A non-invasive method of detecting electrical activity in a target volume. The method can comprise aiming a plurality of antennas at one or more target sub-volumes within a target volume and acquiring the radio signal created when an electrical discharge occurs. The method can then comprise processing the radio signals to determine the electrical activity within the target volume and displaying the electrical activity in the target volume.

According to some aspects of the present disclosure, power modules having current sensing circuits, and corresponding sensing methods, are disclosed. Example power modules include a printed circuit board (PCB) having a PCB trace, an output choke inductor, and an output pin. The power module also includes a first sense terminal coupled to the PCB trace, a second sense terminal coupled to the output pin such that a resistance between the first sense terminal and the second sense terminal is defined by a resistance of the PCB trace and a resistance of the output pin, and a control coupled to the first sense terminal and the second sense terminal. The control is adapted to measure a voltage between the sense terminals, and to determine a current through the PCB trace and the output pin based on the measured voltage and the resistance between the sense terminals.

A test data integration system and a method thereof are provided. The method includes: collecting, by each of a plurality of client devices, a plurality of test information obtained from coupled automatic test equipment when performing a test operation, and transmitting the plurality of test information to a server; receiving, by the server, the plurality of test information, and generating a graphical user interface according to the plurality of test information and displaying an integration analysis result corresponding to the plurality of test information.

An electronic circuit including: an electronic component, a conductive armature surrounding the electronic component, an electrical insulator between the electronic component and the conductive armature, a device configured to measure current passing through the armature or voltage on the armature or on the electronic component, and a defect determination device configured to determine a defect in the electrical insulator based on the measured current or voltage.

A signal channel expanding system based on PAD is provided, including a motherboard disposed on an array tester and a plurality of array test pads disposed on a periphery of the motherboard and configured to control the motherboard; each of the array test pads includes a plurality of pins, each of the pins corresponds to a signal channel, the array test pads include at least two left driving array test pads and at least two right driving array test pads. Compared with the related art, in the signal channel expanding system based on PAD in the disclosure, by using at least two left driving array test pads and at least two right driving array test pads on the periphery of the motherboard, the number of the pins on the periphery of the motherboard can be multiplied and the pin size can remain unchanged without lengthening the test jig.

The present disclosure provides a method, system and apparatus for detecting polarity of component, and a computer-readable storage medium. The component polarity detection method includes: selecting first component symbols similar to graphs in a pre-created template library of component polarity symbols from a polar graph layer of a to-be-detected printed circuit board (PCB), and sifting out second component symbols each having polarity from the selected first component symbols; and traversing each second component symbol having polarity, to detect whether a polarity symbol that has been already stored in the template library is in the second component symbol having polarity; if yes, examining whether a polarity position of the polarity symbol in the second component symbol is correct; and if the polarity position is incorrect, outputting a report indicating that the polarity position of the polarity symbol in the second component symbol is incorrect.

Embodiments described herein provide an anisotropic conductive film (ACF) positioned on a semiconductor package and techniques of using the ACF to test semiconductor devices positioned in or on the semiconductor package. In one example, a semiconductor package comprises: a die stack comprising one or more dies; a molding compound encapsulating the die stack; a substrate on the molding compound; a contact pad on a surface of the substrate and coupled to the die stack; a test pad on the surface of the substrate; a conductive path between the contact pad and the test pad, where an electrical break is positioned along the conductive path; and an ACF over the electrical break. Compressing the ACF by a test pin creates an electrical path that replaces the electrical break. Data can be acquired by test pin and provided to a test apparatus, which determines whether the dies in the die stack are operating properly.

Illustrative embodiments disclosed herein pertain to a capacitive coupler that is custom fabricated to provide shape conformability with a component under test. The shape conformability allows the capacitive coupler to provide a high level of capacitive coupling between an electrode in the capacitive coupler and a metal part contained in the component. The electrode in the capacitive coupler has one or more characteristics such as a shape and an orientation, that are defined by utilizing the metal part as a template during fabrication of the capacitive coupler. In one exemplary embodiment, the electrode in the capacitive coupler has a form factor that substantially matches a form factor of the metal part contained in the component. In another exemplary embodiment, the metal part is oriented at a non-orthogonal angle with respect to a major surface of a printed circuit board upon which the component is mounted.

The line power and neutral conductors for an arc fault sensing circuit interrupter such as in a miniature circuit breaker are arranged as a rigid conductor surrounding and holding an insulated flexible conductor when passing through the Ground Fault Interrupter current transformer. Voltage metering takes place across the rigid conductor to enable arc fault detection and ground fault detection in the miniature circuit breaker within the space of a single current transformer.

Illustrative embodiments disclosed herein pertain to a capacitive coupler that is custom fabricated to provide shape conformability with a component under test. The shape conformability allows the capacitive coupler to provide a high level of capacitive coupling between an electrode in the capacitive coupler and a metal part contained in the component. The electrode in the capacitive coupler has one or more characteristics such as a shape and an orientation, that are defined by utilizing the metal part as a template during fabrication of the capacitive coupler. In one exemplary embodiment, the electrode in the capacitive coupler has a form factor that substantially matches a form factor of the metal part contained in the component. In another exemplary embodiment, the metal part is oriented at a non-orthogonal angle with respect to a major surface of a printed circuit board upon which the component is mounted.