A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.

A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.

A temperature sensor includes a block body, a first thermocouple, and a second thermocouple. The first thermocouple includes a first strand, a second strand, a first insulator surrounding the first strand and the second strand, and a first metal sheath surrounding the first insulator. The second thermocouple includes a third strand, a fourth strand, a second insulator surrounding the third strand and the fourth strand, and a second metal sheath surrounding the second insulator. An end portion of each of the first thermocouple and the second thermocouple is buried in the block body.

A temperature sensor includes a block body, a first thermocouple, and a second thermocouple. The first thermocouple includes a first strand, a second strand, a first insulator surrounding the first strand and the second strand, and a first metal sheath surrounding the first insulator. The second thermocouple includes a third strand, a fourth strand, a second insulator surrounding the third strand and the fourth strand, and a second metal sheath surrounding the second insulator. An end portion of each of the first thermocouple and the second thermocouple is buried in the block body.

Apparatus and associated methods relate to generating a temperature measurement signal based upon a weighted average of signals generated by a resistive temperature detector (RTD) and a thermocouple device. The thermocouple device includes first and second thermocouple junctions. The first thermocouple junction is thermally coupled to the RTD, and the second thermocouple junction is thermally isolated from the RTD. The thermocouple is configured to generate a signal indicative of a difference between first and second thermocouple junctions, which is substantially equal to the difference between the RTD and the second thermocouple junction due to the thermal coupling configuration. The RTD generates a signal indicative of a temperature of the RTD. A weighted sum of the first and second signals is indicative of a temperature of the second thermocouple junction, which responds rapidly to temperature fluctuations, due to its having a relatively small thermal mass compared with the RTD.

Apparatus and associated methods relate to generating a temperature measurement signal based upon a weighted average of signals generated by a resistive temperature detector (RTD) and a thermocouple device. The thermocouple device includes first and second thermocouple junctions. The first thermocouple junction is thermally coupled to the RTD, and the second thermocouple junction is thermally isolated from the RTD. The thermocouple is configured to generate a signal indicative of a difference between first and second thermocouple junctions, which is substantially equal to the difference between the RTD and the second thermocouple junction due to the thermal coupling configuration. The RTD generates a signal indicative of a temperature of the RTD. A weighted sum of the first and second signals is indicative of a temperature of the second thermocouple junction, which responds rapidly to temperature fluctuations, due to its having a relatively small thermal mass compared with the RTD.

Methods, systems, and devices for temperature sensor linearization techniques are described. A temperature sensor associated with a semiconductor device may include a first circuit and a second circuit. The second circuit may be configured to determine that a first temperature, associated with the semiconductor device and indicated by one or more first bits generated by the first circuit, is within a first temperature range of a total temperature range measurable by the temperature sensor. The second circuit may be configured to generate and output, based on the first temperature being within the first temperature range, one or more second bits indicating a second temperature associated with the semiconductor device. The second circuit may generate the one or more second bits by applying, to the one or more first bits, a first-order operation corresponding to the first temperature range and associated with correcting an error of the first temperature.

Methods, systems, and devices for temperature sensor linearization techniques are described. A temperature sensor associated with a semiconductor device may include a first circuit and a second circuit. The second circuit may be configured to determine that a first temperature, associated with the semiconductor device and indicated by one or more first bits generated by the first circuit, is within a first temperature range of a total temperature range measurable by the temperature sensor. The second circuit may be configured to generate and output, based on the first temperature being within the first temperature range, one or more second bits indicating a second temperature associated with the semiconductor device. The second circuit may generate the one or more second bits by applying, to the one or more first bits, a first-order operation corresponding to the first temperature range and associated with correcting an error of the first temperature.

Apparatus, including a multiplexer, having a first output and multiple first inputs receiving analog input signals and an analog feedback signal and cycling through and selecting the signals for transfer in sequential signal groupings to the first output. The apparatus also includes an amplification circuit, having a second output and a second input connected to the multiplexer first output, that amplifies signals corresponding to the analog input signals with a selected gain so as to generate respective amplified analog signals at the second output. Circuitry selects a characteristic of the respective amplified analog signals from an initial signal grouping, feeds the characteristic back for input to the multiplexer as the analog feedback signal, selects a subsequent characteristic of the respective amplified analog signals from a subsequent signal grouping, and adjusts the amplification circuit gain so that the analog feedback signal and the subsequent characteristic have the same amplitude.

Apparatus, including a multiplexer, having a first output and multiple first inputs receiving analog input signals and an analog feedback signal and cycling through and selecting the signals for transfer in sequential signal groupings to the first output. The apparatus also includes an amplification circuit, having a second output and a second input connected to the multiplexer first output, that amplifies signals corresponding to the analog input signals with a selected gain so as to generate respective amplified analog signals at the second output. Circuitry selects a characteristic of the respective amplified analog signals from an initial signal grouping, feeds the characteristic back for input to the multiplexer as the analog feedback signal, selects a subsequent characteristic of the respective amplified analog signals from a subsequent signal grouping, and adjusts the amplification circuit gain so that the analog feedback signal and the subsequent characteristic have the same amplitude.