A digital sensor network is overlaid on an integrated circuit for identifying and mapping hotspots in the integrated circuit. The digital sensor network may include a plurality of digital sensors distributed within an area of an integrated circuit component of an integrated circuit. Each of the plurality of digital sensors may include a ring oscillator and may be configured to output a counter value of a ring oscillator counted over a designated period. A sensor network control unit may be provided that is communicatively connected to the plurality of digital sensors via a communication circuit. The sensor network control unit may be configured to receive a plurality of counter values including the counter value from each of the plurality of digital sensors and identify a hotspot within the area of the integrated circuit.

A method for measuring the oil content of a lithium battery separator by using DSC includes the following steps: taking 5-10 mg of an oil-containing separator sample from the lithium battery separator, and taking 5-10 mg of an oil-free separator sample from an oil-free separator; performing an enthalpy test on the oil-free separator sample at room temperature by using a differential scanning calorimeter to obtain a first enthalpy value, and performing an enthalpy test on the oil-containing separator sample by using the differential scanning calorimeter to obtain a second enthalpy value; subtracting the second enthalpy value from the first enthalpy value to obtain a difference, and then dividing the difference by the first enthalpy value to obtain the oil content of the oil-containing separator sample.

The present invention generally relates to a method for traffic control, and an electronic device therefor. An operation method of an electronic device may comprise the steps of: measuring the temperature of the electronic device through at least one sensor; checking an operation state of at least one application being executed in the electronic device; and controlling data throughput for each of the at least one application on the basis of the operation state of the at least one application if the measured temperature is equal to or greater than a reference value. Other various embodiments are possible.

An apparatus can include a first adaptive filter, a second adaptive filter, a filter, and a third adaptive filter. The first adaptive filter can be configured to determine an estimated magnitude of a control signal associated with a control measure based on a magnitude of a signal from a sensor, wherein the signal is indicative of operating temperature of a memory system. The second adaptive filter can be configured to determine an estimated operating temperature based on a magnitude of the control signal. The filter can be configured to determine a change magnitude of the control signal based on a difference between the magnitude of the signal from the sensor and a threshold operating temperature. The third adaptive filter can be configured to determine a throttle rate at which to apply the control signal based on a change magnitude of the control signal.

A circuit for sensing local operating properties of an integrated circuit is disclosed. The circuit may include one or more sensor circuits configured to sense the local operating properties of the integrated circuit. The sensor circuits may receive a supply voltage with a magnitude in a limited range from a digital power supply that is different from the digital power supply that provides power to functional circuits in the integrated circuit. Level shifters may be coupled to the sensor circuits to shift output signals from the sensor circuits to levels that correspond to the digital power supply that provides power to functional circuits in the integrated circuit. Counters and a shift register may be coupled to the level shifters to receive the shifted output signals, the values of which may be used to determine the local operating properties of the integrated circuit as sensed by the sensor circuits.

An apparatus including a printed circuit board (PCB) including a sense resistor; and an integrated circuit (IC) mounted on the PCB, wherein at least a portion of the IC draws current from a power rail, wherein the sense resistor is coupled between the power rail and the IC, wherein the sense resistor is configured to produce a sense voltage in response to the current drawn by the at least portion of the IC, and wherein the IC includes a current sensor configured to generate a signal indicative of the current drawn by the at least portion of the IC based on the sense voltage.

Techniques for identifying thermal critical conditions in devices with multiple SoCs, and coordinating the resetting and rebooting of the SoCs to recover from the thermal critical conditions are described herein. A device may include a first SoC that monitors a first temperature sensor, and a second SoC that monitors a second temperature sensor, to determine whether temperatures in the device indicate thermal critical conditions. The second SoC may determine that a temperature determined using the second temperature sensor is above a threshold indicating a thermal critical condition, and may provide an indication to the first SoC that the temperature is above the threshold. The first SoC may detect the indication, and the first SoC and second SoC may each reset to allow the device to cool down. The first SoC and second SoC may then coordinate rebooting once the thermal critical condition is no longer detected in the device.

A processing unit manages temperature by correlating readings from a plurality of external temperature sensors to a skin temperature of the processing unit, wherein the correlation is based on characteristics of a computer chassis that is to include the processing unit. The processing unit is mounted on a printed circuit board (PCB) or other substrate that is to be placed in a computer chassis. Each of a plurality of temperature sensors is placed at a different location of the PCB to provide temperature readings from a variety of locations of the PCB. A temperature controller of the processing unit receives temperature readings from the plurality of sensors and correlates the temperature readings with a skin temperature of the processing unit based on a plurality of correlation values.

A built-in temperature sensing device of a single chip includes a built-in temperature sensor and a temperature comparator. The built-in temperature sensor senses a single chip temperature of the single chip. The temperature comparator receives the single chip temperature and a threshold temperature, and compares the single chip temperature with the threshold temperature to generate an output signal to take a necessary protection method.

A method of determining a temperature of a component in an electronic device includes obtaining a posture of the electronic device, selecting a first temperature sensor from a plurality of temperature sensors based on the obtained posture, obtaining a first measured temperature from the first temperature sensor, determining the temperature of the component based on the first measured temperature from the first temperature sensor, and in accordance with the determined temperature meeting one or more criteria, adjusting performance of the component.