsules restrict flow of the solder joints of the semiconductor die contacts in the flip chip configuration such that the solder remains in place if remelted during later clip solder reflow.

A scanning element for an inductive angle-measuring device includes a printed circuit board which has exciter lines and receiver lines, and an electronic circuit. The printed circuit board is arranged in a housing, the housing having a guideway into which the printed circuit board is inserted. The guideway is formed such that the printed circuit board is positioned with form locking in a direction parallel to an axis, and by being inserted into the guideway, the printed circuit board is deformed along a circle line which is curved about the axis.

A sensor includes a lead frame having a first surface, a second opposing surface, and a plurality of leads and a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface. The sensor further includes a non-conductive mold material enclosing the die and at least a portion of the lead frame, a conductive coil secured to the non-conductive mold material, a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and an element disposed in the central region of the mold material.

A magneto-optical defect center magnetometer, such as a diamond nitrogen vacancy (DNV) magnetometer, can include an excitation source, a magneto-optical defect center element, a collection device, a top plate, a bottom plate, and a printed circuit board. The excitation source, the magneto-optical defect center element, and the collection device are each mounted to the printed circuit board

Provided are a low-temperature cooling apparatus and a superconducting quantum interference device (SQUID) sensor module. The low-temperature cooling apparatus includes an outer container; an inner container disposed inside the outer container, the inner container including a neck portion having a first diameter and a body portion having a second diameter greater than the first diameter; an insert inserted into the neck portion of the inner container; and a plurality of SQUID sensor modules inserted into the body portion of the inner container. Each of the SQUID sensor modules is in the form of a fan-shaped pillar and is fixedly coupled with an inner bottom plate of the inner container.

A magnetic field measurement system includes a wearable device having a plurality of wearable sensor units. Each wearable sensor unit includes a plurality of magnetometers and a magnetic field generator configured to generate a compensation magnetic field configured to actively shield the plurality magnetometers from ambient background magnetic fields. A strength of a fringe magnetic field generated by the magnetic field generator of each of the wearable sensor units is less than a predetermined value at the plurality of magnetometers of each wearable sensor unit included in the plurality of wearable sensor units.

A magnetic field sensor for measuring magnetic field of a current applied to a lower electrode defined within a plasma chamber includes a conductor element disposed along a length of a tubular housing. A plurality of slots is defined on one side of the tubular housing to expose the conductor element.

A sensor includes: a receptacle connectable to an external plug; a second housing accommodating at least part of the receptacle; a main substrate on which an electronic component used for sensing is mounted; a shield film covering at least part of the main substrate and shielding an electromagnetic wave emitted from the main substrate and/or an electromagnetic wave to penetrate the main substrate from the outside; a first housing accommodating at least part of the main substrate and at least part of the shield film; a flexible substrate connecting the main substrate and the receptacle; and a protection member abutting on an end of the shield film from the side opposite to the main substrate, the end of the shield film facing the flexible substrate.