G02B26/08

System, method and apparatus for non-mechanical optical and photonic beam steering
11561451 · 2023-01-24 · ·

An example system includes a bulk steering crystal apparatus having a first lens face and a second concave face. The example bulk steering crystal apparatus further includes a number of steering portions interposed between the first lens face and the second concave face, where each of the steering portions includes a bulk substrate portion including an electro-optical material and a corresponding high-side electrode electrically coupled to the corresponding one of the number of steering portions.

High spatial and temporal resolution synthetic aperture phase microscopy (HISTR-SAPM)

A high spatial and temporal resolution synthetic aperture phase microscopy (HISTR-SAPM) system and methods are provided for sample imaging and metrology. The HISTR-SAPM system includes a sample-illumination path along which a first illumination beam propagates and a reference-beam path along which a second illumination beam propagates. A first digital micromirror device (DMD), a second DMD, and a first scanning objective lens are disposed in the sample-illumination path and at a first side adjacent to the sample. A second scanning objective lens passes the sample information to a beam splitter (BS), where the sample illumination beam and the reference-beam are combined to form an interferogram at a final image plane for imaging the sample. A Fourier spatial spectrum analysis and a synthetic aperture are then used to reconstruct a quantitative phase map of the sample with a high resolution and at a high-speed.

Optical device

Provided is an optical device capable of suppressing variations in the range for scanning light. This optical device comprises: a light source that emits a laser beam; a MEMS mirror that scans the laser beam toward a predetermined range; and a diffraction grating that guides the laser beam to the MEMS mirror by guiding the laser beam in a direction corresponding to the wavelength thereof. The optical device also comprises an MEMS control unit that performs control such that, by employing a change in the optical path of the laser beam caused through the diffraction grating by a change in the wavelength of the laser beam, variations in the scanning range of the laser beam by the MEMS mirror are suppressed.

Mirror via conductivity for DMD pixel

A method includes forming a first aluminum silicon layer on a metal layer and forming a titanium nitride layer (or other titanium-based layer) on a surface of the aluminum-silicon layer opposite the metal layer. The method further includes etching the titanium nitride layer to create a titanium nitride pad and forming a torsion hinge in the metal layer. The titanium nitride pad is on the torsion hinge. The method also includes depositing a sacrificial layer over the torsion hinge and titanium nitride pad, forming a via in the sacrificial layer from a surface of the sacrificial layer opposite the torsion hinge to the titanium nitride pad, depositing a metal mirror layer on a surface of the sacrificial layer opposite the torsion hinge and into the via, and removing the sacrificial layer.

Optical receiving module

An optical receiving module may include: a light transmitting body configured to transmit light; a light incidence part through which light is incident into the light transmitting body; and a plurality of reflectors configured to reflect the light incident from the light incidence part a plurality of times, such that the light is incident toward a light receiver unit.

Sequential beam splitting in a radiation sensing apparatus
11703392 · 2023-07-18 · ·

Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.

Aperture structure for optical windows and devices
11703677 · 2023-07-18 · ·

An aperture structure for a substrate for an optical device includes an optical cavity layer, a light absorbing layer, and a blocking layer. The optical cavity layer includes a dielectric material and is characterized by a refractive index of about 1.4 or greater, as measured at a wavelength of 550 nm. The light absorbing layer includes a metal or a metal alloy and is characterized by an extinction coefficient k of at least 1, as measured at a wavelength of 550 nm. The blocking layer includes a metal or a metal alloy and is characterized by an optical density of at least 3 at each wavelength of light in the range from 400 nm to 700 nm. The aperture structure includes a reflectance of less than 5% at each wavelength of light in the range from 400 nm to 700 nm, as measured through the substrate.

OPTOELECTRONIC COMPONENT COMPRISING, ON A SINGLE SUBSTRATE, AN OPTICAL TRANSDUCER MADE OF A SEMI-CONDUCTOR MATERIAL III-V AND AN OPTICALLY SCANNING MICROELECTROMECHANICAL SYSTEM

An optoelectronic component includes an optical transducer made of III-V semiconductor material and an optical scanning microelectromechanical system comprising a mirror. The optical transducer and the optical scanning microelectromechanical system are produced on a common wafer comprising at least a first layer made of silicon or silicon nitride with a thickness of less than one micron and wherein at least the mirror and its holding springs are produced. In a first variant, the mobile parts of the optical scanning microelectromechanical system are produced in various layers of silicon. In a second variant, the mobile parts of the optical scanning microelectromechanical system are produced in the layer of III-V semiconductor material.

Display spatial brightness control

A system includes a spatial light modulator (SLM) configured to project an image. The system also includes a controller coupled to the SLM. The controller is configured to receive the image and determine a brightness level of the image. The controller is also configured to enforce a brightness limit on the image responsive to the brightness level, to produce a reduced image. The controller is configured to instruct a display to display the reduced image.

MEMS devices comprising spring element and comb drive and associated production methods

A method for producing a MEMS device comprises fabricating a first semiconductor layer and selectively depositing a second semiconductor layer over the first semiconductor layer, wherein the second semiconductor layer comprises a first part composed of monocrystalline semiconductor material and a second part composed of polycrystalline semiconductor material. The method furthermore comprises structuring at least one of the semiconductor layers, wherein the monocrystalline semiconductor material of the first part and underlying material of the first semiconductor layer form a spring element of the MEMS device and the polycrystalline semiconductor material of the second part and underlying material of the first semiconductor layer form at least one part of a comb drive of the MEMS device.