A storage device and a manufacturing method thereof are provided and relate to the technology field of storage. The storage device includes storage a first chip and a second chip. The first chip includes a storage array. The storage array includes at least one storage block. The second chip includes a logic control circuit. The logic control circuit includes a global bit line decoder. The global bit line decoder is electrically connected to the at least one storage block. An occupied area after the first chip and the second chip are stacked can be reduced by constructing the global bit line decoder block constituted by the global bit line decoder in the top view projection area of the second chip, thereby reducing plane occupied space of the storage device. This is beneficial for minimizing the size of the storage device.

A data storage system includes a storage medium including a plurality of columns of memory cells, a storage controller coupled to the storage medium, and data path circuitry including a data bus coupled to the storage controller, the data bus configured to receive a plurality of bytes of data to be written to the plurality of columns of memory cells; a block of data latches having a pitch equal to a first number of bit lines of the plurality of columns of memory cells; and column redundancy circuitry configured to pass the plurality of bytes of data to the block of data latches via the plurality of columns in accordance with a nonconsecutive mapping scheme. The nonconsecutive mapping scheme includes mapping each group of three bytes to two columns by splitting one byte of each group of three bytes into two nibbles.

A processing-in-memory (PIM) device includes a command decoder configured to repeatedly output internal multiplication and accumulation (MAC) operation control signals at a predetermined cycle in response to a MAC operation command received from outside the PIM device, a MAC unit configured to perform MAC operations in response to the internal MAC operation control signals, and an address signal generator configured to repeatedly transmit internal address signals designating storage positions of weight data and vector data that are used for the MAC operations to the MAC unit at the predetermined cycle, based on an address signal received from outside the PIM device.

A processing-in-memory (PIM) device includes a command decoder configured to repeatedly output internal multiplication and accumulation (MAC) operation control signals at a predetermined cycle in response to a MAC operation command received from outside the PIM device, a MAC unit configured to perform MAC operations in response to the internal MAC operation control signals, and an address signal generator configured to repeatedly transmit internal address signals designating storage positions of weight data and vector data that are used for the MAC operations to the MAC unit at the predetermined cycle, based on an address signal received from outside the PIM device.

According to one embodiment, a semiconductor memory device includes a first string unit including a first memory string including a first selection transistor and a first memory cell coupled to the first selection transistor, a second string unit including a second memory string including a second selection transistor and a second memory cell coupled to the second selection transistor, a first select gate line, a second select gate line, a first bit line, a second bit line, and a first word line. Both of the first select gate line and the second select gate line are selected in a first read operation. The first select gate line is selected and the second select gate line is not selected in a second read operation.

A memory system includes a memory controller and a memory. The memory controller selectively operates in a first mode and a second mode. In the first mode, the memory controller transmits a first command continuously during a plurality of clock cycles. In the second mode, the memory controller to mix a second command with the first command and transmit the mixture of the first command and the second command. The memory changes command latch timing depending on the first or second mode.

A memory system includes a memory controller and a memory. The memory controller selectively operates in a first mode and a second mode. In the first mode, the memory controller transmits a first command continuously during a plurality of clock cycles. In the second mode, the memory controller to mix a second command with the first command and transmit the mixture of the first command and the second command. The memory changes command latch timing depending on the first or second mode.

In one embodiment, a non-volatile memory apparatus includes memory tiles comprising a set of main memory tiles in rows and columns, a set of row termination tiles at the ends of the rows, and a set of column termination tiles at the ends of the columns. Each memory tile includes a plurality of decks, with each deck comprising bitlines, wordlines orthogonal to the bitlines, and memory cells between overlapping areas of the bitlines and the wordlines. The bitlines/wordlines include a set of bitlines/wordlines of a first layer that traverse row/column termination tiles and main memory tiles adjacent the row/column termination tiles, with each bitline/wordline of the set of bitlines/wordlines connected to another bitline of a second layer in the termination tile.

In one embodiment, a non-volatile memory apparatus includes memory tiles comprising a set of main memory tiles in rows and columns, a set of row termination tiles at the ends of the rows, and a set of column termination tiles at the ends of the columns. Each memory tile includes a plurality of decks, with each deck comprising bitlines, wordlines orthogonal to the bitlines, and memory cells between overlapping areas of the bitlines and the wordlines. The bitlines/wordlines include a set of bitlines/wordlines of a first layer that traverse row/column termination tiles and main memory tiles adjacent the row/column termination tiles, with each bitline/wordline of the set of bitlines/wordlines connected to another bitline of a second layer in the termination tile.

A system and method comprising a cryogenic adiabatic circuit in a cryogenic environment and a clock generator at a higher temperature, the circuit's clock lines can be connected across the temperature gradient to the clock generator, where the clock generator runs below the frequency that would yield power dissipation equal to the static dissipation of a functionally equivalent CMOS circuit at room temperature, resulting in lower power for the function than possible at room temperature irrespective of the speed of operation.