Improved techniques for infrared imaging and gas detection are provided. In one example, a system includes a sensor array configured to receive infrared radiation from a scene comprising a background portion and a gas. The sensor array includes a first set of infrared sensors configured with a first spectral response corresponding to a first wavelength range of the infrared radiation associated with the background portion. The sensor array also includes a second set of infrared sensors configured with a second spectral response corresponding to a second wavelength range of the infrared radiation associated with the gas. The system also includes a read out integrated circuit (ROIC) configured to provide pixel values for first and second images captured by the first and second sets of infrared sensors, respectively, in response to the received infrared radiation. Additional systems and methods are also provided.

An integrated photonics chip for thermal imaging comprises a photonics substrate including a plurality of receiver elements. Each receiver element comprises a first grating coupler optically coupled to a first waveguide filter and configured to receive a first wavelength of light at a given angle, with the first waveguide filter configured to pass the first wavelength of light; and a second grating coupler optically coupled to a second waveguide filter and configured to receive a second wavelength of light at the given angle, with second waveguide filter configured to pass the second wavelength of light. Each receiver element receives the wavelengths of light from an object of interest that emits the light due to blackbody radiation, and receives the wavelengths of light at respectively different angles. Each grating coupler receives a unique wavelength of light with respect to the other wavelengths of light received by the other grating couplers.

The disclosure provides respective detection devices of a sensor array that detect infrared light and convert the infrared light into a DC component electrical signal.

A flame or gas detection method includes determining non-imaging sensor system detection state for a scene of interest, determining an imaging sensor system detection state for the scene of interest, and validating one of the non-imaging sensor system detection state and the imaging sensor system detection state with the other of the non-imaging sensor system detection state and the imaging sensor system detection state. A flame or gas detecting system detection state is then indicated at a user interface including the validated one of the non-imaging sensor system detection state and the imaging system detection state. Flame or gas detection systems and computer program products are also described.

Various embodiments disclosed herein describe an infrared (IR) imaging system for detecting a gas. The imaging system can include an optical filter that selectively passes light having a wavelength in a range of 1585 nm to 1595 nm while attenuating light at wavelengths above 1600 nm and below 1580 nm. The system can include an optical detector array sensitive to light having a wavelength of 1590 that is positioned rear of the optical filter.

An irradiating device for irradiating a machining field with a machining beam, in particular with a laser beam, for carrying out a welding process, is provided. The irradiating device includes a beam scanner for aligning the machining beam to a machining position in the machining field. The irradiating device has an imaging device for imaging a part-region of the machining field on a pyrometer which has at least two pyrometer segments. The imaging device images thermal radiation which emanates from the machining position in the machining field on a first pyrometer segment, and images thermal radiation which emanates from a position in the machining field being situated ahead of or behind the machining position along an advancing direction of the machining beam in the machining field on at least one second pyrometer segment. A machine tool having such an irradiating device is also provided.

A two-wavelength, single-camera imaging thermography system for in-situ temperature measurement of a target, comprising: a target light path inlet conduit for receiving a target light beam reflected from the target; a beam splitter installed in a splitter housing at a distal end of the target light path conduit, wherein the beam splitter divides the target light beam into a first light beam and a second light beam; a first light path conduit emanating from the splitter housing comprising a first aperture iris installed within the first light path conduit for aligning the first light beam; a first band pass filter installed within the first light path conduit for regulating the first light beam to a first wavelength 1 and an optional half waveplate installed within the first light path conduit to modulate a polarization ratio of the first light beam of 1 wavelength; a second light path conduit emanating from the splitter housing comprising a second aperture iris installed within the second light path conduit for aligning the second light beam; a second band pass filter installed within the second light path conduit for regulating the second light beam to a second wavelength 2; a junction housing, wherein distal ends of each of the first and second light path conduits are connected to the junction housing; a polarizing beam splitter installed in the junction housing, wherein the polarizing beam splitter reflects the first light beam of 1 wavelength along the same path or a parallel path of the second light beam of 2 wavelength that passes directly through the polarizing beam splitter unreflected to create a merged light beam comprising light of 1 and 2 wavelengths; and a light path outlet conduit connected to the junction for directing the merged beam to a high-speed camera for imaging.

Described herein are a spectrometer system and a spectrometer device, which are suited for investigation or monitoring purposes, in particular, in the infrared (IR) spectral region, and for a detection of heat, flames, fire, or smoke.

The spectrometer device) allows capturing incident light from object and transferring the incident light to a length variable filter with a particularly high concentration efficiency. Apart from the spectrometer device the spectrometer system further includes an evaluation unit designated for determining information related to a spectrum of an object by evaluating the detector signals provided by the spectrometer device.

A radiation temperature measuring device includes: an infrared sensor that detects a wavelength including an absorption band by atmosphere; an absorption rate calculation unit that calculates an absorption rate by the atmosphere when measuring a surface temperature of an object from output of the infrared sensor; an output storage unit that stores conversion information for converting the output of the infrared sensor into the surface temperature of the object; a surface temperature calculation correction unit that calculates the surface temperature of the object from the output of the infrared sensor, the absorption rate calculated by the absorption rate calculation unit, and the conversion information; and an absorption rate storage unit that stores in advance the absorption rate by the atmosphere when the conversion information is set, in which the calculated surface temperature of the object is corrected with the absorption rate stored in the absorption rate storage unit.

Examples described herein generally relate to apparatus and methods for rapid thermal processing (RTP) of a substrate. In one or more embodiments, a process chamber includes chamber body, a window disposed on a first portion of the chamber body, a chamber bottom, and a shield disposed on a second portion of the chamber body. The shield has a flat surface facing the window to reduce reflected radiant energy to a back side of a substrate disposed in the process chamber during operation. The process chamber further includes an edge support for supporting the substrate and a cooling member disposed on the chamber bottom. The cooling member is disposed in proximity of the edge support to cool the edge support during low temperature operation in order to improve the temperature uniformity of the substrate.