A temperature measuring assembly and an electrical device. The temperature measuring assembly includes a heat conducting element and a temperature measuring element. The heat conducting element is arranged for conducting heat of a to-be-measured device. The temperature measuring element is thermally conductive with the heat conducting element so as to measure a temperature signal of the to-be-measured device according to the heat conducted by the heat conducting element and output the temperature signal to an output connecting element. The heat conducting element and the temperature measuring element are elements separately formed and may be connected as an integral element. The heat conducting element of the temperature measuring assembly has a good insulation and thermal conduction performance and is particularly suitable for measuring the temperature of the to-be-measured device and capable of shortening a temperature measurement response time of the temperature measuring element.

An electrical connector including a housing having a terminal channel with a power terminal in the terminal channel. The electrical connector includes a temperature sensor assembly positioned in the chamber. The temperature sensor assembly includes a sealing pad holding the power terminal and a thermal shunt held by the sealing pad. A temperature sensor is coupled to the thermal shunt. The sealing pad is electrically insulative and has a terminal opening receiving the power terminal. The sealing pad is thermally coupled to the power terminal and thermally coupled to the thermal shunt. The thermal shunt has a thermal conductivity higher than a thermal conductivity of the sealing pad. The temperature sensor monitors the temperature of the power terminal through a thermal path defined by the sealing pad and the thermal shunt.

A rotating machine has a stationary portion, and a rotating portion. The stationary portion and the rotating portion having a fluid passage therebetween. The stationary portion comprising a first fluid channel, a well, and a second fluid channel spaced apart from the first fluid channel. The first fluid channel fluidically is coupled to receive fluid from the fluid passage. A sensor is coupled to the stationary portion and is disposed at the well.

A sensor unit disclosed herein is a temperature sensor unit to be attached to an energy storage device. The temperature sensor unit includes an FPC to be positioned on an energy storage device body, a temperature sensor connected to a detection line of the FPC, a housing disposed on the FPC and covering the temperature sensor, and a biasing member elastically and deformably held in the housing and configured to bias the lower housing of the housing toward the energy storage device body by elastic restoring force to bring the temperature sensor into contact with the energy storage device body with the FPC therebetween.

An electronic device for measuring an ambient temperature (T.sub.air) of the environment of an electronic device is described. It comprises at least one integrated infrared sensor, a blinded window preventing infrared radiation to directly impinge on the integrated infrared sensor and being in thermal contact with the environment as well as with a cover of the device resulting in the blinded window being at a surface temperature (T.sub.surface). The at least one integrated infrared sensor is adapted for sensing the temperature of the blinded window (T.sub.surface). The device also comprises at least one absolute temperature sensor for measuring a temperature of the at least one infrared sensor (T.sub.sensor) itself, and a processing means for determining a temperature difference (T) between the sensed surface temperature (T.sub.surface) and the temperature of the infrared sensor (T.sub.sensor) and for calculating based thereon the ambient temperature (T.sub.air).

An electronic device for measuring an ambient temperature (T.sub.air) of the environment of an electronic device is described. It comprises at least one integrated infrared sensor, a blinded window preventing infrared radiation to directly impinge on the integrated infrared sensor and being in thermal contact with the environment as well as with a cover of the device resulting in the blinded window being at a surface temperature (T.sub.surface). The at least one integrated infrared sensor is adapted for sensing the temperature of the blinded window (T.sub.surface). The device also comprises at least one absolute temperature sensor for measuring a temperature of the at least one infrared sensor (T.sub.sensor) itself, and a processing means for determining a temperature difference (T) between the sensed surface temperature (T.sub.surface) and the temperature of the infrared sensor (T.sub.sensor) and for calculating based thereon the ambient temperature (T.sub.air).

A furnace for relieving glass products of stress is provided. The furnace has a furnace interior and a thermal element that measures temperatures in the furnace interior. The thermal element is enclosed by an enveloping tube composed of an inorganic material.

A furnace for relieving glass products of stress is provided. The furnace has a furnace interior and a thermal element that measures temperatures in the furnace interior. The thermal element is enclosed by an enveloping tube composed of an inorganic material.

A temperature-sensing RFID device includes an RFID chip and an antenna electrically coupled thereto. The RFID chip includes a temperature sensor, while the antenna is adapted to receive energy from an RF field and produce a signal. A shielding structure and/or a thermally conductive or absorbent structure may be associated with the RFID chip. The shielding structure is oriented so as to be positioned between at least a portion of the RFID chip and an outside environment and configured to shield the temperature sensor from at least one environmental factor capable of affecting a temperature sensed by the temperature sensor of an article to which the RFID device is secured. The thermally conductive or absorbent structure is oriented so as to be positioned between at least a portion of the RFID chip and the article and configured to enhance thermal coupling between the temperature sensor and the article.

A contact temperature sensor is disclosed. In an embodiment a contact temperature sensor includes a contact body including a bottom wall configured to apply the contact temperature sensor on a test body and a carrier ceramics configured to thermally directly couple the contact temperature sensor to the test body, wherein the carrier ceramics is arranged on a side of the bottom wall facing the test body, and wherein the carrier ceramics includes a metallization on a side facing the test body. The contact temperature sensor further includes a temperature sensor element thermally coupled to the carrier ceramics.