Current signals indicative of sensed physical quantities are collected from sensing transistors in an array of sensing transistors. The sensing transistors have respective control nodes and current channel paths therethrough between respective first nodes and a second node common to the sensing transistors. A bias voltage level is applied to the respective first nodes of the sensing transistors in the array and one sensing transistor in the array of sensing transistors is selected. The selected sensing transistor is decoupled from the bias voltage level, while the remaining sensing transistors in the array of sensing transistors maintain coupling to the bias voltage level. The respective first node of the selected sensing transistor in the array of sensing transistors is coupled to an output node, and an output current signal is collected from the output node.

A method for making an infrared light absorber is provided, and the method includes following steps: providing a first carbon nanotube array on a substrate; truncating the carbon nanotube array by irradiating a top surface of the carbon nanotube array by a laser beam in two directions, the top surface being away from the substrate, wherein the two directions being at an angle, the angle is in a range of 30 degrees to 90 degrees.

An electromagnetic wave sensor has electromagnetic wave absorbers disposed side by side in first and second directions, temperature detection portions held by the respective electromagnetic wave absorbers and sets of two arm portions connected to each of the electromagnetic wave absorbers at two connection portions. In a plan view, the arm portions have two first extending portions extending from the connection portions in directions of which components in the second direction are opposite to each other, and two second extending portions extending from the first extending portions in directions of which components in the first direction are opposite to each other. Four sides of a rectangle circumscribing each of the electromagnetic wave absorbers with a smallest area are inclined with respect to the first direction in directions in which each of the electromagnetic wave absorbers approaches the second extending portions with the connection portions as fulcrums.

Disclosed is a battery in-situ test system. The battery in-situ test system comprises a charging and discharging module, an environment module and a mechanical loading module, wherein a to-be-tested battery is electrically connected with the charging and discharging module, the environment module comprises a temperature control box, the to-be-tested battery, an optical imaging module, an infrared thermal imaging module and an ultrasonic scanning imaging module are arranged in the temperature control box. The test environment is simulated through the environment module, and the optical imaging module is used for observing the microscopic deformation or damage of the surface of the to-be-tested battery; the infrared thermal imaging module is used for identifying the temperature distortion point of the to-be-tested battery and observing the thermal runaway process of the to-be-tested battery; and the ultrasonic scanning imaging module is used for monitoring the damage, lithium separation and charge state of the to-be-tested battery.

An electronic device for enhancing accuracy upon contactless body temperature measurement is provided. The electronic device includes an image sensor for obtaining an image of an object, a temperature sensor disposed at a position adjacent to the image sensor for measuring a temperature of the obtained object, and a controller for performing control to determine the temperature of the object using a focal length of a camera module including the image sensor corresponding to a time of obtaining the image of the object and a temperature output from the temperature sensor corresponding to the time of obtaining the image of the object.

An infrared-detecting device, includes an infrared detector configured to emit a signal representative of the thermal radiation of a hotspot, and a light source configured to emit an incident beam, preferably in a window of UV or visible wavelength. The infrared-detecting device furthermore comprises a synchronizing device connected to the light source and to the infrared detector or to the processing module, and configured to emit a synchronization signal, the infrared detector being configured to be activated in a preset time window depending on said synchronization signal.

A detector of electromagnetic radiation (RL) is described. The detector comprises: an oriented polycrystalline layer (2) of thermoelectric material, a substrate (1) superimposed on the top surface of the oriented polycrystalline layer so that the back surface (10) is in contact with the oriented polycrystalline layer, first and second electrodes spaced the one from the other and in electrical contact with the oriented polycrystalline layer. The substrate comprises at least one ceramic layer and the oriented polycrystalline layer has a crystal orientation at an angle comprised between 30 degrees and 55 degrees relative to a normal to the top surface of the substrate.

Techniques are disclosed for facilitating image relay for wearable devices with thermal imaging devices attached thereto. In one example, a system includes an attachment configured to releasably couple to an exterior surface of a wearable apparatus. The attachment includes an infrared sensor assembly configured to capture a thermal image of a scene. The attachment further includes a display component configured to provide data indicative of the thermal image. The system further includes an optical relay component configured to couple to an interior surface of the wearable apparatus. The optical relay component is further configured to receive the data from the display component and relay the data within the wearable apparatus to facilitate presenting the data for viewing by a user while wearing the wearable apparatus. Related devices and methods are also provided.

An infrared image sensor includes a first integrate circuit (IC), a bolometer disposed on or above one surface of the first IC configured to detect infrared rays passing through a lens module, a via electrically connecting the first IC and the bolometer, and a reflective layer disposed between the first IC and the bolometer, wherein the first IC includes at least one of a read-out (RO) element configured to perform analog processing for the bolometer to generate infrared sensing information and an image signal process (ISP) element configured to perform digital processing based on the bolometer to generate infrared image information, and at least one of an autofocusing (AF) control element and an optical image stabilization (OIS) control element configured to adjust a positional relationship between the lens module and the bolometer.

A method of making a light converting optical system comprising providing a first optical layer, a thin sheet of reflective light scattering material, a light source, a second optical layer approximately coextensive with the first optical layer, a continuous broad-area photoabsorptive film layer approximately coextensive with the first optical layer, positioning the thin sheet of reflective light scattering material parallel to the first optical layer, positioning the continuous broad-area photoabsorptive film layer between and parallel to the first optical layer and the thin sheet of reflective material, and positioning the second optical layer on a light path between the light source and the continuous broad-area photoabsorptive film layer. The first optical layer has a microstructured broad-area front surface comprising an array of linear grooves disposed side by side and extending along a straight line between two edges of the layer.