Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

A system and a method for transporting high luminous intensity light from at least one luminaire to a destination area are disclosed. The system may include a light guide that carries light from the luminaire to a plurality of sensors located on a Printed Circuit Board (PCB). The PCB may be attachable anywhere the luminaire is located. According to an aspect, the luminaire is a separate entity from the sensor system. While collecting light rays originating from the luminaire and delivering them to the light sensors, the light guide may perform a plurality of operations to modify the characteristics of the collected light rays. The plurality of operations performed by the light guide on the light rays may support the accuracy and longevity of the light sensors on the PCB. Further, the light guide allows the sensor subsystem to be proximal to or distant from the luminaire.

A sensor is disclosed that provides measurements in multiple degrees of freedom without significantly increasing size, complexity, or cost. The sensor can include a light component in support of a first light source operable to direct a first beam of light, and a second light source operable to direct a second beam of light. The sensor can also include an imaging device that can directly receive the first beam of light and the second beam of light and convert these into electric signals. The imaging device and the light component can be movable relative to one another. The sensor can further include a light location module and/or a position module configured to receive the electric signals and determine locations of the first beam of light, the second beam of light on the imaging device and a relative position of the imaging device and the light component.

An integrated optical tap monitor takes the form of a highly-reflective outer coating disposed over the active region of an associated photodetector. The coating is of a material that allows for a majority of the impinging optical signal to be re-directed into an output path, while passing a small portion of the signal into the photodetector's active region for monitoring purposes. The integrated configuration is small enough to be housed within a standard TO can, and additional optical components (filters, attenuators, etc.) may be co-located with the integrated tap monitor. By virtue of incorporating the monitoring function with a reflective surface, the integrated tap monitor may be substituted for a turning mirror at any place along a signal path and provide the benefit of power monitoring while also performing signal re-direction.

An integrated circuit for sensor applications includes a plurality of photosensitive areas on a top side, capable of measuring incident light, thereby creating a signal, and a processing unit adapted to evaluate the signal measured by the photosensitive areas; and a sensor including 1) the integrated circuit, 2) a housing with a first cavity and a second cavity, and 3) a barrier located between the first cavity and the second cavity, wherein the integrated circuit is located within the first cavity, the top side of the integrated circuit faced upwardly, and a light source is located within the second cavity.

The invention provides a management system for an illumination facility, which comprises an illuminance measuring instrument, a position detector for detecting a position of the traveling vehicle, and an arithmetic device, which are mounted on a traveling vehicle, wherein the arithmetic device is configured to save a map information, positional data of an illumination lamp, initial data including illuminance data, and the illuminance data as acquired by the illuminance measuring instrument while driving the traveling vehicle, and wherein the arithmetic device is configured to calculate daily management data of the illumination facility based on the positional data of the traveling vehicle as detected by the position detector, the map information, and the illuminance data, and further wherein the arithmetic device is configured to calculate a change of the illumination facility including the illumination lamp based on the initial data and the daily management data.

An optical sensing module includes a substrate, a cover, a plurality of light-emitting chips, a light-receiving chip, and a plurality of encapsulants. The cover is disposed on the substrate. A plurality of first chambers and a second chamber are formed between the cover and the substrate. The cover has a plurality of light-emitting holes communicating with the first chambers, respectively, and a light-receiving hole communicating with the second chamber. The light-emitting chips are disposed on the substrate and in the first chambers, respectively. The light-receiving chip is disposed on the substrate and in the second chamber. The encapsulants fill the first and second chambers and enclose the light-emitting chips and the light-receiving chip, respectively. Hence, characterized in that: the light-emitting chips and the light-receiving chip are disposed on the substrate, and the light-emitting chips emit light beams in different colors to enhance light emission efficiency.

Provided is an indoor unit for an air-conditioning apparatus including: a sensor box accommodating a sensor configured to detect light; a gearbox configured to hold the sensor box so as to be rotatable, and to be moved along a first axis together with the sensor box; a first motor configured to apply a force causing the sensor box to rotate; a second motor configured to apply a force causing the gearbox to move along the first axis; and a shaft inserted through the gearbox to be rotated by receiving the force from the first motor, in which, in the gearbox, the shaft is inserted, and the gear is accommodated so that a rotational force transmitted from the shaft is transmitted to the sensor box, the gear being movable along the first axis.

A semiconductor light reception module is provided with a stem, a cap covering the stem, a holder superimposed on the cap, and a receptacle inserted into the holder. The holder has a main body section covering the lens in the cap. An opening passing from the opposite side of the cap through the main body section and reaching the lens is provided in the main body section of the holder. A fixing screw is inserted into a screw hole provided in the holder and a screw tip of a screw main body section of the fixing screw abuts against a side surface of the receptacle.