G11C17/08

ROM CELL WITH TRANSISTOR BODY BIAS CONTROL CIRCUIT

A read-only memory (ROM) includes ROM cells and a bias control circuit for biasing the ROM cells. Each ROM cell includes a set of transistors. The bias control circuit is connected to body terminals of the transistors of each ROM cell to provide a bias voltage. The bias voltage, which is temperature-dependent, is generated based on junction leakages at the body terminals of the transistors. The bias control circuit controls threshold voltages of the transistors using the bias voltage. The use of a temperature-dependent bias voltage to bias the body terminals of the transistors allows for a relatively constant read margin for each ROM cell.

ROM CELL WITH TRANSISTOR BODY BIAS CONTROL CIRCUIT

A read-only memory (ROM) includes ROM cells and a bias control circuit for biasing the ROM cells. Each ROM cell includes a set of transistors. The bias control circuit is connected to body terminals of the transistors of each ROM cell to provide a bias voltage. The bias voltage, which is temperature-dependent, is generated based on junction leakages at the body terminals of the transistors. The bias control circuit controls threshold voltages of the transistors using the bias voltage. The use of a temperature-dependent bias voltage to bias the body terminals of the transistors allows for a relatively constant read margin for each ROM cell.

SRAM/ROM MEMORY RECONFIGURABLE BY SUBSTRATE POLARIZATION

3D microelectronic device provided with several superimposed layers of components with an upper layer comprising one or several memory cells having a SRAM structure and provided with a rear biasing electrode of which the biasing is modified to switch the cells from a ROM mode operating mode to a SRAM mode operating mode (FIG. 2).

SRAM/ROM MEMORY RECONFIGURABLE BY SUBSTRATE POLARIZATION

3D microelectronic device provided with several superimposed layers of components with an upper layer comprising one or several memory cells having a SRAM structure and provided with a rear biasing electrode of which the biasing is modified to switch the cells from a ROM mode operating mode to a SRAM mode operating mode (FIG. 2).

SEMICONDUCTOR DEVICE
20190385683 · 2019-12-19 · ·

A semiconductor device has stored therein a plurality of bits of fixed data. The semiconductor device includes a plurality of memory elements that correspond, respectively, to the plurality of bits of the fixed data, and that acquire, store, and output the value of each bit received at an input terminal of each of the memory elements according to a timing signal. An initialization control unit feeds, to the plurality of memory elements, an initialization signal upon receipt of a fixed data setting signal, each of the plurality of memory elements being initialized to a state of storing a corresponding value represented by a bit of the fixed data according to the initialization signal.

CONFIGURABLE VARIABLE-LENGTH SHIFT REGISTER CIRCUITS
20240045622 · 2024-02-08 · ·

Configurable variable-length shift register circuits include a group of flip-flops connected in a serial configuration. The plurality of flip-flops is connected to a serial data-in line and a clock line. Each flip-flop can include a data input, a clock input configured to receive a clock signal from the clock line, and a data output. The plurality of flip-flops can include a serial data-out line. The circuit includes a plurality of multiplexers connected to the plurality of flip-flops to enable a desired number of flip-flops for an application. A nonvolatile memory can be connected to the plurality of multiplexers and configured to receive a register-length indication, where the register-length indication corresponds to a selected number of flip-flops selected for enablement for a given application.

High reliability OTP memory by using of voltage isolation in series

A high-reliability one-time programmable memory adopting series high voltage partition, which relates to integrated circuit technology and comprises a first MOS tube, a second MOS tube and an anti-fuse element, wherein a gate end of the first MOS tube is connected to a second connecting line (WS), a first connecting end of the first MOS tube is connected to a gate end of the second MOS tube and a voltage limiting device, and a second connecting end of the first MOS tube is connected to a third connecting line (BL); a first connecting end of the second MOS tube is connected to a fourth connecting line (BR), a second connecting end of the second MOS tube is connected to the third connecting line (BL), and a gate end of the second MOS tube is connected to the voltage limiting device and the second connecting end of the first MOS tube.

NON-VOLATILE MEMORY DEVICES AND SYSTEMS WITH READ-ONLY MEMORY FEATURES AND METHODS FOR OPERATING THE SAME

Memory devices, systems including memory devices, and methods of operating memory devices and systems are provided, in which at least a subset of a non-volatile memory array is configured to behave as read-only memory by not implementing erase or write commands. In one embodiment of the present technology, a memory device is provided, comprising a non-volatile memory array, and circuitry configured to store one or more addresses of the non-volatile memory array, to compare an address of a received command to the one or more addresses, and at least in part based on the comparison, determine not to implement the received command. The circuitry can be further configured to return an error message after determining not to implement the received command.

NON-VOLATILE MEMORY DEVICES AND SYSTEMS WITH READ-ONLY MEMORY FEATURES AND METHODS FOR OPERATING THE SAME

Memory devices, systems including memory devices, and methods of operating memory devices and systems are provided, in which at least a subset of a non-volatile memory array is configured to behave as read-only memory by not implementing erase or write commands. In one embodiment of the present technology, a memory device is provided, comprising a non-volatile memory array, and circuitry configured to store one or more addresses of the non-volatile memory array, to compare an address of a received command to the one or more addresses, and at least in part based on the comparison, determine not to implement the received command. The circuitry can be further configured to return an error message after determining not to implement the received command.

Apparatus for high speed ROM cells

An apparatus comprises a plurality of memory cells in rows and columns, a first word line electrically coupled to a first group of memory cells through a first word line strap structure comprising a first gate contact, a first-level via, a first metal line and a second-level via and a second word line electrically coupled to a second group of memory cells through a second word line strap structure, wherein the second word line strap structure and the first word line strap structure are separated by at least two memory cells.