A method of determining a temperature of a subject while not in physical contact with the subject. The method includes providing an infrared sensor oriented to receive the infrared radiation emanating from a subject and to generate at least one output that corresponds to the received infrared radiation, providing a processor to process the at least one output into a computed temperature of the subject, adjusting the computer temperature based on an emissivity of the subject, the emissivity determined at least in part by a luminance value based at least in part on an image of the subject providing a memory module to store a first plurality of computed temperatures in a predetermined sequence, and selecting a first maximum from among the first plurality of computed temperatures. A display is provided to display the temperature of the subject.

A lens allows infrared light to pass therethrough. An infrared sensor includes infrared detection elements arranged in two or more columns. The infrared sensor is rotated around a scan rotation axis that passes through part of the lens to scan a detection range, and outputs an output signal indicating a thermal image of the detection range. At least two infrared detection elements in the infrared sensor are located at positions displaced from each other with respect to the scan rotation axis. Among the infrared detection elements, the number of first infrared detection elements having a smaller half-width of a point spread function in a scan direction than that in the direction of the scan rotation axis is larger than the number of second infrared detection elements having a larger half-width of a point spread function in the scan direction than that in the direction of the scan rotation axis.

A sensor apparatus includes a photosensitive sensor, a cover, and a moving mechanism. The photosensitive sensor includes a first lens and a second lens which focus on a photosensitive element. The cover includes a first slit arranged on an optical axis of the first lens and a second slit arranged on an optical axis of the second lens. The moving mechanism is configured to move the photosensitive sensor and the cover relative to each other so that the second slit is arranged on the optical axis of the first lens.

A screening method includes controlling a heat source of a screening device to reach a selected temperature, determining a location of a subject, and determining that the location is a desired distance from the screening device. The method also includes based at least in part on determining that the location is the desired distance from the screening device, simultaneously determining a temperature of the subject and a temperature of the heat source using a temperature sensor of the screening device.

A non-contact temperature sensor (1) suitable for use in measuring the temperature of a material blank (3). The temperature sensor (1) comprises a housing (5), an opening (7) at the forward end of the housing (5), a reflector (13) that is located within the housing (5), at least one aperture (15) that is located between the forward surface and the rearward surface of the reflector (13) and a light detector arrangement (17) located rearward of the reflector (13). The light detector arrangement (17) is orientated such that it can receive light passing through the at least one aperture (15) and it is capable of detecting at least two ranges of wavelengths of infrared light. The light detector arrangement (17) outputs data for each of the at least two ranges of wavelengths of infrared light.

The present invention relates to a freeform surface reflective infrared imaging system comprising a primary mirror, a secondary mirror, a tertiary mirror, and an infrared light detector. Each reflective surface of the primary mirror, the secondary mirror, and the tertiary mirror is an xy polynomial freeform surface. A field of view of the freeform surface reflective infrared imaging system is larger than or equal to 40°×30°. An F-number of the freeform surface reflective infrared imaging system is less than or equal to 1.39.

An infrared sensor module and a forehead thermometer are provided. The infrared sensor module includes a light guide structure and an infrared sensor element. An annular hollow space is formed inside the light guide structure and passes therethrough. A first and second opening is formed on two opposite sides of the light guide structure, respectively. A diameter of the first opening is greater than a diameter of the second opening. The annular hollow space includes a matte and reflective area, the matte area has serration portions, and each of the serration portions extends from the first opening to the second opening and is arranged parallel to each other. The reflective area is formed between the second opening and the matte area. The infrared sensor element is disposed at the second opening. The forehead thermometer includes a casing, a circuit board, the infrared sensor module, and an operating switch.

Embodiments of the present disclosure discloses a temperature detecting device, a temperature detecting system and a temperature detecting method. The temperature detecting device includes: a bearing support, a first end of the bearing support being fixed; a temperature detector, provided on a second end of the bearing support; a moving component, configured to be connected with the bearing support, wherein the second end of the bearing support is movable with respect to the first end under driving of the moving component.

Disclosed herein is an apparatus for adjusting the installation location of a temperature sensor configured to measure the surface temperature of a wafer in a semiconductor wafer cleaning apparatus. The apparatus includes: a bracket which is disposed in the upper end of the side wall of each of multi-station processing chambers (MPCs); a first fastening member which fastens a cable; a second fastening member which fastens a temperature sensor; a location adjustment member which fastens and supports the temperature sensor; the temperature sensor which is fixedly coupled to an end of the location adjustment member; a jig which includes a location adjustment plate and a control substrate, and which adjusts the detection location of the temperature sensor; and a controller which is provided with a wafer surface monitoring system configured to separate the surface temperature into a plurality of channels and to display the surface temperature.

A security sensor device includes: a plurality of sensor units each of which includes an infrared ray detection element having a visual field in a predetermined target direction, the plurality of sensor units aligned in a predetermined arrangement direction; a plurality of optical systems through which detection rays transmit from a corresponding detection area to each infrared ray detection element, the plurality of optical systems aligned in the predetermined arrangement direction; a target object detection circuit into which an output signal is input from each infrared ray detection element; and a switching unit which is configured to change a configuration between each of the plurality of sensor units and the plurality of optical systems according to a user operation, so that two detections of low-place mounting detection and high-place mounting detection are respectively performed.