An integrated circuit package having an electronic interposer comprising an upper section, a lower section and a middle section, a die side integrated circuit device electrically attached to the upper section of the electronic interposer, a die side heat dissipation device thermally contacting the die side integrated circuit device, a land side integrated circuit device electrically attached to the lower section of the electronic interposer, and a land side heat dissipation device thermally contacting the at least one die side integrated circuit device. The upper section and the lower section may each have between two and four layers and the middle section may be formed between the upper section and the lower section, and comprises up to eight layers, wherein a thickness of each layer of the middle section is thinner than a thickness of any of the layers of the upper section and the lower section.

A temperature input unit includes a disconnection detection circuit that measures a temperature of a measurement target with at least one of a thermocouple or a temperature measurement resistor and feeds a disconnection detection current for disconnection detection to the thermocouple and a compensating wire connected to the thermocouple. A controller controls, before measuring the temperature of the measurement target with the thermocouple, a terminal switch and an input circuit switch to connect the compensating wire to a temperature measurement resistor input circuit and an A/D converter, and calculates a predicted value of a voltage drop resulting from resistance of the compensating wire occurring in response to the disconnection detection current. The controller controls the terminal switch and the input circuit switch to connect the compensating wire to a thermocouple input circuit and the A/D converter, and subtracts the predicted value from a measured value of the thermoelectromotive force detected by the thermocouple input circuit to calculate a corrected measured value of the thermoelectromotive force.

An apparatus include one or more DACs and a resistor divider are configured to generate a variable bias voltage V.sub.BIAS with respect to a CM voltage V.sub.CM. The CM voltage V.sub.CM is applied to a cathode of one or more thermopiles or a negative input of one or more amplifiers to prevent saturation and over range of one or more low voltage readout amplifiers and one or more ADCs.

A system includes a metal tub structure formed in an integrated circuit (IC) structure, a first metal component, and a second metal component. The first metal component is formed from a first metal. The first metal component is formed in an opening defined by the metal tub structure, and includes a first metal first junction element, a first metal second junction element, and a first metal bridge electrically connected to the first metal first junction element and the first metal second junction element. The second metal component is formed from a second metal different than the first metal, and includes a second metal first junction element electrically connected to the first metal first junction element to define a first thermocouple junction, and a second metal second junction element electrically connected to the first metal second junction element to define a second thermocouple junction.

The disclosed technology includes systems and methods for detecting an at least partially obstructed air filter in a furnace. The disclosed technology can include a system and method that can receive temperature data from a flame sensor configured to detect a temperature of a flame in a burner, determine that an air filter associated with the burner is at least partially obstructed by determining that the temperature data indicates the flame temperature is greater than or equal to a threshold temperature, and output an alarm signal indicating that the air filter is at least partially obstructed.

Various embodiments include an electronic circuit for driving a thermocouple element comprising: contact electrodes for connecting cold-end electrodes of the thermocouple element; and a measurement circuit to measure a thermo-voltage generated by the thermocouple element. One of the electrodes is connected to a supply voltage and a ground potential over a voltage divider having resistors with pre-defined resistance values such that a common mode voltage between the contact electrode and the ground potential is in a pre-defined range. If a leakage resistance effective between the contact electrode and the ground potential is greater than a pre-defined threshold, a processor compares the common mode voltage to the pre-defined range and generates a calibration value for the measurement circuitry if the common mode voltage is outside the range.

Systems and methods are provided to detect a failed thermocouple. A temperature in a gas path of a gas turbine engine may be measured, where the temperature is based on a signal generated by a thermocouple during a startup of the gas turbine engine and/or during an idle period that immediately follows the startup, and the thermocouple protrudes into the gas path. A failure of the thermocouple may be detected if the temperature is determined to be less than a threshold temperature.

The invention relates to a temperature measurement device comprising at least three probes, a computer, the computer being configured to estimate a temperature on the basis of voltage measurements at the output of the probes, characterised in that the probes are connected together in a plurality of meshes mounted in series, with at least one mesh comprising at least two probes mounted in parallel and at least one other mesh comprising a probe or a plurality of probes mounted in parallel.

The temperature sensor includes a temperature sensing element, a pair of element electrode wires, and a pair of terminals. An overlapping wire portion of each of the element electrode wires is connected to the terminal in such a manner as to overlap the terminal in an overlapping direction. A fillet portion is disposed on a side surface of the overlapping wire portion. The fillet portion has a pair of fillet pieces formed in such a manner as to crawl up from a specific main surface that is a main surface at the overlapping wire portion side in the terminal. In a cross section of the temperature sensor orthogonal to a sensor axis direction and passing through the fillet portion, the maximum length in a width direction of the fillet portion is defined as a fillet maximum width A, and a length in a width direction between a pair of boundary portions between the pair of fillet pieces and the specific main surface is defined as a boundary width B. The temperature sensor has, at least partly in the sensor axis direction, a specific cross section satisfying B≤A, as a cross section of the temperature sensor orthogonal to the sensor axis direction and passing through the fillet portion.

A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. The multiple sides form a cavity. The top side includes one or more ports. Each of the one or more ports includes a top side open area that exposes the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy to and from an electrical device exposed via the cavity. The top side open area of the one or more ports has a corresponding bottom side open area of the bottom side located below the top side open area. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.