A predictive electronic thermometer circuit structure capable of temperature compensation is provided, including: a compensation module, a thermometer circuit, and a liquid crystal display (LCD) drive module. The thermometer circuit includes a temperature measurement oscillation circuit and a real measurement module. The compensation module and the real measurement module are connected in parallel between the temperature measurement oscillation circuit and the LCD drive module. The predictive electronic thermometer circuit structure controls the on and off of the compensation module and the real measurement module through a combination logic control switch respectively. When the compensation module is off and the real measurement module is on, an actual measured data is output. When the real measurement module is off and the compensation module is on, a temperature value is output after predictive compensation. The electronic thermometer has a temperature compensation function, and measures the temperature quickly and accurately.

In one embodiment, a processor includes: a first plurality of intellectual property (IP) circuits to execute operations; and a second plurality of integrated voltage regulators, where the second plurality of integrated voltage regulators are oversubscribed with respect to the first plurality of IP circuits. Other embodiments are described and claimed.

A process temperature estimation system includes a mounting assembly configured to mount the process fluid temperature estimation system to an external surface of a process fluid conduit. A hot end thermocouple is thermally coupled to the external surface of the process fluid conduit. A resistance temperature device (RTD) is spaced from the hot end thermocouple. Measurement circuitry is coupled to the hot end thermocouple and is configured to detect an emf of the hot end thermocouple and a resistance of the RTD that varies with temperature and provide sensor temperature information. A controller is coupled to the measurement circuitry and is configured to measure a reference temperature based on the resistance of the RTD and employ a heat transfer calculation with the reference temperature, the emf of the hot end thermocouple, and known thermal conductivity of the process fluid conduit to generate an estimated process temperature output.

A thermocouple structure according to one aspect of the present disclosure includes a first element wire, second element wires formed of a material different from the first element wire, an insulating covering member covering at least one of the first element wire and the second element wires, and a protective tube accommodating the first element wire and the second element wire. Each of the second element wires is bonded to a different position on the first element wire.

A temperature sensor and a method of controlling the temperature sensor are provided. The temperature sensor includes a voltage generator suitable for generating a temperature voltage that has a voltage level determined according to a temperature and a reference voltage that has a constant voltage level independent of a change in temperature, a code generator suitable for generating an initial code based on the temperature voltage and the reference voltage, and a code calibrator suitable for generating a calibrated code based on the initial code and a calibration factor.

The present application discloses an improved thermopile laser sensor apparatus and methods of use. In one embodiment, the apparatus includes a sensor body having a first sensor body recess and a second sensor body recess formed therein, with a substrate positioned in the first sensor body recess in thermal communication with the sensor body. The substrate includes at least one absorber attached thereto and configured to absorb a portion of a beam of laser energy. A first thermal sensor in thermal communication with the substrate and the sensor body may be formed on or attached to the substrate. A second thermal sensor in thermal communication with the sensor body may be positioned in the second sensor body recess. A thermal barrier configured to reduce the rate of transfer of thermal energy from the substrate to the second thermal sensor may be positioned between the substrate and the second thermal sensor.

A temperature sensor circuit, a control circuit, and a control method are provided. The temperature sensor circuit comprises a temperature sensor and a control circuit. The control circuit is coupled to the temperature sensor and comprises a current source, a sampling circuit, and a computing circuit. The current source is configured to provide a first current and a second current to the temperature sensor in different time periods. The sampling circuit is coupled to the temperature sensor and configured to obtain and store a first voltage information and a second voltage information from the temperature sensor when the first current and second current are respectively provided. The computing circuit is coupled to the sampling circuit and configured to generate a sensing result corresponding to a difference of subtracting the second voltage information from the first voltage information.

A stator for an electric machine, having a winding including a plurality of interconnected conductors assigned to one or more phases, wherein the ends of at least some of the conductors protrude axially or radially beyond the winding at the inner circumference and/or at the outer circumference of the winding. An interconnection ring, to which the conductors are connected, is positioned axially or radially on the winding, and at least one temperature sensor is arranged at the interconnection ring and is in thermal contact with the winding.

Differential thermoelectric devices are provided for monitoring a change of areal thermal energy dissipation rate and surface temperature profile. The devices include a through electrode connecting to different sets of thermoelectric elements at different regions of the device. A sensing circuitry is electrically connected to the thermoelectric elements to measure a voltage output.

An example device includes a first temperature sensor configured to provide a first current signal indicative of a temperature of a first circuit based on a voltage of a first temperature sensing element. The first circuit includes a power switch device and the first temperature sensing element. A second temperature sensor is configured to provide a second current signal indicative of temperature of a second circuit based on a voltage of a second temperature sensing element. The second circuit includes the second temperature sensing element. A trim circuit is configured to trim current in at least one of the first temperature sensor or the second temperature sensor to compensate for mismatch between temperature coefficients of the first and second temperature sensing elements.