A system and method for dynamically adjusting a critical temperature threshold of non-volatile memory to ensure full capture of information to non-volatile memory before the information handling system hibernates. If the operating temperature of the non-volatile memory reaches a critical temperature threshold, a controller determines the memory size of information in volatile memory. If there is a maximum memory size, the controller uses the default critical temperature threshold as the critical temperature threshold and initiates a process to write information to the non-volatile memory and hibernates the system. If there is less than the maximum memory size, the controller may dynamically increase the critical temperature threshold based on the memory size such that the information in volatile memory can be written to the non-volatile memory before the information handling system hibernates.

The present disclosure provides a method for automatically optimizing power consumption. The method includes: (S1) a baseboard management controller determines whether system information is correct or not after powered on. If correct, further proceeding the method. If not correct, stopping further proceeding the method. (S2) the baseboard management controller periodically detects the surface temperature and the internal temperature of the essential element with a first loop cycle and determines whether the surface temperature or the internal temperature is higher than a preset temperature. (S3) If the surface temperature or the internal temperature is higher than the preset temperature, performing a PID adjustment to the fan rotation speed according to the surface temperature or the internal temperature of the essential element. If the surface temperature or the inner temperature is not higher than the preset temperature, performing a stepwise adjustment to the fan rotation speed according to current environment temperature.

An apparatus measures a junction temperature in an IC through a pin of the IC and concurrently provides a digital input signal to digital logic of the IC through the pin. The IC has an ESD diode structure connected to the pin. High and low side voltage sensors sense a voltage drop across the diode structure. An input multiplexer controlled by the digital input signal selectively connects high and low side current sources to the pin to concurrently provide the digital input signal to the digital logic and to drive a constant current through the diode structure. An output multiplexer controlled by the digital input signal selectively connects the high and low side voltage sensors to an output that provides a sense signal indicative of the IC junction temperature.

An integrated circuit package having an electronic interposer comprising an upper section, a lower section and a middle section, a die side integrated circuit device electrically attached to the upper section of the electronic interposer, a die side heat dissipation device thermally contacting the die side integrated circuit device, a land side integrated circuit device electrically attached to the lower section of the electronic interposer, and a land side heat dissipation device thermally contacting the at least one die side integrated circuit device. The upper section and the lower section may each have between two and four layers and the middle section may be formed between the upper section and the lower section, and comprises up to eight layers, wherein a thickness of each layer of the middle section is thinner than a thickness of any of the layers of the upper section and the lower section.

A method for measuring temperature is used to obtain a room temperature of a room. The method for measuring temperature includes: obtaining a first temperature inside an operating area in a portable electronic device in the room; obtaining a second temperature outside the operating area in the portable electronic device by a first temperature sensor; calculating a temperature difference between the first temperature and the second temperature; obtaining a compensation temperature according to the temperature difference and a compensation temperature table; and calculating the room temperature according to the second temperature and the compensation temperature.

Described are a temperature sensor, a semiconductor device, and a method of measuring a temperature of a sample. One embodiment of the temperature sensor may comprise a probe circuit, the probe circuit having a thermal operational range. The temperature sensor may further comprise a thermal resistor separating the probe circuit from a sample. The temperature sensor may further comprise a heating circuit adapted to maintain the probe circuit within the thermal operational range.

A method of determining a temperature of a component in an electronic device includes obtaining a posture of the electronic device, selecting a first temperature sensor from a plurality of temperature sensors based on the obtained posture, obtaining a first measured temperature from the first temperature sensor, determining the temperature of the component based on the first measured temperature from the first temperature sensor, and in accordance with the determined temperature meeting one or more criteria, adjusting performance of the component.

A monitoring system includes an analytical engine system coupled to a plurality of sensors of an engine system. The analytical engine system is configured to determine a model probability distribution based on model data, determine a distance threshold value of the model probability distribution based at least in part on a threshold percentage, determine a window probability distribution based on window data sampled from the engine system, determine a fraction of the window probability distribution that is greater than the distance threshold value, and generate a lubricant alert signal when the fraction is greater than a temperature anomaly threshold. The model data includes model temperature data and model load data. The window data includes window temperature data and window load data that is based at least in part on feedback from the plurality of sensors during operation of the engine system.

While a stepping motor for conveying a paper is being driven, a first clocking section enables a counting control section to add a first predetermined value to a count value each time a first predetermined period of time elapses. When the count value reaches a first threshold value, a motor stop determination section stops the motor. A second clocking section enables the counting control section to subtract a second predetermined value from the count value each time a second predetermined period of time elapses when the motor is stopped. When the count value falls below a second threshold value smaller than the first threshold value, a motor drive resuming section resumes the operation of the motor. A third clocking section enables the counting control section to subtract a third predetermined value from the count value each time a third predetermined period of time elapses when the stepping motor is stopped in a state in which the count value is smaller than the first threshold value.

A first thermoelectric component (TEC) includes a top surface and a bottom surface. The first TEC is configured to concurrently increase temperature of the top surface and decrease temperature of the bottom surface or vice versa to transfer thermal energy between the top surface and the bottom surface based on a voltage potential applied to the first TEC. A thermal transfer component includes a top surface and a bottom surface. The bottom surface of the thermal transfer component is coupled to the top surface of the first TEC. The thermal transfer component is tapered such that the bottom surface is smaller than the top surface. A second TEC includes a top surface and a bottom surface. The bottom surface of the second TEC is coupled to the top surface of the thermal transfer component. The second TEC is larger than the first TEC.