A mirror includes a carrier, a reflecting layer disposed above a main face of the carrier, and a transparent layer disposed above the reflective layer. The carrier includes a base body, and the base body includes one or more of a material comprising a density in a range from 0.1 to 1.0 g/cm.sup.3, a porous material, a foamed material, a material comprising a structure containing closed cells, a material comprising a honeycomb structure, or a structure containing carbon fibers.

The present invention refers to a method for making a reflecting stratiform structure (100), configured so as to reflect the incident radiation coming from an upper side with respect to the reflecting stratiform structure (100), comprising an upper transparent protective coating layer (101) configured in that the upper transparent protective coating layer (101) is applied to the reflecting stratiform structure (100) through a cross-linking process, which is carried out by cross-linking a polymerisable resin, which will form the upper transparent protective coating layer (101), making energy pass through a transparent thermoplastic film (102, 120), preferably made of polyethylene terephthalate (PET), so as to cross-link the polymerisable resin.

A radiation source apparatus includes a vessel, a laser source, a collector, and a reflective mirror. The vessel has an exit aperture. The laser source is at one end of the vessel and configured to excite a target material to form a plasma. The collector is disposed in the vessel and configured to collect a radiation emitted by the plasma and to direct the collected radiation to the exit aperture of the vessel. The reflective mirror is in the vessel and configured to reflect the laser beam toward an edge of the vessel.

Provided is a method for manufacturing a component arrangement for a package, including providing a wafer made of a semiconductor material having a polished wafer surface; forming an opening in the wafer by anisotropic etching, wherein an anisotropically etched surface is manufactured near the opening; separating a component from the anisotropically etched wafer, wherein the separated component is manufactured having the following surfaces: an optical surface formed near a surface portion of the polished wafer surface and a mounting surface formed in the region of the anisotropically etched surface; and mounting the separated component on a substrate surface of a carrier substrate using the mounting surface in such a manner that the anisotropically etched surface is bonded to the substrate surface, wherein the optical surface is arranged as an inclined exposed surface. Furthermore, a component arrangement and a package are provided having a component arrangement.

A display device to be attached to an object includes: a display unit that includes a display surface and displays video on the display surface; a decorative layer that is light-transmissive and disposed on a display surface side of the display unit, the decorative layer being decorated according to an appearance of the object; and an intermediate layer that is light-transmissive and disposed between the display unit and the decorative layer. The decorative layer has a first haze value ranging from 28.4% to 86.3%, inclusive.

Systems (100) and methods (600) for providing a product with a radiation mitigation feature. The methods comprise: obtaining a composite base layer formed of a fiber-reinforced material; and performing a deposition process to dispose a first coating layer on the composite base layer so as to form the product with a radiation barrier, the first coating layer comprising 35% by mass or less of a metal constituent, at least 65% by mass of a germanium constituent, a zero or substantially zero coating stress, and/or an overall thickness between 2 microns and 8 microns.

The present invention includes a mirror main body formed in a polygonal shape in a plan view and having a first main face that reflects an image, a second main face that is opposite to the first main face, and a peripheral edge face that connects the first main face and the second main face to each other, in which the peripheral edge face includes a plurality of first end faces and a second end face that connects the adjacent first end faces, and the second end face constitutes a first chamfered portion formed at an outer edge of the mirror main body in a plan view.

A lithography system includes an extreme ultraviolet (EUV) light source, a reticle stage, a reflection layer, and a plurality of light permeable protrusions. The EUV light source is configured for generating an EUV light beam. The reticle stage is configured for holding a reticle with a front surface of the reticle facing in a downward direction. The reflection layer is below the reticle stage. The light permeable protrusions are formed on the reflection layer. Each of the light permeable protrusions includes a bouncing surface facing in a direction that forms an acute angle with the downward direction. A first portion of the EUV light beam from the EUV light source passes through the bouncing surface of each of the light permeable protrusions to the reflection layer and is reflected to the reticle by the reflection layer.

A lens assembly includes an optical element having an outward-facing surface with a cornea-shaped contour. The lens assembly includes a housing that carries an optical element. The housing at least partially houses an image sensor. The image sensor is positioned to receive image light from the optical element. The lens assembly is an artificial eye system that may be used to mimic a human eye while operating or testing a head-mounted display.

The present invention relates to an optical device (1), suitable for transmitting/reflecting electromagnetic radiation in a wavelength range of the electromagnetic spectrum, said device (1) comprising at least: a substrate (10) made of a first material, a coating layer (20) made of a second material that is different from the first material, and surface texturing (30) forming cavities (31) in the device (1), characterized in that the cavities (31) extend through the coating layer (20) and are partially sunk into the substrate (10).