A pose change apparatus includes a first output shaft rotatable around a first rotational axis, a first member rotatable around the first output shaft according to the rotation of the first output shaft, a second output shaft disposed on the first member and rotatable around a second rotational axis tilted at an angle with respect to the first rotational axis, a second member disposed on the first member, configured to hold the inspection target, and rotatable around the second rotational axis according to the rotation of the second output shaft, a first actuator configured to rotate the first output shaft forwardly and reversely within a predetermined angular range, and a second actuator configured to rotate the second output shaft forwardly and reversely within a predetermined angular range.

A visual turbidity detection device and detection method thereof includes an observing box, an observing assembly, and a light assembly. The observing box includes a box, at least one side of the box defines an observing window, and at least one side of the box is capable of being disassembled to define an opening for taking and placing a sample to be tested. The observing assembly includes a first base and a first rotation shaft. An end of the first rotation shaft is rotatably connected to a bottom wall of the box, a shaft body of the first rotation shaft is fixedly connected to the first base, another end of the first rotation shaft extends out of a top wall of the observing box, and the first base is configured to place the sample to be tested. The light assembly is disposed on an inner wall of the observing box.

A visual turbidity detection device and detection method thereof includes an observing box, an observing assembly, and a light assembly. The observing box includes a box, at least one side of the box defines an observing window, and at least one side of the box is capable of being disassembled to define an opening for taking and placing a sample to be tested. The observing assembly includes a first base and a first rotation shaft. An end of the first rotation shaft is rotatably connected to a bottom wall of the box, a shaft body of the first rotation shaft is fixedly connected to the first base, another end of the first rotation shaft extends out of a top wall of the observing box, and the first base is configured to place the sample to be tested. The light assembly is disposed on an inner wall of the observing box.

A wafer defect analyzing device includes a light source, an imaging mechanism, a height adjusting mechanism and a processor. The light source is configured to carry a wafer and to emit an infrared light. The imaging mechanism includes a camera facing toward the light source for shooting the wafer, a microscopic objective lens located between the camera and the light source, a light filtering element located between the camera and the microscopic objective lens, and a gain element located between the camera and the light filtering element. The height adjusting mechanism is connected to the imaging mechanism and includes a motor. The processor is signally connected to the imaging mechanism. The height adjusting mechanism moves the imaging mechanism along a longitudinal axis, the imaging mechanism shoots a plurality of images of the wafer, and the processor receives and analyzes the images to analyze a defect on the wafer.

A method for inspecting an aircraft propulsion system component for defects using non-destructive testing includes applying a fluorescent penetrant to one or more surfaces of a component, resonating the component with a resonance test assembly, while the fluorescent penetrant is applied to the one or more surfaces, and measuring a resonance frequency of the component with the resonance test assembly, removing excess fluorescent penetrant from the one or more surfaces subsequent to measuring the resonance frequency of the component, and illuminating the component with ultraviolet (UV) light and, while illuminating the component, identifying a presence or an absence of one or more defects at the one or more surfaces indicated by the fluorescent penetrant.

A surface inspection device (1) according to the present invention comprises: a plate-shaped sample holding member (3) which can hold a sample (2); a spindle motor (4) for rotating the sample holding member (3); a turntable (5) which is fixed to the spindle motor (4) and rotated by the spindle motor (4); a frame (6) to which the spindle motor (4) is fixed; a plurality of support members (12) each having one end fixed to the sample holding member (3) and the other end fixed to the turntable (5), the support members supporting the sample holding member (3) such that the sample holding member is displaceable in a focus direction which is the height direction with respect to the turntable (5); and a sample drive unit (11) which displaces the sample holding member (3) in the focus direction with respect to the turntable (5). This surface inspection device (1) can accurately drive the sample (2) in the focus direction.

A method of operating an electronic device that is configured to support manufacturing a semiconductor device includes (i) selecting a height of a stage of the electronic device that is configured to hold the semiconductor device, (ii) generating white light by using a light source of the electronic device, (iii) generating light of a selected wavelength by filtering the white light using a monochromater of the electronic device, (iv) emitting the light of the selected wavelength to the semiconductor device using a beam splitter of the electronic device, and (v) capturing reflection light reflected from the semiconductor device using a camera of the electronic device.

A wafer defect analyzing device includes a light source, an imaging mechanism, a height adjusting mechanism and a processor. The light source is configured to carry a wafer and to emit an infrared light. The imaging mechanism includes a camera facing toward the light source for shooting the wafer, a microscopic objective lens located between the camera and the light source, a light filtering element located between the camera and the microscopic objective lens, and a gain element located between the camera and the light filtering element. The height adjusting mechanism is connected to the imaging mechanism and includes a motor. The processor is signally connected to the imaging mechanism. The height adjusting mechanism moves the imaging mechanism along a longitudinal axis, the imaging mechanism shoots a plurality of images of the wafer, and the processor receives and analyzes the images to analyze a defect on the wafer.

According to an embodiment of the present disclosure, disclosed is an apparatus for imaging an object. The apparatus may include: a first circular plate configured to perform a first rotational motion; a second circular plate installed on the first circular plate and configured to perform a second rotational motion of a different type from the first rotational motion in a second rotation zone on a same plane as the first circular plate; and an imaging device configured to image an object supported on the second circular plate while the second circular plate performs the second rotational motion in the second rotation zone.

The present invention relates to an inspection apparatus and an inspection method which selectively adjust a numerical aperture of illuminating light in the form of collimated light when inspecting a target object, such as a wafer or the like, using a spectrum, thereby preventing a diffraction phenomenon caused by the illuminating light. The inspection apparatus may include: a camera unit disposed above a target object; an illumination unit configured to illuminate the target object with illuminating light; and a light detection unit configured to detect reflection light of the target object illuminated with the illuminating light, wherein the illumination unit comprises a numerical aperture adjustment device which has a first optical member having a first numerical aperture that is replaceable with a second optical member having a second numerical aperture different from the first numerical aperture so as to reduce a diffraction phenomenon caused by the illuminating light.