A mirror assembly can include a housing, a mirror, and a light source. In certain embodiments, the mirror includes a light pipe configured to emit a substantially constant amount of light along a periphery of the mirror. In some embodiments, the mirror assembly includes a sensor assembly. The sensor assembly can be configured to adjust the amount of emitted light based on the position of a user in relation to the mirror. Certain embodiments of the mirror include an algorithm to adjust light based on the position of a user relative to the mirror, the level of ambient light, and/or the activation of different light modes.

A mirror assembly can include a housing, a mirror, and a light source. In certain embodiments, the mirror includes a light pipe configured to emit a substantially constant amount of light along a periphery of the mirror. In some embodiments, the mirror assembly includes a sensor assembly. The sensor assembly can be configured to adjust the amount of emitted light based on the position of a user in relation to the mirror. Certain embodiments of the mirror include an algorithm to adjust light based on the position of a user relative to the mirror, the level of ambient light, and/or the activation of different light modes.

A light pipe assembly includes a light pipe having one or more first crush ribs extending outwardly from an outer surface of the light pipe. The light pipe assembly further includes a light pipe housing having one or more second crush ribs extending into a cavity of the light pipe housing. When the light pipe is positioned in the cavity of the light pipe housing, the light pipe is retained in the light pipe housing by the one or more first crush ribs and the one or more second crush ribs. The one or more first crush ribs come in contact with and press against the one or more second crush ribs when the light pipe is positioned in the cavity of the light pipe housing.

A camera assembly includes a circuit board on which an imager is mounted, and a lens assembly mounted over the imager to the circuit board. The camera assembly further includes a first infrared light source mounted on the circuit board at a first location, and a second infrared light source mounted on the circuit board at a second location. A first light pipe is mounted to the circuit board at the first location, while a second light pipe is mounted to the circuit board at the second location. The circuit board, lens assembly, first and second infrared light sources, and first and second light pipes are disposed in a housing, which includes a front housing and a rear housing. The first and second light pipes extend from the circuit board to the front housing such that light is conveyed from the first and second infrared light sources, respectively, to an illumination exit plane of the camera assembly.

Optical components and methods of manufacture thereof. A first optical component has a hollow-core photonic crystal fiber includes internal capillaries for guiding radiation and an outer capillary sheathing the internal capillaries; and at least an output end section having a larger inner cross-sectional dimension over at least a portion of the output end section than an inner cross-sectional dimension of the outer capillary along a central portion of the hollow-core photonic crystal fiber prior to the output end section. A second optical component includes a hollow-core photonic crystal fiber and a sleeve arrangement.

A multi-level semiconductor device, the device including: a first level including integrated circuits; a second level including an optical waveguide, where the second level is disposed above the first level, where the first level includes crystalline silicon; and an oxide layer disposed between the first level and the second level, where the second level is bonded to the oxide layer, and where the bonded includes oxide to oxide bonds.

Disclosed are image relay elements exhibiting transverse Anderson localization for light field and holographic energy sources. The relay elements may include a relay element body having one or more structures, where the structures can be coupled in series, in parallel and/or in stacked configurations. The structures may have multiple surfaces such that energy waves propagating therethrough the relay elements may experience spatial magnification or de-magnification.

The application provides an improved gemstone testing apparatus for testing a gemstone specimen. The gemstone testing apparatus includes a handheld casing, a processor unit, a first gemstone test device, a second gemstone test device, and a display unit. The first gemstone test device includes a first test probe and a thermal conductivity test module. The second gemstone test device includes a second test probe and a light absorption module.

The application provides an improved gemstone testing apparatus for testing a gemstone specimen. The gemstone testing apparatus includes a handheld casing, a processor unit, a first gemstone test device, a second gemstone test device, and a display unit. The first gemstone test device includes a first test probe and a thermal conductivity test module. The second gemstone test device includes a second test probe and a light absorption module.

An apparatus for sensing pressure and temperature includes: a hollow glass tube; a first optical fiber having an end disposed into a first end of the tube; a second optical fiber being disposed in a second end of the tube, the second optical fiber having a first solid core section followed by a hollow core section followed by a second solid core section, a first gap formed between the first and second optical fibers, a length of the first solid core section forming a second gap, and a length of the hollow core section forming a third gap; an optical interrogator that transmits light at various wavelengths and measures an intensity of reflected light due to the first gap, second gap, and third gap as a function of frequency to provide interrogation data; and a processor that matches the interrogation data to reference data to estimate the pressure and/or temperature.